• JSTS:Journal of Semiconductor Technology and Science
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• v.17 no.3
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• pp.438-445
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• 2017

This paper presents a low-power high-resolution band-pass ${\Sigma}{\Delta}$ ADC for accelerometer applications. The proposed band-pass ${\Sigma}{\Delta}$ ADC consists of a high-performance 6-th order feed-forward ${\Sigma}{\Delta}$ modulator with 1-bit quantization and a low-power, area-efficient digital filter. The ADC is fabricated in 180 nm 1P6M mixed-signal CMOS process with a die area of $5mm^2$. This high-resolution ADC got 90 dB peak signal to noise plus distortion ratio (SNDR) and 96 dB dynamic range (DR) over 4 kHz bandwidth, while the intermediate frequency (IF) is shifting from 100 KHz to 200 KHz. The power dissipation of the chip is 5.6 mW under 1.8 V (digital)/3.3 V (analog) power supply.

• Journal of the Korean Society for Nondestructive Testing
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• v.27 no.6
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• pp.556-562
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• 2007

This paper presents the use of a novel fiber optic accelerometer system to monitor ambient vibration (both wind-induced one and vehicle-induced) of a real bridge structure. This sensor system integrates the $Moir\'{e}$ fringe phenomenon with fiber optics to achieve accurate and reliable measurements. A low-cost signal processing unit implements unique algorithms to further enhance the resolution and increase the dynamic bandwidth of the sensors. The fiber optic accelerometer has two major benefits in using this fiber optic accelerometer system for monitoring civil engineering structures. One is its immunity to electromagnetic (EM) interference making it suitable for difficult applications in such environments involving strong EM fields, electrical spark-induced explosion risks, and cabling problems, prohibiting the use of conventional electromagnetic accelerometers. The other is its ability to measure both low- and high-amplitude vibrations with a constantly high resolution without pre-setting a gain level, as usually required in a conventional accelerometer. The second benefit makes the sensor system particularly useful for real-time measurement of both ambient vibration (that is often used for structural health monitoring) and strong motion such as earthquake. Especially, the semi-strong motion and the small ambient one are successfully simulated and measured by using the new fiber optic accelerometer in the experiment of the structural health monitoring of a real bridge.

• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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• 2004.05a
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• pp.1047-1051
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• 2004

Charge amplifier systems benefit from the very wide dynamic range of PE accelerometers by offering flexibility in adjusting the electrical output characteristics such as sensitivity and range. They are well suited for operation at high temperatures. Modern charge systems feature improved low noise operation, simplified digital controls, and dual mode operation for operation with charge or IEPE voltage mode sensors. high impedance circuitry is not well suited for operation in adverse field or factory environments. The resolution of a PE accelerometer may not be specified or known since noise is a system consideration determined by cable length and amplifier gain. IEPE accelerometrs operate from a constant current power source, provide a high-voltage, low-impedance, fixed mV/g output. They operate through long, ordinary, coaxial cable in adverse environments without degradation of signal quality. They have limited high temperature range. IEPE sensors are simple to operate. Both resolution and operating range are defined specifications. Cost perchannel is lower compared to PE systems since low-noise cable and charge amplifiers are not required.

• Journal of Sensor Science and Technology
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• v.13 no.6
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• pp.430-435
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• 2004

The resolution of the accelerometer, fabricated with MEMS technology is mainly affected by mechanical and electrical noise. To reduce mechanical noise, we have to increase mass of the structure part and quality factor related with the degree of vacuum packaging. On the other hand, to increase mass of the structure part, the thickness of the structure must be increased and ICP-RIE is used to fabricate the high aspect ratio structure. At this time, footing effect make the sensitivity of the accelerometer decreasing. This paper presents a hybrid SOG(Silicon On Glass) Process to fabricate a lateral silicon accelerometer with differential capacitance sensing scheme which has been designed and simulated. Using hybrid SOG Process, we could make it a real to increase the structural thickness and to prevent the footing effect by deposition of metal layer at the bottom of the structure. Moreover, we bonded glass wafer to structure wafer anodically, so we could realize the vacuum packaging at wafer level. Through this way, we could have an idea of controlling of quality factor.

• Journal of the Korea Institute of Military Science and Technology
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• v.9 no.4
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• pp.71-80
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• 2006

Strapdown Inertial navigation systems consist of an inertial sensor assembly(ISA), electronic modules to process sensor data, and a navigation computer to calculate attitude, velocity and position. In the ISA, most gryoscopes such as RLGs and FOGs, have digital output, but typical accelerometers use current as an analog output. For a high precision inertial navigation system, sufficient stability and resolution of the accelerometer board converting the analog accelerometer output into digital data needs to be guaranteed. To achieve this precision, the asymmetric error and A/D reset scale error of the accelerometer board must be properly compensated. If the relation between the acceleration error and the errors of boards are exactly known, the compensation and estimation techniques for the errors may be well developed. However, the A/D Reset scale error consists of a pulse-train type term with a period inversely proportional to an input acceleration additional to a proportional term, which makes it difficult to estimate. In this paper, the effects on the acceleration output for auto-pilot situations and the effects of A/D reset scale errors during horizontal alignment are qualitatively analyzed. The result can be applied to the development of the real-time compensation technique for A/D reset scale error and the derivation of the design parameters for accelerometer board.

• 제어로봇시스템학회:학술대회논문집
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• 2003.10a
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• pp.2187-2191
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• 2003

In this paper, a x/y-axis accelerometer is fabricated, using the SBM process on a <111> SOI wafer. This fabrication method solves the problem of the footing phenomenon in the conventional SOI process for improved manufacturability and performance. The roughened lower parts as well as the loose silicon fragments due to the footing phenomenon are removed by the alkaline lateral etching step of the SBM process. The fabricated accelerometer has a demodulated signal-to-noise ratio of 92 dB, when 40Hz, 5 g input acceleration is applied. The noise equivalent input acceleration resolution and bandwidth are $125.59\;{\mu}g$ and over 100 Hz, respectively. The acceleration random walk is $12.5\;{\mu}g/\sqrt{Hz}$. The output linearity is measured to be 1.2 % FSO(Full Scale Output) at 40 Hz, and the input range is over ${\pm}\;10g$.

• Proceedings of the KSME Conference
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• 2001.06c
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• pp.53-58
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• 2001

This paper presents a high resolution capacitive microaccelerometer for applications to personal information systems. We reduce the mechanical noise level of the microaccelerometer by increasing the proof-mass based on deep RIE process. We reduce the electrical noise level by increasing the amplitude of an AC sense voltage. The high sense voltage is obtained by DC-to-DC voltage multiplier. In order to solve the nonlinearity problem caused by the high sense voltage, we modify the conventional comb electrode of straight finger type into that of branched finger type, resulting in self force-balancing effects for enhanced detection linearity. The proposed branched finger capacitive microaccelerometer was fabricated by the deep RIE process of an SOI wafer. The fabricated microaccelerometer reduces the electrical noise at the level of $2.4{\mu}g/\sqrt{Hz}$ for the sense voltage of l6.5V, which is 10.1 times smaller than the electrical noise level of $24.3{\mu}g/\sqrt{Hz}$ at 0.9V. For the sense voltage higher than 2V, the electrical noise level of the microaccelerometer became smaller than the constant mechanical noise level of $11{\mu}g/\sqrt{Hz}$. Total noise level, including the electrical noise and the mechanical noise, has been measured as $9{\mu}g/\sqrt{Hz}$ for the sense voltage of 16.5V, which is 3.2 times smaller than the total noise of $28.6{\mu}g/\sqrt{Hz}$ for the sense voltage of 0.9V. The self force-balancing effect results in the increased stiffness of 1.98 N/m at the sense voltage of 17.8V, compared to the stiffness of 1.35 N/m at 0V, thereby generating the additional stiffness at the rate of $0.002N/m/V^{2}$.

• Smart Structures and Systems
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• v.6 no.9
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• pp.1025-1039
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• 2010

Measuring displacement response for civil structures is very important for assessing their performance, safety and integrity. Recently, video-based techniques that utilize low-cost high-resolution digital cameras have been developed for such an application. These techniques however have relatively low sampling frequency and the results are usually contaminated with noises. In this study, an integrated visual-inertial measurement method that combines a monocular videogrammetric displacement measurement technique and a collocated accelerometer is proposed for displacement and velocity measurement of civil engineering structures. The monocular videogrammetric technique extracts three-dimensional translation and rotation of a planar target from an image sequence recorded by one camera. The obtained displacement is then fused with acceleration measured from a collocated accelerometer using a multi-rate Kalman filter with smoothing technique. This data fusion not only can improve the accuracy and the frequency bandwidth of displacement measurement but also provide estimate for velocity. The proposed measurement technique is illustrated by a shake table test and a pedestrian bridge test. Results show that the fusion of displacement and acceleration can mitigate their respective limitations and produce more accurate displacement and velocity responses with a broader frequency bandwidth.

• Smart Structures and Systems
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• v.1 no.1
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• pp.63-82
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• 2005

This paper introduces a technology for robust and low maintenance cost sensor network capable to detect accelerations below a micro-g in a wide frequency bandwidth (above 1,000 Hz). Sensor networks with such performance are critical for navigation, seismology, acoustic sensing, and for the health monitoring of civil structures. The approach is based on the fabrication of an array of high sensitivity accelerometers, each utilizing Fabry-Perot cavity with wavelength-dependent reflectivity to allow embedded optical detection and serialization. The unique feature of the approach is that no local power source is required for each individual sensor. Instead one global light source is used, providing an input optical signal which propagates through an optical fiber network from sensor-to-sensor. The information from each sensor is embedded onto the transmitted light as an intrinsic wavelength division multiplexed signal. This optical "rainbow" of data is then assessed providing real-time sensing information from each sensor node in the network. This paper introduces the Fabry-Perot based accelerometer and examines its critical features, including the effects of imperfections and resolution estimates. It then presents serialization techniques for the creation of systems of arrayed sensors and examines the effects of serialization on sensor response. Finally, a fabrication process is proposed to create test structures for the critical components of the device, which are dynamically characterized.

• Journal of Korean Society for Geospatial Information Science
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• v.19 no.3
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• pp.115-125
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• 2011

The smartphones which have been recently are embedded with high resolution quality camera, assisted GPS, accelerometer, gyroscope and various sensors including magnetometer sensor that could be directly used for measurement. This study aims to suggest the possible application of smartphone camera providing high resolution images in terms of photogrammetry by calibrating it and assessing its accuracy. First of all, prior to the accuracy assessment of smartphone camera, camera calibration was conducted to correct lens distortion of each camera and the accuracy of image coordinates and object coordinates calculated by bundle adjustment during this procedure was analyzed. Also regarding three-dimensional positioning, result analysis depending on considering lens distortion coefficients was conducted, and finally relative accuracy of smartphone camera on metric camera was assessed. The result showed that in terms of distortion correction of smartphone camera, also higher order symmetric radial lens distortion coefficients should be considered, and three dimensional position determined by smartphone images was a little difference from that by metric camera. Therefore it is expected that smartphone images have huge possibility to be used for photogrammetry.