• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.06a
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• pp.129-130
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• 2009

The P/E characteristics of $HfO_2$ CTF memory capacitor with $SiO_2/HfO_2/Al_2O_3$(OHA) engineered tunnel barrier were investigated. After a growth of thermal oxide with a thickness of 2 nm, 1 nm $HfO_2$ and 3 $Al_2O_3$ layers were deposited by atomic layer deposition (ALD) system. The band offset was calculated by analysis of conduction mechanisms through Fowler-Nordheim (FN) plot and Direct Tunneling (DT) plot. Moreover the PIE characteristics of $HfO_2$ CTF memory capacitor with OHA tunnel barrier was presented.

• Journal of IKEEE
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• v.23 no.2
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• pp.594-598
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• 2019

We demonstrate an alternative alignment process using transferring process on solution driven HfZnO film. Parallel pattern is firstly fabricated on a silicon wafer by laser interference lithography. Prepared HfZnO solution fabricated by sol-gel process is spin-coated on a glass substrate. The silicon wafer with parallel pattern is placed on the HfZnO film and annealed at $100^{\circ}C$ for 30 min. After transferring process, parallel grooves on the HfZnO film is obtained which is confirmed by atomic force microscopy and scanning electron microscopy. Uniform liquid crystal alignment is achieved which is attributed to an anisotropic characteristic of HfZnO film by parallel grooves. The liquid crystal cell exhibited a pretilt angle of $0.25^{\circ}$ which showed a homogeneous alignment property.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.18 no.3
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• pp.663-669
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• 2014

The electrical characteristics of RRAM with different annealing temperature and thickness have been measured and discussed. The devices with Pt/Ti top electrode of 150nm, Pt bottom electrode of 150nm, $HfO_2$ oxide thickness of 45nm and 70nm have been fabricated. The fabricated device were classified by 3 different kinds according to the annealing temperature, such as non-annealed, annealed at $500^{\circ}C$ and annealed at $850^{\circ}C$. The set and reset voltages and the variation of resistance with temperatures have been measured as electrical properties. From the measurement, it was found that the set voltages were decreased and the reset voltage were increased slightly, and thus the sensing window was decreased with increasing of measurement temperatures. It was remarkable that the device annealed at $850^{\circ}C$ showed the best performances. Although the device with thickness of 45nm showed better performances in the point of the sensing window, the resistance of 45nm devices was large relatively in the low resistive state. It can be expected to enhance the device performances with ultra thin RRAM if the defect generation could be reduced at the $HfO_2$ deposition process.

• Proceedings of the Materials Research Society of Korea Conference
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• 2006.11a
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• pp.14.2-14.2
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• 2006

• Journal of the Institute of Electronics and Information Engineers
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• v.50 no.2
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• pp.98-103
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• 2013

In this work, we investigated the enhanced performance of IZO-based TFTs with $HfSiO_x$ gate insulators. Four types of $HfSiO_x$ gate insulators using different diposition powers were deposited by co-sputtering $HfO_2$ and Si target. To simplify the processing sequences, all of the layers composing of TFTs were deposited by rf-magnetron sputtering method using patterned shadow-masks without any intentional heating of substrate and subsequent thermal annealing. The four different $HfSiO_x$ structural properties were investigated x-ray diffraction(XRD), atomic force microscopy(AFM) and also analyzed the electrical characteristics. There were some noticeable differences depending on the composition of the $HfO_2$ and Si combination. The TFT based on $HfSiO_x$ gate insulator with $HfO_2$(100W)-Si(100W) showed the best results with a field effect mobility of 2.0[$cm^2/V{\cdot}s$], a threshold voltage of -0.5[V], an on/off ratio of 5.89E+05 and RMS of 0.26[nm]. This show that the composition of the $HfO_2$ and Si is an important factor in an $HfSiO_x$ insulator. In addition, the effective bonding of $HfO_2$ and Si reduced the defects in the insulator bulk and also improved the interface quality between the channel and the gate insulator.

• Journal of Sensor Science and Technology
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• v.29 no.4
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• pp.266-269
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• 2020

In this study, we investigated the effect of a sulfur passivation (S-passivation) process step on the electrical properties of surface-channel In_0.7Ga_0.3As quantum-well (QW) metal-oxide-semiconductor field-effect transistors (MOSFETs) with S/D regrowth contacts. We fabricated long-channel In_0.7Ga_0.3As QW MOSFETs with and without (NH₄)₂S treatment and then deposited 1/4 nm of Al₂O₃/HfO₂ through atomic layer deposition. The devices with S-passivation exhibited lower values of subthreshold swing (74 mV/decade) and drain-induced barrier lowering (19 mV/V) than the devices without S-passivation. A conductance method was applied, and a low value of interface trap density D_it (2.83×10¹² cm^-2eV^-1) was obtained for the devices with S-passivation. Based on these results, interface traps between InGaAs and high-κ are other defect sources that need to be considered in future studies to improve III-V microsensor sensing platforms.

• Journal of the Korean Electrochemical Society
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• v.14 no.4
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• pp.196-200
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• 2011

The formation of niobium oxide microcones on niobium substrates was investigated in NaF to the HF electrolytes. This condition builds on the uniqueness of the microstructures niobium oxide. The dimensions and integrity of the bulk microstructures were found to be strongly dependent on potential, temperature, electrolyte composition, and anodization time. The anodic oxide was initially amorphous at all temperatures, but crystalline oxide nucleated during anodization. From XRD patterns of the anodized specimens, the microcones consisted of crystalline $Nb_2O_5$. We demonstrated niobium oxide microcone structures with nanorods. The anodized niobium oxide microcone texture revealed nanorod bundles. The surface of $Nb_2O_5$ microcones is very regular and has a nano-scale. The surface morphologies of the nanorods were examined using FE-SEM. EDS analyses show that the anodically prepared niobium oxide consists of $Nb_2O_5$. The aim of this study is to find the condition of forming the favorable nanorods by anodization method.

• Korean Journal of Materials Research
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• v.4 no.2
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• pp.166-176
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• 1994

Ni base superalloys are composed of solid sohltion hardening elements(Co, Cr. Mo. W and so on) and $\gamma '$ precipitation hardening elements(A1, Ti, Nb, Ta and so on). To Improve the mechanical properties and oxidation resistanre of superalloys, rare earth elements(%r, Hf, Y and so on) are added to the inner substrate, or are used as coating materials. Their pffects on the growth rate and adhes~on of oxide are changed according to the kinds of oxides such as $AI_2O_3$ and $Cr_2O_3$. The effect of yttrium on the oxidation rate, grain size of oxide, internal structure, and crack resistance was investigated for two kinds of Ni-base superalloys. One in AF'115 superalloy containing Hf and the other is MA6000 superalloy containing $Y_2O_3$. They werr owid~zed at high temperature after yttrium surface modification using ion coater. Yttrium coating on the AF115 and MA6000 superalloys results in a marked change in the growth of the inner oxide. For AF115 superalloy, the degree of gram boundary segregation of $Cr_2O_3$, and prefer en^ tial oxidation of Hf are decreased, and the shape of inner oxidation layer was changed from triangle to plate type. For MA6000 superalloy, $Cr_2O_3$ oxide scale was transformed as outer oxidation layer of CrZOI and inner oxidation layer of $Cr_2O_3$.

• Proceedings of the KIEE Conference
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• 1999.07g
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• pp.3310-3312
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• 1999

We have studied the method of silicon direct bonding using the mixture of $HNO_$, $H_2O_2$, and HF chemicals called the controlled slight etch (CSE) solution for the effective wafer cleaning. CSE, two combinations of oxidizing and etching agents, have been used to clean the silicon surfaces prior to wafer bonding. Two wafers of silicon and silicon dioxide were contacted each other at room temperature and postannealed at $300{\sim}1100^{\circ}C$ in $N_2$ ambient for 2.5 h. We have cleaned silicon wafers with the various HF concentrations and characterized the parameters with regard to surface roughness, chemical nature, chemical oxide thickness, and bonding energy. It was observed that the chemical oxide thickness on silicon wafer decreased with increasing HF concentrations. The initial interfacial energy and final energy postannealed at $1100^{\circ}C$ for 2.5h measured by the crack propagation method was 122 $mJ/m^2$ and 2.96 $mJ/m^2$, respectively.

• Journal of Sensor Science and Technology
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• v.17 no.1
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• pp.9-14
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• 2008

In this paper, the gas responses of tungsten oxide films prepared by anodic reaction was discussed. Sensing electrodes and heating electrodes were patterned by photolithography method on quartz substrate. Porous tungsten oxide was fabricated in electrolyte solutions of 5 % HF (HF :$C_2H_6OH:H_2O$=3 : 2 : 20) by anodic reaction. The anodic reaction with metal (platinum wire) as a cathode and the sensing device as an anode was conducted under the various reaction times (1-10 min) at 10 mA/$cm^2$ The surface structure and morphology of the fabricated sensor have been analysed by X-ray diffraction (XRD) and field-emission scanning electron microscopy (FE-SEM). All the peaks of XRD results were well indexed to the pure phase pattern. The average diameter of the porous tungsten oxide surface were ranged about 100 nm. The fabricaed sensor showed good sensitivity to 200 ppm toluene at operating temperature of $250^{\circ}C$.