Journal of the Microelectronics and Packaging Society (마이크로전자및패키징학회지)

The Korean Microelectronics and Packaging Society (한국마이크로전자및패키징학회)
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Cu Electroplating and Low Alpha Solder Bumping on TSV for 3-D Packaging

3차원 실장을 위한 TSV의 Cu 전해도금 및 로우알파 솔더 범핑

  • Jung, Do hyun (Department of Materials Science and Engineering, University of Seoul) ;
  • Kumar, Santosh (Department of Materials Science and Engineering, University of Seoul) ;
  • Jung, Jae pil (Department of Materials Science and Engineering, University of Seoul)
  • Received : 2015.12.01
  • Accepted : 2015.12.22
  • Published : 2015.12.30
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Abstract

Research and application of three dimensional packaging technology in electronics have been increasing according to the trend of high density, high capacity and light weight in electronics. In this paper, TSV fabrication and research trend in three dimensional packaging are reported. Low alpha solder bumping which can solve the soft error problem in electronics is also introduced. In detail, this paper includes fabrication of TSV, functional layers deposition, Cu filling in TSV by electroplating using PPR (periodic pulse reverse) and 3 step PPR processes, and low alpha solder bumping on TSV by solder ball. TSV and low alpha solder bumping technologies need more studies and improvements, and the drawbacks of three dimensional packaging can be solved gradually through continuous attentions and researches.

Keywords

References

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