• Journal of Sensor Science and Technology
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• v.14 no.6
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• pp.387-394
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• 2005

In order to design SOI CMOS image sensors, SOI MOSFET model parameters were extracted using the equation of bulk MOSFET model parameters and were optimized using SPICE level 2. Simulated I-V characteristics of the SOI NMOSFET using the extracted model parameters were compared to the experimental I-V characteristics of the fabricated SOI NMOSFET. The simulation results agreed well with experimental results. A unit pixel for SOI CMOS image sensors was designed and was simulated for the PPS, APS, and logarithmic circuit using the extracted model parameters. In these CMOS image sensors, a nano-wire MOSFET photodetector was used. The output voltage levels of the PPS and APS are well-defined as the photocurrent varied. It is confirmed that SOI CMOS image sensors are faster than bulk CMOS image sensors.

• Proceedings of the IEEK Conference
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• 2000.11d
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• pp.255-258
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• 2000

This thesis shows controlling the mobile robot with distance information gotten with ultrasonic sensors, and analysis of captured image. The ultrasonic sensors supplies more accurate distance data in limited area but shows unstable data unlimited area while image data generally shows stable data, but this requires so much time because of amounts of calculation. So this thesis considers the merits of ultrasonic sensors and image to implement robot system .

• JSTS:Journal of Semiconductor Technology and Science
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• v.15 no.5
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• pp.533-538
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• 2015

Thermal characterization of individual pixels in microbolometer infrared image sensors is needed for optimal design and improved performance. In this work, we used thermoreflectance microscopy on uncooled microbolometer image sensors to investigate the thermal characteristics of individual pixels. Two types of microbolometer image sensors with a shared-anchor structure were fabricated and thermally characterized at various biases and vacuum levels by measuring the temperature distribution on the surface of the microbolometers. The results show that thermoreflectance microscopy can be a useful thermal characterization tool for microbolometer image sensors.

• Journal of IKEEE
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• v.18 no.1
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• pp.77-95
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• 2014

In general, image acquisition characteristics tests of image sensors and modules vary widely according to the characteristics of image sensors and modules under test, the application purpose of target devices where image sensors and modules are mounted, and the functions of test equipments. However, some de facto standard tests are frequently used in industry fields. They differ only in several parameters e.g. thresholds for fault detection, and they can be applied to most image sensors and modules. In this paper, 11 typical tests are explained in detail, and they are described in a simple and clear form under single framework, which significantly reduces errors and saves efforts.

• Journal of the Microelectronics and Packaging Society
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• v.27 no.2
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• pp.1-10
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• 2020

The technology and market size of image sensors continue to develop thanks to the release of image sensors that exceed 100 million pixels in 2019 and expansion of black box camera markets for vehicles in addition to existing mobile applications. We review the technology flow of image sensors that have been constantly evolving for 40 years since Hitachi launched a 200,000-pixel image sensor in 1979. Although CCD has made inroads into image sensor market for a while based on good picture quality, CMOS image sensor (CIS) with active pixels has made inroads into the market as semiconductor technology continues to develop, since the electrons generated by the incident light are converted to the electric signals in the pixel, and the power consumption is low. CIS image sensors with superior characteristics such as high resolution, high sensitivity, low power consumption, low noise and vivid color continue to be released as the new technologies are incorporated. At present, new types of structures such as Backside Illumination and Isolation Cell have been adopted, with better sensitivity and high S/N ratio. In the future, new photoconductive materials are expected to be adopted as a light absorption part in place of the pn junction.

• Journal of information and communication convergence engineering
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• v.13 no.4
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• pp.270-274
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• 2015

In this paper, we propose an improved framework to analyze an N-ocular imaging system under fixed constrained resources such as the number of image sensors, the pixel size of image sensors, the distance between adjacent image sensors, the focal length of image sensors, and field of view of image sensors. This proposed framework takes into consideration, for the first time, the defocusing effect of the imaging lenses according to the object distance. Based on the proposed framework, the N-ocular imaging system such as integral imaging is analyzed in terms of depth resolution using two-point-source resolution analysis. By taking into consideration the defocusing effect of the imaging lenses using ray projection model, it is shown that an improved depth resolution can be obtained near the central depth plane as the number of cameras increases. To validate the proposed framework, Monte Carlo simulations are carried out and the results are analyzed.

• Journal of Sensor Science and Technology
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• v.29 no.2
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• pp.123-127
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• 2020

In this paper, the estimation of the disparity for depth extraction in monochrome complementary metal-oxide-semiconductor (CMOS) image sensors with offset pixel apertures is presented. To obtain the depth information, the disparity information between two different channel data of the offset pixel apertures is required. The disparity is caused by the difference in the response angle between the left- and right-offset pixel aperture images. A depth map is implemented by the generated disparity. Therefore, the disparity is the most important factor for realizing 3D images from the designed CMOS image sensor with offset pixel apertures. The disparity is influenced by the pixel height and offset value of the offset pixel aperture. To confirm this correlation, the offset value is set to maximum within the pixel area, and the disparity values corresponding to the difference in the heights are calculated and compared. The disparity is derived using the camera-lens formula. Two monochrome CMOS image sensors with offset pixel apertures are used in the disparity estimation.

• Ceramist
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• v.21 no.2
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• pp.59-74
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• 2018

Imaging in the Short Wave Infrared (SWIR) provides several advantages over the visible and near-infrared regions: enhanced image resolution in in foggy or dusty environments, deep tissue penetration, surveillance capabilities with eye-safe lasers, assessment of food quality and safety. Commercially available SWIR imagers are fabricated by integrating expensive epitaxial grown III-V compound semiconductor sensors with Si-based readout integrated circuits(ROIC) by indium bump bonding Infrared image sensors made of solution-processed quantum dots have recently emerged as candidates for next-generation SWIR imagers. They combine ease of processing, tunable optoelectronic properties, facile integration with Si-based ROIC and good performance. Here, we review recent research and development trends of various application fields of SWIR image sensors and nano-materials capable of absorption and emission of SWIR band. With SWIR sensible nano-materials, new type of SWIR image sensor can replace current high price SWIR imagers.

• Proceedings of the KSRS Conference
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• 1998.09a
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• pp.361-369
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• 1998

Recently, the improvement of on-board satellite sensors covering hyperspectral image sensors, high spatial resolution sensors provide data on earth in diverse aspect. The application field relating remotely sensed data also varies depending on what type of job one wants. The various resolution of sensors from low to extremely high is also available on the market with a user defined specific location. The expense to purchase remote sensed data is going down compare to the cost it need past few years ago in terms of research or private use. Now, the satellite remote sensed data is used on the field of forecasting, forestry, agriculture, urban reconstruction, geology, or other research field in order to extract meaningful information by applying special techniques of image processing. There are many image processing packages available worldwide and one common aspect is that they are expensive. There need to be a advanced satellite data processing package for people who can not afford commercial packages to apply special remote sensing techniques on their data and produce valued-added product. The study was carried out with the purpose of developing a special satellite data processing package which covers almost every satellite produced data with normal image processing functions and also special functions needed on specific research field with friendly graphical user interface (GUI). And for the people with any background of remote sensing with windows platform.

• Journal of Korea Multimedia Society
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• v.18 no.8
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• pp.960-967
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• 2015

In this paper, we propose a user interface technique based on embedded sensors applying to apps in smart phone. Especially, we implement avata generation application using image filtering technique for photo image in smart phone. In the application, The embedded sensors are used as intuitive user interface to adjust the image filtering effect for making user satisfied effect in real time after the system produced the image filtering effect for avatar. This technique provides not a simple typed method of parameter values adjustment but a new intuitively emotional adjustment method in image filtering applications. The proposed technique can use sound values from embedded mike sensor for adjusting key values of sketch filter effect if the smart phone user produces sound. Similiarly the proposed technique can use coordinate values from embedded acceleration sensor for adjusting masking values of oil painting filter effect and use brightness values from embedded light sensor for adjusting masking values of sharp filter effect. Finally, we implement image filtering application and evaluate efficiency and effectiveness for the proposed technique.