• 제목/요약/키워드: In-situ SiN

검색결과 105건 처리시간 0.026초

PVD 방법에 의한 $TiN/TiSi_2$-bilayer 형성 (Formation of $TiN/TiSi_2$-bilayer by PVD method)

  • 최치규;강민성;김덕수;이광만;황찬용;서경수;이정용;김건호
    • 한국재료학회지
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    • 제8권12호
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    • pp.1182-1189
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    • 1998
  • Si 기판을 실온과 $600^{\circ}C$로 유지하면서 동시 증착 방법으로 (Ti+2Si)를 증착한 후 $N_2$ 분위기에서 Ti를 증발시켜 TiN($300\AA$)/(Ti+2Si, $300\AA$)/Si(100) 구조의 시료를 제작한 다음 초고진공에서 in-situ로 열처리하여 양질의 $TiN/TiSi_2$-bilayer를 형성하였다 열처리 온도가 $700^{\circ}C$ 이상에서 (111) texture 구조를 가지면서 화학 양론적으로 $Ti_{0.5}N_{0.5}$인 박막과 C54-$TiSi_2$박막이 형성되었다. $TiN/C54-TiSi_2/Si$ (100)구조의 계면은 응집 현상이 없이 평활하였으며, $C54-TiSi_2$상은 에피택셜 성장되었다. $TiN/TiSi_2$-이중구조막의 면저항은 열처리 온도에 따라 감소하였으며, $700^{\circ}C$ 이상의 열처리 온도에서는 면저항 값이 $2.5\omega/\textrm{cm}^2$ 였다.

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저온 Si계 에피 성장기술에서 실험계획법에 의한 in-situ H$_2$ bake 및 GeH$_4$ clean 공정 최적화 (The process optimization of in-situ H$_2$ bake and GeH$_4$ clean in low temperature Si epitaxy using design of experiment)

  • 이경수
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 1994년도 추계학술대회 논문집
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    • pp.54-58
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    • 1994
  • H$_2$ bake and GeH$_4$ clean are used as a in-situ pre-clean method in low temperature Si based epitaxial growth technology using rapid thermal processing chemical vapor deposition (RTPCVD). In this paper, the H$_2$ bake and GeH$_4$ clean processes are optimized for low surface defect density using Taguchi method. In H$_2$ bake process, the epitaxial growth temperature affects dominantly on the surface defect density, and the next affecting factors are H$_2$ bake temperature and rinse time in de-ionised water. In GeH$_4$ clean process, GeH$_4$ clean temperature affects most strongly on the surface defect density, and the minor factor is GeH$_4$flow rate. The optimum process conditions predicted fly Taguchi method agree well with tile experimental data in both in-situ clean processes.

전기저항측정에 의한 SiC섬유강화 $Si_3N_4$기 복합재료의 파괴예측 (Facture Prediction in SiC Fiber Reinforced $Si_3N_4$ Matrix Composites from Electrical Resistivity Measurements)

  • 신순기
    • 한국재료학회지
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    • 제10권5호
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    • pp.364-368
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    • 2000
  • 섬유강화 세라믹스 복합재료의 파괴예측 가능성을 알아보기 위해서 탄소섬유와 WC분말입자를 전기 전도상으로 이용하여 재료 스스로가 파괴예측 기능을 가지도록 한 SiC섬유강화 $Si_3N_4$세라믹스기 복합재료를 1773K에서 1시간 동안 hot-press하여 제작하였다. 4점 굽힘 시험하는 동안 전기저항 변화를 측정하여 파괴예측 기능을 평가하였다. 그 결과 전기정항은 재료의 파괴거동과 밀접한 관계를 가지면서 변화함을 알았다. 특히 분말형태의 전기전도상의 첨가는 본 복합재료의 파괴과정을 낮은 응력단계로부터 예측하는데 유용하였다. 결과적으로 이러한 재료설RP의 신개 (파괴예측기능)의도입은 $Si_3N_4$기 세라믹스를 구조재료로 이용함에 있어서 큰 문제가 되고 있는 신뢰성 확보에 새로운 기능을 준다고 생각되었다. 생각되었다.

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In-situ Synchrotron Radiation Photoemission Spectroscopy Study of Atomic Layer Deposition of $Ta_2O_5$ film on Si Substrate with Ta(NtBu)(dmamp)$_2Me$ and $H_2O$

  • Lee, Seung Youb;Jung, Woosung;Kim, Yooseok;Kim, Seok Hwan;An, Ki-Seok;Park, Chong-Yun
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2013년도 제44회 동계 정기학술대회 초록집
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    • pp.619-619
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    • 2013
  • The interfacial state between $Ta_2O_5$ and a Si substrate during the growth of $Ta_2O_5$ films by atomic layer deposition (ALD) was investigated using in-situ synchrotron radiation photoemission spectroscopy (SRPES). A newly synthesized liquid precursor Ta($N^tBu$) $(dmamp)_2Me$ was used as the metal precursor, with Ar as a purging gas and $H_2O$ as the oxidant source. After each half reaction cycle, samples were analyzed using in-situ SRPES under ultrahigh vacuum at room temperature. SRPES analysis revealed that Ta suboxide and Si dioxide were formed at the initial stages of $Ta_2O_5$ growth. However, the Ta suboxide states almostdisappeared as the ALD cycles progressed. Consequently, the $Ta^{5+}$ state, which corresponds with the stoichiometric $Ta_2O_5$, only appeared after 4.0 cycles. Additionally, tantalum silicate was not detected at the interfacial states between $Ta_2O_5$ and Si. The measured valence band offset between $Ta_2O_5$ and the Si substrate was 3.22 eV after 3.0 cycles.

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High-Efficiency a-Si:H Solar Cell Using In-Situ Plasma Treatment

  • Han, Seung Hee;Moon, Sun-Woo;Kim, Kyunghun;Kim, Sung Min;Jang, Jinhyeok;Lee, Seungmin;Kim, Jungsu
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2013년도 제44회 동계 정기학술대회 초록집
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    • pp.230-230
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    • 2013
  • In amorphous or microcrystalline thin-film silicon solar cells, p-i-n structure is used instead of p/n junction structure as in wafer-based Si solar cells. Hence, these p-i-n structured solar cells inevitably consist of many interfaces and the cell efficiency critically depends on the effective control of these interfaces. In this study, in-situ plasma treatment process of the interfaces was developed to improve the efficiency of a-Si:H solar cell. The p-i-n cell was deposited using a single-chamber VHF-PECVD system, which was driven by a pulsed-RF generator at 80 MHz. In order to solve the cross-contamination problem of p-i layer, high RF power was applied without supplying SiH4 gas after p-layer deposition, which effectively cleaned B contamination inside chamber wall from p-layer deposition. In addition to the p-i interface control, various interface control techniques such as thin layer of TiO2 deposition to prevent H2 plasma reduction of FTO layer, multiple applications of thin i-layer deposition and H2 plasma treatment, H2 plasma treatment of i-layer prior to n-layer deposition, etc. were developed. In order to reduce the reflection at the air-glass interface, anti-reflective SiO2 coating was also adopted. The initial solar cell efficiency over 11% could be achieved for test cell area of 0.2 $cm^2$.

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RAMBE를 사용하여 Si 기판 위에 성장된 AIN 박막의 결정성 분석 (Microstructural ananalysis of AlN thin films on Si substrate grown by plasma assisted molecular beam epitaxy)

  • 홍성의;한기평;백문철;조경익;윤순길
    • 한국진공학회지
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    • 제10권1호
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    • pp.22-26
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    • 2001
  • Plasma assisted molecular beam epitaxy(PAMBE)를 사용하여 Si 기판위에 성장시킨 AlN 박막에 대하여 성장온도 및 기판의 방향성에 따른 박막의 결정성 변화를 분석하였다. Reflection high energy electron diffraction(RHEED) 패턴을 이용하여 성장 중의 결정성을 관찰하였고, 성장 후에는 X-ray diffraction(XRD), double crystal X-ray diffraction(DCXD), transmission electron microscopy/diffraction(TEM/TED)분석을 하였다. $850^{\circ}C$이상의 온도에서 Si(100)위에 성장된 AlN박막은 육방정계의 c축 방향으로 우선 배향되어 있음을 확인하였으며 Si(111)위에 성장된 AlN박막의 경우 AlN(0001)/Si(111), AlN(1100)/Si(110), AlN(1120)/Si(112)의 결정방위를 가지고 성장하였음을 확인하였다. 또한 Si(111) 기판 위에서는 전위와 적층결함 등 많은 결정결함에 의해 DCD패턴의 반치폭이 2$\theta$=$36.2^{\circ}$에서 약 3000arcsec에 이르는 등 결정성은 좋지 않았으나 AlN박막이 단결정으로 성장된 것으로 나타났다.

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도핑량에 따른 다결정 3C-SiC 마이크로 공진기의 특성 (Characteristics of polycrystalline 3C-SiC micro resonators with doping concentrations)

  • 마이 피 훙;정귀상
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2009년도 추계학술대회 논문집
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    • pp.131-131
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    • 2009
  • This paper describes the fabrication and characteristics of polycrystalline (poly) 3C-SiC microresonators with $3{\times}10^{17}{\sim}1{\times}10^{19}cm^{-3}$ in-situ N-doping concentrations. In this work, the crystallinity, carrier concentration and surface morphology of the grown thin films were evaluated by X-ray diffraction (XRD), scanning electron microscopy (SEM) and atomic force microscopy (AFM). The 1.2 ${\mu}m$ thick cantilvers and the 0.4 ${\mu}m$ thick doubly-clamped beam microresonators with various lengths were implemented using in-situ doping poly 3C-SiC thin films. The characteristics of the poly 3C-SiC microresonators were evaluated using quartz and a laser vibrometer under vacuum at room temperature. The resonant frequencies of the SiC microresonators decreased with doping concentrations owing to the reduction of the Young's modulus of the poly 3C-SiC thin films. It was confirmed that the resonant frequencies of the poly 3C-SiC microresonators are controllable by adjusting the doping concentrations.

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Nano-Scale Observation of Nanomaterials by In-Situ TEM and Ultrathin SiN Membrane Platform

  • 안치원
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2013년도 제44회 동계 정기학술대회 초록집
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    • pp.657-657
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    • 2013
  • In-situ observations of nano-scale behavior of nanomaterials are very important to understand onthe nano-scale phenomena associated with phase change, atomic movement, electrical or optical properties, and even reactions which take place in gas or liquid phases. We have developed on the in-situ experimental technologies of nano-materials (nano-cluster, nanowire, carbon nanotube, and graphene, et al.) and their interactions (percolation of metal nanoclusters, inter-diffusion, metal contacts and phase changes in nanowire devices, formation of solid nano-pores, melting behavior of isolated nano-metal in a nano-cup, et al.) by nano-discovery membrane platform [1-4]. Between two microelectrodes on a silicon nitride membrane platform, electrical percolations of metal nano-clusters are observed with nano-structures of deposited clusters. Their in-situ monitoring can make percolation devices of different conductance, nanoclusters based memory devices, and surface plasmonic enhancement devices, et al. As basic evidence on the phase change memory, phase change behaviors of nanowire devices are observed at a nano-scale.

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Surface Treatment of Ge Grown Epitaxially on Si by Ex-Situ Annealing for Optical Computing by Ge Technology

  • Chen, Xiaochi;Huo, Yijie;Cho, Seongjae;Park, Byung-Gook;Harris, James S. Jr.
    • IEIE Transactions on Smart Processing and Computing
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    • 제3권5호
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    • pp.331-337
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    • 2014
  • Ge is becoming an increasingly popular semiconductor material with high Si compatibility for on-chip optical interconnect technology. For a better manifestation of the meritorious material properties of Ge, its surface treatment should be performed satisfactorily before the electronic and photonic components are fabricated. Ex-situ rapid thermal annealing (RTA) processes with different gases were carried out to examine the effects of the annealing gases on the thin-film quality of Ge grown epitaxially on Si substrates. The Ge-on-Si samples were prepared in different structures using the same equipment, reduced-pressure chemical vapor deposition (RPCVD), and the samples annealed in $N_2$, forming gas (FG), and $O_2$ were compared with the unannealed (deposited and only cleaned) samples to confirm the improvements in Ge quality. To evaluate the thin-film quality, room-temperature photoluminescence (PL) measurements were performed. Among the compared samples, the $O_2$-annealed samples showed the strongest PL signals, regardless of the sample structures, which shows that ex-situ RTA in the $O_2$ environment would be an effective technique for the surface treatment of Ge in fabricating Ge devices for optical computing systems.

Effects of oxidized CrN buffer layer on the growth of epitaxial ZnO film on Si(111) by Plasma Assisted Molecular Beam Epitaxy

  • Kim, Jung-Hyun;Han, Seok-Kyu;Hong, Soon-Ku;Lee, Jae-Wook;Lee, Jeong-Yong;Song, Jung-Hoon;Yao, Takafumi
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2009년도 추계학술대회 논문집
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    • pp.115-115
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    • 2009
  • Epitaxial ZnO film was grown on Si(111) substrate with oxidazed CrN buffer by plasma-assisted molecular beam epitaxy (PAMBE). The growth and structural properties are investigated. The single crystalline growth was revealed by in-situ RHEED analysis. Crystalline quality of ZnO film grown on oxidized CrN buffer was investigated by the X-ray rocking curves. The FWHMs of (0002) XRCs was $1.379^{\circ}$. This value was smaller than the ZnO film grown directly on (111) Si substrate.

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