• Proceedings of the KSME Conference
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• 2003.11a
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• pp.127-132
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• 2003

A study of high-pressure n-heptane droplet vaporization is conducted with emphasis placed on equilibrium at vapor-liquid interface. General frame of previous rigorous model[1] is retained but tailored for flash equilibrium calculation of vapor-liquid interfacial thermodynamics. The model is based on complete time-dependent conservation equations with a full account of variable properties and vapor-liquid interfacial thermodynamics. The influences of high-pressure phenomena, including ambient gas solubility, thermodynamic non-ideality, and property variation on the droplet evaporation are investigated. The governing equations and associated moving interfacial boundary conditions are solved numerically using a implicit scheme with the preconditioning method and the dual time integration technique. And a parametric study of entire droplet vaporization history as a function of ambient pressure, temperature has been conducted. Some computational results are compared with Sato's experimental data for the validation of calculations. For low ambient temperatures, the droplet lifetime first increases with pressures, then decreases for high pressures. For higher ambient temperatures, the droplet lifetime increase with less amplitude than that of low ambient temperatures, which then decreases with more amplitude than that of low temperatures. The solubility of nitrogen can not be neglected in the high pressure and it becomes higher as the pressure goes up.

• YAKHAK HOEJI
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• v.41 no.1
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• pp.30-37
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• 1997

In order to formulate a controlled release system for oral drug delivery, the microcapsules were prepared in w/o emulsion containing cefaclor as a water-soluble model drug by th e method of interfacial polycondensation. Gelatin wis selected as a suitable polymer for interfacial polycondensation. Gelatin solution containing drug was emulsified in an organic phase under mechanical stirring. After emulsification, terephthaloyl chloride was added as cross linking agent, followed by mechanical stirring, washing and drying. Physical characteristics of microcapsules were investigated by optical microscopy, scanning electron microscopy and particle size analysis. Mean particle sizes of gelatin microcapsules were, in the range, of about 20~50 ${\mu}$m. The microcapsules were in good apperance with spherical shapes before washing, but were destroyed partially after washing and drying, even though some microcapsules were still maintained in their shapes. Contents of cefaclor in the microcapsules were calculated by UV spectrophotometry after 3 days extraction with pH 4 carbonate buffer solution. The effects of cross linking time. pH. concentration of cross-linking agent, and temperature on drug release kinetics have been discussed extensively.

• Journal of Korea Foundry Society
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• v.20 no.2
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• pp.116-121
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• 2000

Interfacial reaction and mechanical properties between Sn-Zn-X ternary alloys(X : 3wt.%In, 4wt.%Bi) and Cu-substrate were studied. Cu/solder joints were subjected to aging treatments for up to 50days to see interfacial reaction at $100^{\circ}C$ and then were examined changes of microstructure and interfacial compound by optical microscopy, SEM and EDS. Cu/solder joints were aged to 30days and then loaded to failure at cross head speed of 0.3 mm $min^{-1}$ to measure tensile strength. According to the results of the solderability test, additions of In and Bi in the Sn-9wt.%Zn solder improve the wetting characteristics of the alloy and lower the melting temperature. Through the EDS and XRD analysis of Cu/Sn-9wt.%Zn solder joint, it was concluded that the intermetallic compound was the ${\gamma}-Cu_5Zn_8$ phase. Cu-Zn intermetallics at Cu/solder interfaces played an important role in both the microstructure evolution and failure of solder joints. Cu/solder joint strength was decreased by aging treatment, and those phenomenon was closely related to the thickening of intermetallic layer at Cu/solder joints.

• Korean Chemical Engineering Research
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• v.43 no.5
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• pp.632-636
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• 2005

In this work, the effect of chemical treatments on surface properties of SiC was investigated in thermal and mechanical interfacial behaviors of SiC/PMMA nanocomposites. The acid/base value, contact angles, and FT-IR analysis were performed for the study of surface characteristics of the SiC studied. The thermal stabilities of the SiC/PMMA nanocomposites were investigated by thermogravimetric analysis (TGA). Also the mechanical interfacial properties of the composites were studied in critical stress intensity factor ($K_{IC}$) and critical strain energy release rate ($G_{IC}$) measurements. As a result, the acidically treated SiC (A-SiC) had higher acid value than that of untreated SiC (V-SiC) or basically treated SiC (B-SiC). The acidic solution treatment led to an increase in surface free energy of the SiC, mainly due to the increase of its specific component. Thermal and mechanical interfacial properties of the SiC/PMMA nanocomposites, including initial decomposition temperature (IDT), $K_{IC}$, and $G_{IC}$ had been improved in the acidic treatment on SiC. This was due to the improvement in the interfacial bonding strength, resulting from the acid-base interfacial interactions between the fillers and polymeric matrix.

• Composites Research
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• v.17 no.1
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• pp.10-17
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• 2004

In this work, the blend system prepared from epoky(DGEBA)/polymethylmethacrylate(PMMA) was investigated in thermal and mechanical interfacial property measurements. The thermal properties were carried out by DSC, DMA, and TGA measurements. Also, the surface free energy and fracture toughness were determined by contact angle and critical stress intensity factor($K_{IC}$), respectively. And the fracture surface was observed by SEM after $K_{IC}$ tests. As experimental results, the curing temperature and glass transition temperature were slightly increased in addition of PMMA. Surface free energy of the blends showed an improved value at low contents of PMMA which could be attributed to the both increasings of London dispersive and polar components. From measurement of $K_{IC}$ of the blends, the highest value was found at 5 phr. This was due to the increasing of compatibility or physical interaction in macromolecular chains between DGEBA and PMMA of the blends.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.38 no.10
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• pp.831-835
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• 2014

The relative concentration of surface and interfacial defects in hydrothermally grown ZnO nanostructures was investigated by a comparison of two samples having different growth temperatures via bias voltage sweep rate under laser illumination of 405 and 355 nm. The current of small ZnO nanostructures (growth temperature of $75^{\circ}C$) decreased when induced more slowly bias voltage sweep rate under the laser illumination. In contrast, the current of large ZnO nanostructures (growth temperature of $90^{\circ}C$) increased. This difference in currents indicates the relation of relative defects concentration between surface and interfacial defects of ZnO nanostructure. Our experimental approach has potential applicability in the analysis of influence on defects in ZnO devices.

• 한국전산유체공학회:학술대회논문집
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• 2000.05a
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• pp.113-119
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• 2000

Two-dimensional steady flow of two immiscible, compressible fluids are considered when the temperature of each layer is constant. Both upper and lower fluids are bounded by two horizontal rigid boundaries with symmetric obstruction of compact support at the tourer boundary. By using asymptotic method, we derive the forced K-dV equation governing interfacial wave. Various solutions and numerical results are presented.

• Proceedings of the Materials Research Society of Korea Conference
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• 1993.11a
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• pp.86-86
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• 1993

• Proceedings of the Materials Research Society of Korea Conference
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• 2002.11a
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• pp.196-196
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• 2002

• Journal of the Microelectronics and Packaging Society
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• v.29 no.3
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• pp.55-61
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• 2022

In this study, properties of Pb-free solder joints which were combined using Sn-3.0Ag-0.5Cu (SAC305) Pb-free solder with a mid-temperature type of melting temperature and Sn-57Bi-1Ag Pb-free solder with a low-temperature type of melting temperature were reported. Combined Pb-free solder joints were formed by reflow soldering processes with ball grid array (BGA) packages which have SAC305 solder balls and flame retardant-4 (FR-4) printed circuit boards (PCBs) which printed Sn-57Bi-1Ag solder paste. The reflow soldering processes were performed with two types of temperature profiles and interfacial properties of combined Pb-free solder joints such as interfacial reactions, formations of intermetallic compounds (IMCs), diffusion mechanisms of Bi, and so on were analyzed with the reflow process conditions. In order to compare reliability characteristics of combined Pb-free solder joints, we also conducted thermal shock test and analyzed changes of mechanical properties for joints from a shear test during the thermal shock test.