• ETRI Journal
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• 제39권2호
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• pp.292-299
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• 2017

We propose pulse-mode dynamic $R_on$ measurement as a method for analyzing the effect of stress on large-scale high-power AlGaN/GaN HFETs. The measurements were carried out under the soft-switching condition (zero-voltage switching) and aimed to minimize the self-heating problem that exists with the conventional hard-switching measurement. The dynamic $R_on$ of the fabricated AlGaN/GaN MIS-HFETs was measured under different stabilization time conditions. To do so, the drain-gate bias is set to zero after applying the off-state stress. As the stabilization time increased from $ 0.1{\mu}s$ to 100 ms, the dynamic $R_on$ decreased from $160\Omega$ to $2\Omega$. This method will be useful in developing high-performance GaN power FETs suitable for use in high-efficiency converter/inverter topology design.

• JSTS:Journal of Semiconductor Technology and Science
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• 제9권3호
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• pp.136-147
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• 2009

In this paper we analyze the influence of source/drain (S/D) extension region design for minimizing short channel effects (SCEs) in 25 nm gate length single and double gate Silicon-on-Insulator (SOI) and Germanium-on-Insulator (GOI) MOSFETs. A design methodology, by evaluatingm the ratio of the effective channel length to the natural length for the different devices (single or double gate FETs) and technology (SOI or GOI), is proposed to minimize short channel effects (SCEs). The optimization of non-overlapped gate-source/drain i.e. underlap channel architecture is extremely useful to limit the degradation in SCEs caused by the high permittivity channel materials like Germanium as compared to that exhibited in Silicon based devices. Subthreshold slope and Drain Induced Barrier Lowering results show that steeper S/D gradients along with wider spacer regions are needed to suppress SCEs in GOI single/double gate devices as compared to Silicon based MOSFETs. A design criterion is developed to evaluate the minimum spacer width associated with underlap channel design to limit SCEs in SOI/GOI MOSFETs.

• 대한전자공학회논문지SD
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• 제49권4호
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• pp.1-6
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• 2012

본 논문에서는 고주파에서 동작하는 터널링 전계효과 트랜지스터 (TFET)의 소신호 파라미터 추출과 이에 대한 분석을 다루고 있다. 시뮬레이션으로 구현된 TFET의 채널 길이는 50 nm에서 100 nm 사이에서 변화되었다. Conventional planar MOSFET 기반의 quasi-static 모델을 이용하여 TFET의 파라미터 추출이 이루어졌으며 다른 채널 길이를 갖는 TFET에 대한 소신호 파라미터의 값을 게이트 바이어스 변화에 따라서 추출하였다. 추출 결과로부터 effective gate resistance와 transconductance, source-drain conductance, gate capacitance 등 주요 파라미터의 채널 길이 변화에 따른 경향성이 conventional MOSFET과 상당히 다른 것을 확인하였다. 그리고 $f_T$는 MOSFET과 달리 게이트 길이 역수의 값에 정확히 반비례하는 특성을 보였으며 TFET의 고주파 특성 향상을 transconductance의 개선이 아닌 gate capacitance의 감소에 의하여 가능함을 알 수 있었다.

• JSTS:Journal of Semiconductor Technology and Science
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• 제6권1호
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• pp.30-37
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• 2006

In this article, we evaluated the structural merits and the validity of a partially insulated MOSFET (PiFET) through the fabrication of prototype transistors and an 80 nm 512M DDR DRAM with partially-insulated cell array transistors (PiCATs). The PiFETs showed the outstanding short channel effect immunity and off-current characteristics over the conventional MOSFET, resulting from self-induced halo region, self-limiting SID shallow junction, and reduced junction area due to PiOX layer formation. The DRAM with PiCATs also showed excellent data retention time. Thus, the PiFET can be a promising alternative for ultimate scaling of planar MOSFET.

• Journal of Electrical Engineering and Technology
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• 제3권4호
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• pp.566-570
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• 2008

Vertical nanowire SGFETs(Surrounding Gate Field Effect Transistors) provide full gate control over the channel to eliminate short channel effects. This paper presents design and characterization of a differential pair amplifier using NMOS and PMOS SGFETs with a 10nm channel length and a 2nm channel radius. The amplifier dissipates $5{\mu}W$ power and provides 5THz bandwidth with a voltage gain of 16, a linear output voltage swing of 0.5V, and a distortion better than 3% from a 1.8V power supply and a 20aF capacitive load. The 2nd and 3rd order harmonic distortions of the amplifier are -40dBm and -52dBm, respectively, and the 3rd order intermodulation is -24dBm for a two-tone input signal with 10mV amplitude and 10GHz frequency spacing. All these parameters indicate that vertical nanowire surrounding gate transistors are promising candidates for the next generation high speed analog and VLSI technologies.

• 한국재료학회지
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• 제26권11호
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• pp.635-643
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• 2016

Graphene has shown exceptional properties for high performance devices due to its high carrier mobility. Of particular interest is the potential use of graphene nanoribbons as field-effect transistors. Herein, we introduce a facile approach to the fabrication of graphene nanoribbon (GNR) arrays with ~200 nm width using nanoimprint lithography (NIL), which is a simple and robust method for patterning with high fidelity over a large area. To realize a 2D material-based device, we integrated the graphene nanoribbon arrays in field effect transistors (GNR-FETs) using conventional lithography and metallization on highly-doped $Si/SiO_2$ substrate. Consequently, we observed an enhancement of the performance of the GNR-transistors compared to that of the micro-ribbon graphene transistors. Besides this, using a transfer printing process on a flexible polymeric substrate, we demonstrated graphene-silicon junction structures that use CVD grown graphene as flexible electrodes for Si based transistors.

• 전기전자학회논문지
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• 제24권3호
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• pp.845-852
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• 2020

3 나노미터 아래의 미래공정에서는 작은 면적의 표준셀(Standard Cell)을 구현하는 데에 많은 기술적인 개선을 요구한다. 따라서 어떠한 기술을 통해 얼마나 작은 면적의 표준셀을 구현할 수 있는지, 그리고 그 영향이 어떠한지 알아보는 것은 매우 중요하다. 본 논문에서는 3 나노미터와 이하의 미래공정에서 표준셀 설계를 위해 묻힌 전력망(Buried Power Rail, BPR)과 상호보완 FET(Complementary FET, CFET)이 면적 감소에 얼마나 기여하는지 살펴보며 그 영향을 기생 캐패시턴스 관점에서 분석한다. 본 논문을 통해 상호보완 FET은 4T 이하의 표준셀을 구현할 수 있는 기술이지만, Z-축으로 증가하는 높이만큼 상당한(+18.0% 이상) 기생 Cap의 영향을 받는다는 점을 밝힌다.

• Journal of Power Electronics
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• 제11권4호
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• pp.527-532
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• 2011

Due to the need for improved fuel consumption and the trend towards increasing the electrical content in automobiles, integrated starter generator (ISG) systems are being considered by the automotive industry. In this paper, in order to change the conventional generator of a vehicle, a belt driven integrated starter generator is considered. The overall ISG system, the design considerations for the claw pole type AC electric machine and a low voltage very high current power stage implementation are discussed. Test data on the low voltage claw pole type machine is presented, and a large current voltage source DC/AC inverter suitable for low voltage integrated starter generator operation is also presented. A metal based PCB (Printed Circuit Board) power unit to attach the 4-parallel MOS-FETs is used to achieve extremely high current capability. Furthermore, issues related to the torque assistance during vehicle acceleration and the generation/regeneration characteristics are discussed. A prototype with the capability of up to 1000 A and 27 V is designed and built to validate the kilo-amp inverter.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2002년도 추계학술대회 논문집 전기기기 및 에너지변환시스템부문
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• pp.204-206
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• 2002

For small capacity rectifier circuits such as these for consumer electronics and appliances. capacitor input type rectifier circuits are generally used Consequently. various harmonics generated within the power system become a serious Problem. Various studies of this effect have been presented previously. However. most of these employ switching devices, such as FETs and the like. The absence of switching devices makes systems more tolerant to over -load, and brings low radio noise benefits. We propose a power factor correction scheme using a LC resonant in commercial frequency without switching devices. In this method. It makes a sinusoidal wave by widening conduction period using the current resonance in commercial frequency. Hence, the harmonic characteristics can be significantly improved. where the lower order harmonics. such as the fifth and seventh orders are much reduced. The result are confirmed by the theoretical and expermental implementations.

• E2M - 전기 전자와 첨단 소재
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• 제7권1호
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• pp.57-63
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• 1994

Aluminum oxide($Al_2{O_3}$) offers some unique advantages over the conventional silicon dioxide( $SiO_{2}$) gate insulator: greater resistance to ionic motion, better radiation hardness, possibility of obtaining low threshold voltage MOS FETs, and possibility of use as the gate insulator in nonvolatile memory devices. We have undertaken a study of the dielectric breakdown of $Al_2{O_3}$ on Si deposited by GAIVBE technique. In our experiments, we have varied the $Al_2{O_3}$ thickness from 300.angs. to 1400.angs. The resistivity of $Al_2{O_3}$ films varies from 108 ohm-cm for films less than 100.angs. to 10$_{13}$ ohm-cm for flims on the order of 1000.angs. The flat band shift is positive, indicating negative charging of oxide. The magnitude of the flat band shift is less for negative bias than for positive bias. The relative dielectric constant was 8.5-10.5 and the electric breakdown fields were 6-7 MV/cm(+bias) and 11-12 MV/cm (-bias).