• 제목/요약/키워드: Heater array

검색결과 50건 처리시간 0.023초

SOI 기판을 이용한 Thermal Probe 어레이 제작 및 특성 평가 (Fabrication and Characterization of Thermal Probe Array on SOI Substrates)

  • 조주현;나기열;박근형;이재봉;김영석
    • 한국전기전자재료학회논문지
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    • 제18권11호
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    • pp.990-995
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    • 2005
  • This paper reports the fabrication and characterization of $5\;\times\;5$ thermal cantilever array for nano-scaled memory device application. The $5\;\times\;5$ thermal cantilever array with integrated tip heater has been fabricated with MEMS technology on SOI wafer using 7 photo masking steps. All single-level cantilevers have a diode in order to eliminate any electrical cross-talk between adjacent tips. Electrical measurements of fabricated thermal cantilever away show its own thermal heating mechanism. Thermal heating is demonstrated by the reflow of coated photoresist on the cantilever array surface.

마이크로채널에서의 국소 열전달 측정 (Local heat transfer measurement inside microchannel)

  • 조대관;이준식
    • 대한기계학회:학술대회논문집
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    • 대한기계학회 2008년도 추계학술대회A
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    • pp.1902-1907
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    • 2008
  • The current work presents a design and fabrication technique for a microchannel system to measure the local temperature distribution inside microchannel. This micro channel system fabricated by MEMS technique is integrated with a heater and an array of temperature sensors so that detailed heat transfer phenomena inside micro-scale channel can be studied. Materials widely used in semiconductor process were selected to fabricate a heater and temperature sensors on a silicon wafer. On these heater and sensors a channel wall was fabricated with SU-8. The friction constant and the local Nusselt number distribution measured for the deionized water flow in the microchannel is presented.

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MEMS 공정을 이용한 32x32 실리콘 캔틸레버 어레이 제작 및 특성 평가 (Fabrication and Characterization of 32x32 Silicon Cantilever Array using MEMS Process)

  • 김영식;나기열;신윤수;박근형;김영석
    • 한국전기전자재료학회논문지
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    • 제19권10호
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    • pp.894-900
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    • 2006
  • This paper reports the fabrication and characterization of $32{\times}32$ thermal cantilever array for nano-scaled memory device applications. The $32{\times}32$ thermal cantilever array with integrated tip heater has been fabricated with micro-electro-mechanical systems(MEMS) technology on silicon on insulator(SOI) wafer using 9 photo masking steps. All of single-level cantilevers(1,024 bits) have a p-n junction diode in order to eliminate any electrical cross-talk between adjacent cantilevers. Nonlinear electrical characteristic of fabricated thermal cantilever shows its own thermal heating mechanism. In addition, n-channel high-voltage MOSFET device is integrated on a wafer for embedding driver circuitry.

Silicon Nitride Cantilever Array Integrated with Si Heaters and Piezoelectric Sensors for Probe-based Data Storage

  • Nam Hyo-Jin;Kim Young-Sik;Lee Caroline Sunyong;Jin Won-Hyeog;Jang Seong-Soo;Cho Il-Joo;Bu Jong-Uk
    • 정보저장시스템학회논문집
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    • 제1권1호
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    • pp.73-77
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    • 2005
  • In this paper, a new silicon nitride cantilever integrated with silicon heater and piezoelectric sensor has been firstly developed to improve the uniformity of the initial bending and the mechanical stability of the cantilever array for thermo-piezoelectric SPM(scanning probe microscopy) -based data storages. This nitride cantilever shows thickness uniformity less than $2\%$. Data bits of 40 nm in diameter were recorded on PMMA film. The sensitivity of the piezoelectric sensor was 0.615 fC/nm after poling the PZT layer. For high speed operation, 128${\times}$128 probe array was developed.

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산화물 반도체 박막 가스센서 어레이의 제조 및 수율 개선 (Fabrication and yield improvement of oxide semiconductor thin film gas sensor array)

  • 이규정;류광렬;허창우
    • 한국정보통신학회논문지
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    • 제6권2호
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    • pp.315-322
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    • 2002
  • 반도체 제조공정과 미세가공 기술을 이용하여 30$0^{\circ}C$의 동작온도에서 약 60㎽의 전력소모를 갖는 산화물 반도체 박막 가스센서 어레이를 제조하였다. 멤브레인의 우수한 열적 절연은 0.1$\mu\textrm{m}$ 두께의 Si$_3$N$_4$와 1$\mu\textrm{m}$ 두께의 PSG의 이중 층에 의한 것으로, 각각 LPCVD(저압화학 기상증착)와 APCVD(대기압 화학 기상증착)에 의해 제조되었다. 센서 어레이의 4가지 산화물 반도체 박막 감지물질로는 1wt.%Pd가 도핑된 SnO$_2$, 6wt.% $Al_2$O$_3$가 도핑된 ZnO, WO$_3$, ZnO를 이용하였으며, 제조된 초소형 산화물 반도체 박막 가스센서 어레이는 여러 가지 가스의 노출시 유용한 저항 변화를 나타내었고 감도는 감지 물질에 강하게 의존함을 알 수 있었다. 센서 소자의 공정 수율을 증진시키기 위하여 히터 부위를 함몰하는 공정 방법을 취하였으며, 그 결과 월등한 수율 개선을 도모할 수 있었다.

4-bit 디지털 미소분사기의 설계변수와 토출성능간의 영향분석에 관한 실험적 연구 (Design Parameters and Experimental Performance Evaluation of 4-bit Digital Multi-heater Microinjector)

  • 강태구;조영호
    • 대한기계학회논문집A
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    • 제29권3호
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    • pp.418-424
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    • 2005
  • We present the design, fabrication and experimental results of 4-bit digital microinjectors, whose ejected droplet volumes are adjusted by the digital operation of a 4-bit microheater array. We design the reference microinjectors as well as its comparative test structures. In the fabrication process, we use a five-mask micromachining process and the total chip size of the fabricated microinjector is $7,640{\mu}m{\times}5,260{\mu}m.$ We measure the ejected droplet volumes and velocities, which are adjusted from $12.1{\pm}1.0~55.6{\pm}14.7pl\;and\;2.3{\pm}0.1~15.7{\pm}0.8m/s.$ respectively, depending on the 15 possible combinations of 4-bit microheater array. We also experimentally characterize the effect of geometric variation including the microheater size, inter-microheater gap, microchannel width and sequential operation of microheater array on the ejected droplet volume and velocity. Among these parameters, we find that the microheater size is the most dominant parameter affected to the ejected droplet volumes and velocities. Thus, the present microinjector has a potential for application to the high-resolution inkjet printers with multiple gray levels or high-precision fluid injectors with variable volume control.

페리퍼럴어레이 플립칩의 온도 분포 특성 (Temperature Measurement of Flip Chip Joints with Peripheral Array of Solder Bumps)

  • 조본구;이택영;이종원;김준기;김강범
    • 마이크로전자및패키징학회지
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    • 제12권3호
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    • pp.243-251
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    • 2005
  • 페리퍼럴 어레이 플립칩의 온도 분포를 실측하여 열원의 기하학적 형상, 소자의 크기, 그리고 보호막 개구 크기 변화에 따른 소자의 열 성능을 측정하였다. 열원의 크기가 작고, 플립칩 솔더 범프에서 먼 중앙 열원의 경우가 전 면적 열원에 비해서 소자의 온도가 매우 높았다. 여기에 더해, 보호막 개구의 모양 변화에 의한 접촉 면적의 증가를 통해 소자의 최대 온도를 낮출 수가 있었다. 중앙 열원을 갖고 원형 개구에 2 (watts)의 전력이 가해지는 경우, $3(mm)\times3(mm)$크기 소자의 최대 온도는 약 $110(^{\circ}C)$이고, 이에 반해 $1.5(mm)\times1.8(mm)$ 크기 소자의 최대 온도는 약 $90(^{\circ}C)$ 이었다. 또한 보호막 개구의 모양을 원형 개구에서 잘린 사각형 개구로 변화시키면서 접촉 면적을 증가시킨 경우, $3(mm)\times3(mm)$ 크기의 소자와 중앙 열원을 갖는 경우에서 약 $10(^{\circ}C)$의 온도 감소를 나타내었다. 따라서 열원 소자의 위치와 크기, 소자의 크기, 그리고 개구 면적에 따른 솔더의 접촉 면적에 따라 플립칩의 열 성능이 현격한 차이를 나타내고 있음을 알 수 있다.

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서로 다른 자석 배열을 가지는 와전류 열원화 장치의 성능 측정 (Performance Measurement of the Eddy Current Heat Generator with Different Array of Permanent Magnets)

  • 윤택한;손영우;이장호
    • 신재생에너지
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    • 제9권1호
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    • pp.17-24
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    • 2013
  • Eddy Current is one of ways to make heat using rotational energy of wind turbine rotor. Four difference arrays of permanent magnets around rotor surface are used to generate heat using eddy current in this study. For the evaluation of heating performance, new test rig is prepared to measure water flow and temperatures in the inlet and outlet of the eddy current heat generator. In the test, torque and rotational speed are also measured in the motor driven system, and evaluated if the torque is matched with it of wind turbine rotor or not. It will be shown that the eddy current heat generator can be applied to real urban wind energy systems in this study.

소형 저궤도 위성적용을 위한 전력조절분배기 예비설계 (Preliminary Design of a Power Control and Distribution Unit for a Small LEO Satellite Application)

  • 박성우;박희성;장진백;장성수
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 2005년도 제36회 하계학술대회 논문집 B
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    • pp.1438-1440
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    • 2005
  • A power control and distribution unit(PCDU) plays roles of protection of battery against overcharge by active control of solar array generated power, distribution of unregulated electrical power via controlled outlets to bus and instrument units, distribution of regulated electrical power to selected bus and instrument units, and provision of status monitoring and telecommand interface allowing the system and ground operate the power system, evaluate its performance and initiate appropriate countermeasures in case of abnormal conditions. In this work, we perform the preliminary design of a PCDU scheme for the small LEO Satellite applications. The main constitutes of the PCDU are the battery interface module, the auxiliary supply modules, solar array regulators with maximum power point tracking(MPPT) technology, heater power distribution modules, internal converter modules for regulated bus voltage generation. and instrument power distribution modules.

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