• Preventive Nutrition and Food Science
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• 제14권4호
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• pp.349-353
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• 2009

The effects of packaging materials on preserving the functional component of pine bud beverage stored under UV (ultraviolet) light exposure conditions were studied. The order of UV light blocking properties of the selected packages was: opaque can> opaque PET (polyethylene terepthalate) with green lamination=transparent PET with 10% PEN (polyethylene naphthalate) blending> transparent PET, and did not depend on film thickness in specified range. At 20${^{\circ}C}$, the order of preserving degree of original color and endobornyl acetate, which is quality index of pine bud beverage, was the same as above. Exposure to UV light can cause of deterioration of functional food components, but green color lamination and blending of PEN materials with transparent PET help to preserve the UV sensitive pine bud beverage components. However, the treated PET bottles have poorer preservation capabilities than the opaque cans. Transparent PET with PEN blending, in particular, will be very useful packaging material for colorful functional beverage preservation by helping to protect the ingredients while attracting consumer attention.

• 펄프종이기술
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• 제46권4호
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• pp.93-100
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• 2014

The packaging with environment-friendly materials become more important issue since the concern for the environment and the disposal of waste such as the packaging materials has increased. Although the paper based packaging such as corrugated box are widely used as a typical environment-friendly packaging stuff, the heat insulation properties of paper packaging did not get many attention. In this study, the heat insulation properties of paper were deeply evaluated to improve the functional properties as packaging material of the cold storage goods. The simple device for evaluating the heat insulation of paper product was developed. Subsequently, the changes in the heat insulation depending on the paper structure and the addition of the inorganic fillers were investigated by using the instrument. The higher basis weight and the less beating time resulted in the bulkier structure and the less efficiency of heat transfer. The addition of the perlite powder as a filler resulted in the great increase in the heat insulation, although the addition of the calcium carbonate decreased the heat insulation potential of paper.

• 마이크로전자및패키징학회지
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• 제21권2호
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• pp.13-21
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• 2014

Technology for high power devices has made impressive progress in increasing the current density of power semiconductor, system module, and design optimization, which realize high power systems with heterogeneous functional integration. Depending on the performance development of high power semiconductor, packaging technology of high power device is urgently required for efficiency improvement of the device. Power device packaging must provide superior thermal management due to high operating temperature of power modules. Here we, therefore, review critical challenges of typical power electronics packaging today including core assembly processes, component materials, and reliability evaluation regulations.

• 식품산업과 영양
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• 제4권2호
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• pp.1-4
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• 1999

• 마이크로전자및패키징학회지
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• 제22권4호
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• pp.7-14
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• 2015

Research and application of three dimensional packaging technology in electronics have been increasing according to the trend of high density, high capacity and light weight in electronics. In this paper, TSV fabrication and research trend in three dimensional packaging are reported. Low alpha solder bumping which can solve the soft error problem in electronics is also introduced. In detail, this paper includes fabrication of TSV, functional layers deposition, Cu filling in TSV by electroplating using PPR (periodic pulse reverse) and 3 step PPR processes, and low alpha solder bumping on TSV by solder ball. TSV and low alpha solder bumping technologies need more studies and improvements, and the drawbacks of three dimensional packaging can be solved gradually through continuous attentions and researches.

• Journal of Welding and Joining
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• 제31권3호
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• pp.11-16
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• 2013

Through-silicon-via (TSV) is a major technology in microelectronics for three dimensional high density packaging. The 3-dimensional TSV technology is applied to CMOS sensors, MEMS, HB-LED modules, stacked memories, power and analog, SIP and so on which can be employed to car electronics. The copper electroplating is widely used in the TSV filling process. In this paper, the various Cu filling methods using the control of the plating process were described in detail including recent studies. Via filling behavior by each method was also introduced.

• Journal of Biosystems Engineering
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• 제35권5호
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• pp.323-329
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• 2010

Physical damages on fruits may be caused by shock and vibration inputs that transmitted from the transporting vehicle through the packaging and cushioning materials to the fruit. In this study, both half sine shock test and trapezoidal shock test were performed by MIL-STD-810F specification in order to investigate and represent the shock response properties such as peak acceleration and shock amplification factors of the pear according to packaging and cushioning materials for optimal packaging design during transportation. Shock excitation data that had been measured on the vehicle operating on the real road were used. Shock response properties measured by half sine shock test were smaller than those measured by trapezoidal shock test. Results represent that corrugation shapes and thickness can significantly affect the cushioning performance than the paper configurations of cushioning pad and showed that fruits may be damaged seriously while transported on the unpaved road without the properly cushioned packaging practices.

• 공업화학
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• 제26권1호
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• pp.23-28
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• 2015

옻나무에서 추출한 우루시올은 우수한 열안정상과 항균성을 나타내며, 이러한 특성을 기능성 패키징에 응용하기 위하여 폴리우루시올(YPUOH) 분말을 제조하였다. 제조한 YPUOH 분말과 저밀도 폴리에틸렌(LDPE)을 twin screw extruder system을 이용하여 다른 세 가지 조성의 LDPE/YPUOH 복합필름을 제조하였다. 기능성 패키징 소재로서의 응용 가능성을 알아보기 위하여 LDPE/YPUOH 복합필름에 대한 모폴로지, 열적 특성, 항균 특성, 배리어 특성을 조사하였다. LDPE와 YPUOH의 상호작용은 약하지만, 잘 분산된 복합필름 제조가 가능하였으며, YPUOH의 도입에 따라 열안정성은 증가하였다. YPUOH 분말의 우수한 항균특성은 제조한 LDPE/YPUOH의 복합필름에서도 E. coli에 대하여 99.9%의 우수한 항균활성(R)을 확인할 수 있었다. 또한, LDPE/YPUOH 복합필름의 수분에 대한 배리어 특성은 YPUOH의 함량이 증가함에 따라 향상되었으며, 이는 YPUOH가 수분에 대한 배리어성 필러로서 작용하며, 또한 복합필름의 표면 특성을 소수성으로 변화시켜주는 것에 기인한다. 저함량의 YPUOH 도입에 따른 LDPE의 내열성, 항균 특성, 수분에 대한 배리어 특성의 향상은 옻 추출물로 제조한 YPUOH가 패키징 소재의 기능성 필러로서 응용 가능성이 높다는 것을 의미한다.

• 한국포장학회지
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• 제21권2호
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• pp.55-60
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• 2015

수출 절화 백합에서의 포장은 품질 유지 및 신선도에 직접적인 영향을 끼칠 수 있기 때문에 어느 포장재를 선정해야 하는가에 대한 연구가 필요하다. 이 연구에서는 무처리 신문지, OPP천공필름, 연신나이론필름(ON), OPP펀칭필름 그리고 무처리 OPP필름을 이용하여 실험하였다. $25^{\circ}C$에 저장한 백합은 $5^{\circ}C$에 비하여 노화가 급격하게 일어났음을 알 수 있었으며 $25^{\circ}C$에 저장한 백합이 $5^{\circ}C$에 저장한 것보다 수분 흡수와 생체중의 변화폭이 작았다. 뿐만 아니라 생체중은 $5^{\circ}C$가 $25^{\circ}C$ 비하여 OPP필름을 제외한 모든 포장재에서 높게 나타났는데 이는 $5^{\circ}C$가 $25^{\circ}C$에 비해 수분 흡수량이 높게 나타나 생체중 감소를 억제하였기 때문이다. 또한 $5^{\circ}C$일 때 포장재 형태가 백합의 생리활성에 미치는 영향이 $25^{\circ}C$때보다 높게 나타났다. 포장재를 비교하였을 때에는 신문지 포장재만이 저장온도에 따른 절화백합의 생리활성 변화에 영향이 가장 작게 나타났다는 사실로 미루어 보아 개화일은 포장재 형태보다 온도에 의한 영향을 많이 받는다는 사실을 알 수 있었다.

• 한국포장학회지
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• 제13권2호
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• pp.43-50
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• 2007

The production, distribution, and consumption of Korean medicinal herbs have increased every year because of an increase of health considerations. But there are no sufficient standardization procedures in packaging and distribution systems related to these herb products. The standardization of packaging material and dimension could be a good addition for establishing proper quality control methods for Korean medicinal herbs. Medicinal herbs deteriorate under physical, chemical and biological hazards such as oxidation, textural change under high moisture content, color change by light, sanitation problems by insect invasion and contamination. Packaging standardization with proper functional packaging materials is critical to ensure the qualities of medicinal herbs. Also, storage and distribution efficiencies can be improved by achieving packaging dimension standardization. This review summarizes recent research trends related to quality evaluation methods and major quality deterioration factors of Korean medicinal herbs. This paper also offers reviews on some of problems and challenges in current packaging and distribution systems of medicinal herb industries and briefly suggests advanced quality control methods through packaging standardization.