• Journal of Korean Society of Occupational and Environmental Hygiene
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• v.32 no.2
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• pp.111-115
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• 2022

Objectives: The purpose of this study is to verify whether droplet-induced propagation, the main route of infectious diseases such as COVID-19, can occur in semiconductor FAB (Fabrication), based on research results on general droplet propagation. Methods: Through data surveys droplet propagation was modeled through simulation and experimental case analysis according to general (without mask) and mask-wearing conditions, and the risk of droplet propagation was inferred by reflecting semiconductor FAB operation conditions (air current, air conditioning system, humidity, filter conditions). Results: Based on the results investigated to predict the possibility of spreading infectious diseases in semiconductor FAB, the total amount of droplet propagation (concentration), propagation distance, and virus life in FAB were inferred by reflecting the management parameter of semiconductor FAB. Conclusions: The total amount(concentration) of droplet propagation in the semiconductor fab is most affected by the presence or absence of wearing a mask and the line air dilution rate has some influence. when worn it spreads within 0.35~1m, and since the humidity is constant the virus can survive in the air for up to 3 hours. as a result the semiconductor fab is judged to be and effective space to block virus propagation due to the special environmental condition of a clean room.

• Journal of Sensor Science and Technology
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• v.31 no.6
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• pp.366-370
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• 2022

A 12 ㎛ pixel-sized 360 × 240 microbolometer focal plane array (MBFPA) was fabricated using a complementary metaloxide-semiconductor (CMOS)-compatible process. To release the MBFPA membrane, an amorphous carbon layer (ACL) processed at a low temperature (<400 ℃) was deposited as a sacrificial layer. The thermal time constant of the MBFPA was improved by using serpentine legs and controlling the thickness of the SiNx layers at 110, 130, and 150 nm on the membrane, with response times of 6.13, 6.28, and 7.48 msec, respectively. Boron-doped amorphous Si (a-Si), which exhibits a high-temperature coefficient of resistance (TCR) and CMOS compatibility, was deposited on top of the membrane as an IR absorption layer to provide heat energy transformation. The structural stability of the thin SiNx membrane and serpentine legs was observed using field-emission scanning electron microscopy (FE-SEM). The fabrication yield was evaluated by measuring the resistance of a representative pixel in the array, which was in the range of 0.8-1.2 Mohm (as designed). The yields for SiNx thicknesses of SiNx at 110, 130, and 150 nm were 75, 86, and 86%, respectively.

• Journal of Appropriate Technology
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• v.6 no.2
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• pp.200-207
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• 2020

The purpose of the establishment of Fab Lab is to promote the sustainable development of local communities around the world. To this end, The Fab foundation are preparing a resource-circulating society that maintains a city's self-sufficiency rate of 50% or more by 2054. In developed countries, Fab Lab is not only a manufacturing space for startup support, but an open innovation space for learning and creation. In addition, in emerging countries, Fab Lab is playing a role as a digital production center to create and share appropriate new technologies by reflecting the needs of local communities. India has 70 Fab Labs, the largest emerging country, ahead of Russia's 48. India's Fab Lab is conducting a collaboration project through regular meetings held every six months. The subject of this study, Fab Lab Vigyan Ashram, is defined as a place to transfer the concept of digital lab to alternative schools in rural India. In this study, we looked at a case in which an alternative school for an agricultural community called Vigyan Ashram, the modern version of the Gurukula system, successfully combined with the digital fabrication called Fab Lab to become a new citizen-led making community of the 4th Industrial Revolution. Based on this, we explored the development model of the Indian Fab Lab that fits the local situation.

• Industrial Engineering and Management Systems
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• v.4 no.1
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• pp.47-53
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• 2005

The efficiency of fabrication (fab) operation is one of the key factors in order for a semiconductor manufacturing company to stay competitive. Optimization of manpower and forecasting manpower needs in a modern fab is an essential part of the future strategic planing and a very important to the operational efficiency. As the semiconductor manufacturing technology has entered the 8-inch wafer era, the complexity of fab operation increases with the increase of wafer size. The wafer handling method has evolved from manual mode in 6-inch wafer fab to semi-automated or fully automated factory in 8-inch and 12-inch wafer fab. The distribution of manpower requirement in each specialty varied as the trend of fab operation goes for downsizing manpower with automation and outsourcing maintenance work. This paper is to study the specialty distribution of manpower from the requirement in a typical 6-inch, 8-inch to 12-inch wafer fab. The human resource planning in today’s fab operation shall consider many factors, which include the stability of technical talents. This empirical study mainly focuses on the human resource planning, the manpower distribution of specialty structure and the forecast model of internal demand/supply in current semiconductor manufacturing company. Considering the market fluctuation with the demand of varied products and the advance in process technology, the study is to design a headcount forecast model based on current manpower planning for direct labour (DL) and indirect labour (IDL) in Taiwan’s fab. The model can be used to forecast the future manpower requirement on each specialty for the strategic planning of human resource to serve the development of the industry.

• Proceedings of the PSK Conference
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• 2003.04a
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• pp.217.2-217.2
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• 2003

In the type II system. there are two elongation enzymes in E. coli, FabB is well-known to its ability to elongate cis-3-decenoly-ACP (C10:1) in unsaturated fatty acid synthesis, whereas FabF is important for the thermal regulation of fatty acid composition by its ability to elongate palmitoleic acid to vaccenic acid. based on their genetic mutation anaylsis. Radiochemical enzyme assay was performed using myristoyl-ACP as a substrate, which is known for general substrate of FabB and FabF. (omitted)

• Proceedings of the Materials Research Society of Korea Conference
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• 1998.08a
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• pp.78.1-78
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• 1998

• Korean Journal of Computational Design and Engineering
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• v.19 no.3
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• pp.214-223
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• 2014

This paper presents a bottleneck detection framework using simulation approach in a wafer FAB (Fabrication). In a semiconductor manufacturing industry, wafer FAB facility contains various equipment and dozens kinds of wafer products. The wafer FAB has many characteristics, such as re-entrant processing flow, batch tools. The performance of a complex manufacturing system (i.e. semiconductor wafer FAB) is mainly decided by a bottleneck. This paper defines the problem of a bottleneck process and propose a simulation based framework for bottleneck detection. The bottleneck is not the viewpoint of a machine, but the viewpoint of a step with the highest WIP in its upstream buffer and severe fluctuation. In this paper, focus on the classification of bottleneck steps and then verify the steps are not in a starvation state in last, regardless of dispatching rules. By the proposed framework of this paper, the performance of a wafer FAB is improved in on-time delivery and the mean of minimum of cycle time.

• Bulletin of the Korean Chemical Society
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• v.30 no.5
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• pp.1101-1106
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• 2009

Multivalent and multi-specific antibodies can provide valuable tools for bio-medical research, diagnosis and therapy. In antigen-antibody interactions, the avidity of antibodies depends on the affinity and the number of binding sites.$^1$ As artificial multivalent antibody agents, single chain Fv-streptavidin fusion tetramer proteins $(scFv-SA)_4$ have been previously tested.$^{1,\;2}$ Although, the Fab domain is known to be more stable than scFv in animal models,$^{3,\;4}$ it has never been used to make a multivalent agent with a streptavidin fusion. In this study, we prepared tetra-valent $(Fab-cSA)_4$ by fusing Fab with core streptavidin (cSA). This molecule was made using inclusion body production, refolding and chromatography purification. Affinities of the Fab-cSA tetramer and a scFv-cSA tetramer to a cell surface antigen were compared by ELISA using biotin-HRP. The Fab-cSA tetramer showed higher binding avidity than the scFv-cSA tetramer. The higher binding avidity of the Fab-cSA tetramer demonstrates its potential as a therapeutic agent for target-specific antibody therapy.

• Journal of Korean Institute of Industrial Engineers
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• v.28 no.4
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• pp.415-424
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• 2002

Semiconductor manufacturing has been emerged as a highly competitive but profitable business. Accordingly it becomes very important for semiconductor manufacturing companies to meet customer demands at the right time, in order to keep the leading edge in the world market. However, due-date oriented production is very difficult task because of the complex job flows with highly resource conflicts in fabrication shop called FAB. Due to its cyclic manufacturing feature of products, to be completed, a semiconductor product is processed repeatedly as many times as the number of the product manufacturing cycles in FAB, and FAB processes of individual manufacturing cycles are composed with similar but not identical unit processes. In this paper, we propose a production scheduling and control scheme that is designed specifically for semiconductor scheduling environment (FAB). The proposed scheme consists of three modules: simulation module, cycle due-date estimation module, and dispatching module. The fundamental idea of the scheduler is to introduce the due-date for each cycle of job, with which the complex job flows in FAB can be controlled through a simple scheduling rule such as the minimum slack rule, such that the customer due-dates are maximally satisfied. Through detailed simulation, the performance of a cycle due-date based scheduler has been verified.

• IE interfaces
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• v.22 no.1
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• pp.1-9
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• 2009

As the LCD fabrication factories (Fab) are highly capital-intensive and the markets are very competitive, it is an essential requirement of operational management to achieve full-capacity production while meeting customer demands on time. In a typical LCD Fab, medium-term schedules such as release plans and production plans are critical to achieve the goal of full-capacity production and on-time delivery. Presented in this paper is a framework for weekly planning system generating medium-term schedules using a finite-capacity planning method. Also this paper presents a release planning method applying capacityfiltering algorithm, especially backward capacity-filtering procedure, which is one of the finite-capacity planning methods. In addition, performance analyses using actual data of a TFT-LCD Fab show that the proposed method is superior to existing methods or commercial S/W products generating release plans.