Design of the Dummy Block for Uniform Stamp Deformation in the UV Nanoimprint Lithography

UV 나노 임프린트 공정에서 스탬프 균일 변형을 위한 더미 블록 설계

  • 김남웅 (서울대 대학원 기계항공공학부) ;
  • 김국원 (순천향대학교 기계공학과) ;
  • 정태은 (인덕대 정보메카트로닉스과) ;
  • 신효철 (서울대 기계항공공학부)
  • Published : 2008.10.15

Abstract

Nanoimprint lithography(NIL) is an emerging technology enabling cost-effective and high-throughput nanofabrication. Among NILs, significant efforts from both academia and industry have been put in UV NIL research and development because of its ability to pattern at room temperature and at low pressure. In UV NIL, there may be in-line set-up error of the stamp and the substrate. To compensate this error, the dummy blocks are put on the stamp and pressurized uniformly. Contact problems between the stamp and the photoresist layer on the substrate are often happened, which results in the non-uniform residual layer In this paper, the pressurization method on the dummy block is investigated by the finite element method. A new method is recommended and evaluated far the uniform stamp deformation.

Keywords

References

  1. Chou, S. and Krauss, P., 1997, "Imprint lithography with sub-10nm feature size and high throughput," Microelectronic Engineering, Vol. 35, pp. 237-240 https://doi.org/10.1016/S0167-9317(96)00097-4
  2. Guo, L. J., 2004, "Recent progress in nanoimprint technology and its applications," Journal of Physics D: Applied Physics, Vol. 37, pp. R123-R141 https://doi.org/10.1088/0022-3727/37/11/R01
  3. Schulz, H., Wissen, M., Bogdanski, N., Scheer, H.-C., Mattes, K., and Friedrich, Ch., 2006, "Impact of molecular weight of polymers and shear rate effects for nanoimprint lithography," Micro-electronic Engineering, Vol. 83, pp. 259-280 https://doi.org/10.1016/j.mee.2005.07.090
  4. Ruchhoeft, P., Colburn, M., Choi, B., Nounu, H., Johnson, S., Bailey, T., Damle, S., Stewart, M., Ekerdt, J., Sreenivasan, S. V., Wolfe, J. C., and Willsonet, C. G., 1999, "Patterning curved surfaces: Template generation by ion beam proximity lithography and relief transfer by step and flash imprint lithography," J. Vac. Sci. Technol. B, Vol. 17, pp. 2965-2969 https://doi.org/10.1116/1.590935
  5. Resnick, D. J., Dauksher, W. J., Mancini, D., Nordquist, K. J., Bailey, T. C., Johnson, S., Stacey, N., Ekerdt, J. G., Willson, C. G., Sreenivasan, S. V., and Schumaker, N., 2003, "Imprint lithography for integrated circuit fabrication," J. Vac. Sci. Technol. B, Vol. 21, pp. 2624-2631 https://doi.org/10.1116/1.1618238
  6. Song, Y. J., Shin, D. H., Im, H. J., Jang, S. Y., Lee, K. S., and Jeong, J. I., 2007, "LCD Glass strain Simulation During stage alignment process of Large Size Imprint Equipment," Proceedings of The KSMTE Spring Conference 2007, pp. 108-111
  7. Lee, K. W., Lee, M. G., Lee, J. W., Lim, S.-H., Shin, D. H., Jang, S. Y., Jeong, J. I., and Yim, H. J., 2007, "Dynamic Analysis of a Nano Imprinting Stage Using CAE," Trans. of the KSMTE, Vol. 16, No. 5, pp. 211-217