References
- http://www.flipchips.com
- Shin, Y.E. and Koh, Y.W., 2002, 'Trends and Prospects of Domestic Joining Technology in Electric.Electronic Field,' Journal of KWS, Vol. 20, No.5, pp. 618-627
- Lee, Y.M., 1999, 'Overview on Flip Chip Technology for RF Applications,' Journal of Microelectronics and Packaging Soc., Vol. 6, No. 4, pp. 61-71
- Ryu, D.H., Ahn, M.H. and Kim, T.H., 2004, 'Flip-Chip Bonder Apparatus and Method for Operating the Same,' Korean Patent No. 10-0434832
- Hong, S. M., Kang, C. S. and Jung, J. P., 2002, 'Effect of Plasma Treatment on the Bond Strength of Sn-Pb Eutetic Solder Flip Chip,' Journal of Korean Welding Soc., Vol. 20, pp. 92-98
- Park, J.H. and Jung, J.D., 2003, 'Thermal-Mechanical Interaction of Flip Chip Package Constitutents,' Journal of KSPE, Vol. 20, pp. 183-190
- Kim, J. K., 1998, 'Characteristics of Surface Pressure Distribution Around a Kerosene Fan Heater,' Transactions of the KSME B, Vol. 21, No.4, pp. 61-71
- Park, Y.-H., 2003, 'New Design Approach for the Uniform Temperature of Precision Hot Plates,' Transactions of the KSME B, Vol. 27, No. 11, pp. 1525-1533 https://doi.org/10.3795/KSME-B.2003.27.11.1525
- Song, J.Y., Song, C.K., No, S.K. and Park, H.Y., 2002, 'Reliability Evaluation System of Hot Plate for Photoresist Baking,' Journal of KSPE, Vol. 19, pp. 180-186
- Flip Chip Bonders, FC250, A Product Catalog, 2002, Karl Suss
- Lee, S. H., Kwak, H. S., Han, C. S. and Ryu, D. H., 2003, 'A Numerical Model to Aanlyze Thermal Behavior of a Radiative Heater Designed for Flip-Chip Bonders,' Journal of Computational Fluid Engineering, Vol. 8, No.4, pp. 41-49
- Holman, J.P, 1997, Heat Transfer, 8th ed., McGraw-Hill, pp. 142-144
- Watlow, 2002, 'Your Heat Solution Resources,' Watlow Electric Manufacturing Company, COR-LC-0601
- Ryu, D.H., 2002, 'Results of Heating Tests by Using Several Types of Ceramic Heaters,' Private Communication
- Abernethy, R.B., Benedict, R.P. and Dowdell, R.B., 1985, 'ASME Measurement Uncertainty,' Trans ASME J. Fuids Engineering, Vol. 107, pp. 161-164 https://doi.org/10.1115/1.3242450
- Ryu, D.H., Kim, T.H., Kim, J.W., Kwak, H.S. and Lee, S.H., 'Flip-Chip Bonder,' Korean Patent No. 10-518978