• 한국공작기계학회논문집
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• 제17권5호
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• pp.76-81
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• 2008

Nanoimprint lithography(NIL) is an emerging technology enabling cost-effective and high-throughput nanofabrication. Among NILs, significant efforts from both academia and industry have been put in UV NIL research and development because of its ability to pattern at room temperature and at low pressure. In UV NIL, there may be in-line set-up error of the stamp and the substrate. To compensate this error, the dummy blocks are put on the stamp and pressurized uniformly. Contact problems between the stamp and the photoresist layer on the substrate are often happened, which results in the non-uniform residual layer In this paper, the pressurization method on the dummy block is investigated by the finite element method. A new method is recommended and evaluated far the uniform stamp deformation.

• Structural Engineering and Mechanics
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• 제57권4호
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• pp.703-716
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• 2016

In this paper, we have investigated shear horizontal wave propagation in a layered structure, consisting of granular macromorphic rock (Dionysos Marble) substrate underlying a viscoelastic layer of finite thickness. SH waves characteristics are affected by the material properties of both substrate and the coating. The effects of microstructural parameter "characteristic length" of the substrate, along with heterogeneity, internal friction and thickness of viscoelastic layer are studied on the dispersion curves. Dispersion equation for SH wave is derived. Real and damping phase velocities of SH waves are studied against dimensionless wave number, for different combinations of various parameters involved in the problem.

• Current Optics and Photonics
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• 제1권6호
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• pp.637-641
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• 2017

We present dielectric constant measurements of thin films using THz metamaterials fabricated on a quartz substrate. The resonance shifts of the metamaterials exhibit saturation behavior with increasing film thickness. The saturation frequency shift varies with the real part of the dielectric constant, from which the numerical expression for the particular metamaterial design was extracted. We first performed finite-difference time-domain simulations to find an explicit relationship between the saturated frequency shift and the dielectric constant of a thin film, which was confirmed by the experimental results from conventional techniques. In particular, the quartz substrate enables us to determine their values more accurately, because of its low substrate index. As a result, we extracted the dielectric constants of various films whose values have not been addressed previously without precise control of the film thickness.

• JSTS:Journal of Semiconductor Technology and Science
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• 제5권1호
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• pp.17-23
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• 2005

This paper describes the simulation of a micromachined dome-shaped-diaphragm acoustic transducer built on a $1.5{\mu}m$ thick silicon nitride diaphragm ($2,000{\mu}m$ in radius, with a circular clamped boundary on a silicon substrate) with electrodes and piezoelectric ZnO film in a silicon substrate. Finite element analysis with ANSYS 5.6 has been performed to analyze the static and dynamic behaviors of the transducer under both pressure and voltage loadings.

• 대한전자공학회:학술대회논문집
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• 대한전자공학회 1999년도 하계종합학술대회 논문집
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• pp.881-884
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• 1999

In this paper, resonant frequency, electromagnetic field distribution, and resonant mode of a microstrip substrate-mounted dielectric resonator are investigated. A dielectric resonator is excited by the microstrip line. The data are obtained using the finite difference time-domain (FDTD) and compared with the experimental results and theoretical solutions the previous published paper.

• 접착 및 계면
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• 제5권2호
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• pp.14-26
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• 2004

For reliable determination of mechanical characteristics of adhesively bonded joints used e.g. as input data for computer-aided design of complex components, the thick-adherend tensile-shear test according to ISO 11003-2 is the most important material testing method. Although the total displacement of the joint is measured across the polymer layer directly in the overlap zone in order to minimize the influence of the stepped adherends, the substrate deformation must be taken into account within the framework of the evaluation of the shear modulus and the maximum shear strain, at least when high-strength adhesives are applied. In the standard ISO 11003-2 version of 1993, it was prescribed to perform the substrate deformation correction by means of testing a one-piece reference specimen. The authors, however, pointed to the excessive demands on the measuring accuracy of the extensometers connected with this technique in industrial practice and alternatively proposed a numerical deformation analysis of a dummy specimen. This idea of a mathematical correction was included in the revised ISO 11003-2 version of 2001 but in the simplified form of an analytical method based on Hooke's law of elasticity for small strains. In the present work, it is shown that both calculation techniques yield considerably discordant results. As experimental assessment would require high-precision distance determination (e.g. laser extensometer), finite element analyses of the deformation behavior of the bonded joint are performed in order to estimate the accuracy of the obtained substrate deformation corrections. These simulations reveal that the numerical correction technique based on the finite element deformation modeling of the reference specimen leads to considerably more realistic results.

• Tribology and Lubricants
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• 제37권6호
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• pp.240-245
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• 2021

Ceramic coatings with high hardness and excellent chemical stability have been successfully applied to various machine elements, tools, and implants. However, in the case of monolayer coating on soft substrates, a high-stress concentration at the interface between the coating and the substrate causes delamination of the coating layer. Recently, to overcome this problem, multilayer coatings with a metal layer with a low modulus of elasticity added between the ceramic and the substrate have been widely applied. This study presents the third part of a recent study and focuses on the effect of the number of coating layers on the Brinell hardness of multilayered coating with TiN/Ti, following the two previous studies on a new Brinell hardness test method for a coated surface and on the influence of substrate and coating thickness. Indentation analyses are performed using finite element analysis software, von Mises stress and equivalent plastic strain distributions, load-displacement curves, and residual indentation shapes are presented. The number of TiN/Ti layers considerably affect the stress distributions and indentation shapes. Moreover, the greater the number of TiN/Ti layers, the higher is the Brinell hardness. The stress and plastic strain distributions confirm that the multilayer coatings improve the wear resistance. The results are expected to be used to design and evaluate various coating systems, and additional study is required.

• 마이크로전자및패키징학회지
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• 제31권1호
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• pp.23-28
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• 2024

유연소자를 이용한 전자제품은 실사용환경에서 가혹한 기계적 변형을 경험한다. 이에 따라 유연소자의 기계적 신뢰성에 대한 연구가 많은 연구자들의 관심을 받고 있다. 본 연구에서는 유연기판에 증착된 금속 박막의 최대 굽힘 변형률을 예측하기 위하여 기존에 사용하는 굽힘 변형률 모델과 유한요소해석을 이용하였다. 박막의 소재 및 두께, 기판의 두께를 달리하여 유한요소해석으로 굽힘 실험을 모사하였고, 기존 모델로 예측된 변형률과 해석결과를 서로 비교하였다. 굽힘 변형 시 박막 첨단과 주위의 변형률 분포를 확인하였고, 굽힘 정도에 따른 기존 모델의 오차율을 정리하였다. 신규수학적 모델을 제시하여 각 경우의 수에 따른 상수를 제시하였다.

• 마이크로전자및패키징학회지
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• 제6권4호
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• pp.23-33
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• 1999

유한요소법을 이용한 IGBT 3상 풀브릿지 모듈의 열.응력 해석을 수행하였다. 패키지 재료에 의한 영향을 살피고자 AIN과 $A1_2O_3$절연기판을 사용한 경우를 비교하였으며, 적층구조의 규격을 변화시켜 열해석 및 열응력 해석결과를 비교하였다. 열해석 경계조건 설정에 따른 차이를 비교하기 위하여 등가열전달계수 경계조건(FHTCC)과 일정온도 경계조건(CTC)으로 나누어 해석하였다. 절연기판 면적의 증가는 열저항 감소에 거의 기여하지 못하였으나 열응력 감소에는 상당한 효과를 보였는데, 기판면적이 3배 넓어지면 열저항 감소분은 $A1_2O_3$ 절연기판 모듈에서 8.9%정도, AIN 절연기판 모듈에선 1.5% 정도 감소하는데 그쳤으나 열응력은 최고 60%의 감소를 보였다. 또한 솔더의 두께가 증가할수록 열저항은 증가하였으나, 열응력은 감소 또는 일정하게 유지함을 확인하였다. 각 모듈에서 최대응력값은 모두 절연기판과 접촉된 상, 하부 Cu pad에서 발생하였으며 모듈 패키지 가장자리 부분보다는 중앙부의 응력값이 높았다.

• 대한금속재료학회지
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• 제47권3호
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• pp.202-208
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• 2009

The effects of aging time on the microstructure and shear strength of the Low Temperature Co-fired Ceramic (LTCC)/Ag pad/Electroless Nickel Immersion Gold (ENIG)/BGA solder joints were investigated through isothermal aging at $150^{\circ}C$ for 1000 h with conventional Sn-37Pb and Sn-3Ag-0.5Cu. $Ni_3Sn_4$ intermetallic compound (IMC) layers was formed at the interface between Sn-37Pb solder and LTCC substrate as-reflowed state, while $(Ni,Cu)_3Sn_4$ IMC layer was formed between Sn-3Ag-0.5Cu solder and LTCC substrate. Additional $(Cu,Ni)_6Sn_5$ layer was found at the interface between the $(Ni,Cu)_3Sn_4$ layer and Sn-3Ag-0.5Cu solder after aging at $150^{\circ}C$ for 500 h. Thickness of the IMC layers increased and coarsened with increasing aging time. Shear strength of both solder joints increased with increasing aging time. Failure mode of BGA solder joints with LTCC substrate after shear testing revealed that shear strength of the joints depended on the adhesion between Ag metallization and LTCC. Fracture mechanism of Sn-37Pb solder joint was a mixture of ductile and pad lift, while that of Sn-3Ag-0.5Cu solder joint was a mixture of ductile and brittle $(Ni,Cu)_3Sn_4$ IMC fracture morphology. Failure mechanisms of LTCC/Ag pad/ENIG/BGA solder joints were also interpreted by finite element analyses.