• Proceedings of the KIEE Conference
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• 1997.07f
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• pp.2249-2251
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• 1997

Total 144 quadrupole magnets are installed in PLS. The magnets are connected in series with groups of two or 24. Each group is powered by a high-precision constant-current DC power supply. For the purpose of the beam based alignment of beam position monitors in the PLS, it is necessary to adjust the current of each quadrupole independently. To achieve this, a high current shunt regulator is designed. It can shunt a maximum 50 A of the quadrupole magnet current. The shunt regulator is programmable and the current amplitude can be varied linearly with a 12-bit resolution. Power transistors are used in the current shunt regulator. The operation of transistors is in linear region. The RS232C protocol is used for remote control and status report of the shunt regulator to the main control centre of the PLS. Preliminary result indicates that the calibration accuracy of the beam position monitor can be achievable in less than $10{\mu}m$.

• Journal of Advanced Navigation Technology
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• v.26 no.4
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• pp.235-243
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• 2022

In this paper, in the case of an inertial navigation system, the posture estimation error in the initial alignment due to vertical deflection is analyzed. Posture estimation error due to DOV was theoretically analyzed based on the speed and posture error of INS. Simulations were performed to verify the theoretical grinding, and the results were in good agreement. For example, in the case of η=20", an alignment error of ϕ_N=0.00287°, ϕ_U=0.00196° occurred, and in the case of 𝜉=20", an error of ϕ_E= -0.00286° occurred. Through this, it was confirmed that the vertical posture error caused by the DOV occurred as a coupling characteristic of the INS posture error. It has been shown that an additional posture error may occur due to the DOV, which was not considered in the existing INS alignment, which means that correction for the DOV must be considered when applying high-precision INS.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2002.10a
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• pp.536-539
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• 2002

In this paper, we developed the automatic optical fiber aligner by image processing and automatic loading system. Optical fiber is indispensable for optical communication systems that transmit large volumes of data at high speed, but super-precision technology in sub-micron units is required for optical axis adjustment, we have developed 6-axis micro stage system for I/O optical fiber arrays, the initial automatic aligning system/software for a input optical array by the image processing technique, fast I/O-synchronous aligning strategy, the automatic loading/unloading system and the automatic UV bonding mechanism. In order to adjust the alignment it used on PC based motion controller, a $10\mu\textrm{mm}$ repeat-detailed drawing of automatic loading system is developed by a primary line up for high detailed drawing. Also, at this researches used the image processing system and algorithm instead of the existing a primary hand-line up. and fiber input array and waveguide chip formed in line by automatic. Therefore, the developed and manufactured optical aligning system in this research fulfills the great role of support industry for major electronics manufacturers, telecommunications companies, universities, government agencies and other research institutions.

• Journal of the Semiconductor & Display Technology
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• v.22 no.4
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• pp.108-112
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• 2023

Precision manufacturing technology is rapidly developing due to the extreme miniaturization of semiconductor processes to comply with Moore's Law. Accurate and precise alignment, which is one of the key elements of the semiconductor pre-process and post-process, is very important in the semiconductor process. The center detection of wafer align marks plays a key role in improving yield by reducing defects and research on accurate detection methods for this is necessary. Methods for accurate alignment using traditional image sensors can cause problems due to changes in image brightness and noise. To solve this problem, engineers must go directly into the line and perform maintenance work. This paper emphasizes that the development of AI technology can provide innovative solutions in the semiconductor process as high-resolution image and image processing technology also develops. This study proposes a new wafer center detection method through variable thresholding. And this study introduces a method for detecting the center that is less sensitive to the brightness of LEDs by utilizing a high-performance object detection model such as YOLOv8 without relying on existing algorithms. Through this, we aim to enable precise wafer focus detection using artificial intelligence.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.30 no.10 s.253
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• pp.957-965
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• 2006

A high-performance hot chuck is designed as a heating device for an ultra-precision flip-chip bonder with infrared alignment system. Analysis of design requirements for thermal performance leads to a radiative heating mechanism employing two halogen lamps as heating source. The heating tool is made of silicon carbide characterized by high thermal diffusivity and small thermal expansion coefficient. Experimental tests are performed to assess heat-up performance and temperature uniformity of the heating tool. It is revealed that the initial design of hot chuck results in a good heat-up speed but there exist a couple of troubles associated with control and integrity of the device. As a means to resolve the raised issues, a revised version of heating tool is proposed, which consists of a working plate made of silicon carbide and a supporting structure made of stainless steel. The advantages of this two-body heating tool are discussed and the improved features are verified experimentally.

• Transactions of Materials Processing
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• v.20 no.8
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• pp.581-587
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• 2011

The production of high-precision micro-sized screws, used to fasten parts of micro devices, generally utilizes a cold thread-rolling process and two flat dies to create the teeth. The process is fairly complex, involving parameters such as die shape, die alignment, and other process variables. Thus, up-front finite-element(FE) simulation is often used in the system design procedure. The final goal of this paper is to produce high-precision screw with a diameter of $800{\mu}m$ and a thread pitch of $200{\mu}m$ (M0.8${\times}$P0.2) by a cold thread rolling process. Part I is a first-stage effort, in which FE simulation is used to establish process parameters for thread rolling to produce micro-sized screws with M1.4${\times}$P0.3, which is larger than the ultimate target screw. The material hardening model was first determined through mechanical testing. Numerical simulations were then performed to find the effects of such process parameters as friction between work piece and dies, alignment between dies and material. The final shape and dimensions predicted by simulation were compared with experimental observation.

• Journal of Mechanical Science and Technology
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• v.19 no.4
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• pp.968-975
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• 2005

The shearing process for the sheet metal is normally used in the precision elements such as semi-conductor components. In these precision elements, the burr formation brings a bad effect on the system assembly and demands the additional de-burring process, so this imposes high cost on manufacturing. In this paper, we have developed the in-situ auto-aligning precision meso-punching system to investigate the burr formation mechanism and ultimately minimize burr. Firstly, we introduced the punch-die contact sensing method to align the punch and the die at initial state prior to the punching process. Secondly, by using the low-price semi-con­ductor laser, burr formed on the edges is measured intermittently during the punching process. We could, finally, make burr on the sheet metal uniformized and minimized by controlling of the precision X - Y table, $1\;{\mu}m$ resolution, and measuring burr height by semiconductor laser. Experimental results show the validity of our system for pursuing the burr-free punched elements.

• Journal of Radiation Industry
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• v.8 no.3
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• pp.147-153
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• 2014

This paper describes a large area CMOS image sensor module Implementation using the precision align inspection program. This work is needed because wafer cutting system does not always have high precision. The program check more than 8 point of sensor edges and align sensors with moving table. The size of a $2{\times}1$ butted CMOS image sensor module which except for the size of PCB is $170mm{\times}170mm$. And the pixel size is $55{\mu}m{\times}55{\mu}m$ and the number of pixels is $3,072{\times}3,072$. The gap between the two CMOS image sensor module was arranged in less than one pixel size.

• Journal of the Korean Society for Precision Engineering
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• v.5 no.3
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• pp.43-47
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• 1988

Height micrometer is a kind of end standards. It consists of a stack of gage blocks which is capable of moving up and down by a micrometer head. Height micrometer requires calibration with very high accuracy because its resolution is generally 1 .mu. m and its accuracy is higher than few micro- meters. Conventionally, comparison with gage blocks is used to calibrate height micrometer, but it is less accurate and time consuming method. A height micrometer calibration system using a laser interferometer instead of gage blocks has been developed. The measuring range of the system is 300mm, and the accuracy is better than ${\pm}0.5{\mu}m$ A new method of maintaining the laser-beam alignment is described as well.

• KIPS Transactions on Software and Data Engineering
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• v.5 no.1
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• pp.35-42
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• 2016

The core of the machine vision that is frequently used at the pre/post-production stages is a marker alignment technology. In this paper, a method to detect the angle and position of a product at high speed by use of a unique pattern present in the marker stamped on the product, and calibrate them is proposed. In the proposed method, to determine the angle and position of a marker, the candidates of the marker are extracted by using a variation of the integral histogram, and then clustering is applied to reduce the candidates. The experimental results revealed about 5s 719ms improvement in processing time and better precision in detecting the rotation angle of a product.