• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.21 no.1
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• pp.1-4
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• 2008

The electrical characteristics of polycrystalline silicon (poly-Si) thin film transistor (TFT) crystallized by excimer laser annealing (ELA) method were evaluated, The polycrystalline silicon thin-film transistor (poly-Si TFT) has higher electric field-effect-mobility and larger drivability than the amorphous silicon TFT. However, to poly-Si TFT's using conventional processes, the temperature must be very high. For this reason, an amorphous silicon film on a buried oxide was crystallized by annealing with a KrF excimer laser (248 nm)to fabricate a poly-Si film at low temperature. Then, High permittivity $HfO_2$ of 20 nm as the gate-insulator was deposited by atomic layer deposition (ALD) to low temperature process. In addition, the solid phase crystallization (SPC) was compared to the ELA method as a crystallization technique of amorphous-silicon film. As a result, the crystallinity and surface roughness of poly-Si crystallized by ELA method was superior to the SPC method. Also, we obtained excellent device characteristics from the Poly-Si TFT fabricated by the ELA crystallization method.

• Journal of Information Display
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• v.11 no.1
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• pp.12-16
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• 2010

The effect of the crystallization and activated annealing of Si films using an excimer laser and the new CW blue laser are described and compared with furnace annealing for application in advanced TFTs and for future applications. Pulsed excimer laser annealing (ELA) is currently being used extensively as a low-temperature poly-silicon (LTPS) process on glass substrates as its efficiency is high in the ultra-violet (UV) region for thin Si films with thickness of 40-60 nm. ELA enables extremely low resistivity relating to high crystallinity for both the n- and p-type Si films. On the other hand, CW blue laser diode annealing (BLDA) enables the smooth Si surface to have arbitral crystal grains from micro-grains to an anisotropic huge grain structure only by controlling its power density. Both annealing techniques are expected to be applied in the future advanced TFT systems.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.05a
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• pp.173-176
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• 2004

In this study we investigated post ELA(Excimer Laser Annealing) effect on SMC (Silicide Mediated Crystalization) poly-Si (Polycrystalline Silicon) to improve the characteristics of poly-Si. Combining SMC and XeCl ELA were used to crystallize the a-Si (amorphous Silicon) at various ELA energy density for LTPS (Low Temperature Polycrystalline Silicon). We fabricated the conventional SMC poly-Si with no SPC (Solid Phase Crystallization) phase using UV heating method[1] and irradiated excimer laser on SMC poly-Si, so called SMC-ELA poly-Si. After using post ELA we can get better surface morphology than conventional ELA poly-Si and enhance characteristics of SMC poly-Si. We also observed the threshold energy density regime in SMC-ELA poly-Si like conventional ELA poly-Si.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.06a
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• pp.129-130
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• 2008

Polycrystalline silicon (poly-Si) Schottky barrier thin film transistors (SB-TFT) are fabricated by erbium silicided source/drain for n-type SB-TFT. High quality poly-Si film were obtained by crystallizing the amorphous Si film with excimer laser annealing (ELA) or solid phase crystallization (SPC) method. The fabricated poly-Si SB-TFTs have a large on/off current ratio with a low leakage current. Moreover, the electrical characteristics of poly-Si SB TFTs are significantly improved by the additional forming gas annealing in 2 % $H_2/N_2$, because the interface trap states at the poly-Si grain boundaries and at the gate oxide/poly-Si channel decreased.

• Journal of Information Display
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• v.4 no.4
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• pp.1-3
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• 2003

For excimer laser annealing (ELA), energy density, number of pulses, beam uniformity, and condition of initial amorphous Si (a-Si) films are significant factors contributing to the final microstructure and the performance of low-temperature polycrystalline Si (LTPS) TFTs. Although the process and equipment have been significantly improved, the environmental factors associated with initial amorphous Si (a-Si) films and process conditions are yet to be optimized.

• 한국정보디스플레이학회:학술대회논문집
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• 2009.10a
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• pp.254-257
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• 2009

The crystallization and activated annealing effect of Si films using an excimer laser and a new CW blue laser are described comparing with furnace annealing (SPC) for the application of advanced TFTs and future applications. Currently, pulsed ELA is used extensively as a LTPS process on glass substrates as the efficiency is high in UV region for thin Si film of 40- 60 nm thickness. ELA enables extremely low resistivity for both n- and p-typed Si films. On the other hand, CW BLDA enables the smooth Si surface having arbitral grains from micro-grains to anisotropic huge grain structure only controlling its power density.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.06a
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• pp.19-19
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• 2007

Excimer laser annealing (ELA) 방법을 이용하여 결정화하고 게이트 절연체로써 high-k 물질을 가지는 다결정 실리콘박막 트랜지스터의 전기적 특성을 평가하였다. 다결정 실리콘 박막 트랜지스터는 비결정질 실리콘 박막 트랜지스터 보다 높은 전계 효과 이동도와 운전 용이한 장점을 가진다. 기존의 결정화 방법으로는 다결정 실리콘 박막 트랜지스터의 높은 열 공급을 피할 수 없기 때문에, 매몰 산화막 위의 비결정질 박막은 저온에서 다결정 실리콘 결정화를 위해 KrF excimer laser (248nm)를 이용하여 가열 냉각 공정을 했다. 게다가 케이트 절연체로써 atomic layer deposition (ALD) 방법에 의해 저온에서 20 nm의 고 유전율을 가지는 $HfO_2$ 박막을 증착하였다. 알루미늄은 n-MOS 박막 트랜지스터의 게이트 전극으로 사용되었다. 금속 케이트 전극을 사용하여 게이트 공핍 효과와 관계되는 케이트 절연막 두께의 증가를 예방할 수 있고, 게이트 저항의 감소에 의해 소자 속도를 증가 시킬 수 있다. 추가적으로, 비결정질 실리콘 박막의 결정화 기술로써 사용된 ELA 방법은 SPC (solid phase crystallization) 방법과 SLS (sequential lateral solidification) 방법에 의해 비교되었다. 결과적으로, ELA 방법에 의해 결정화된 다결정 실리콘 박막의 결정도와 표면 거칠기는 SPC와 SLS 방법에 비해 개선되었다. 또한, 우리는 ELA 결정화 방법에 의한 다결정 실리콘 박막 트랜지스터로부터 우수한 소자 특성을 얻었다.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2001.07a
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• pp.562-565
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• 2001

In this paper, novel device structures in order to realize ultra fast and ultra small silicon devices are investigated using ultra-high vacuum chemical vapor deposition(UHVCVD) and Excimer Laser Annealing (ELA). Based on these fundamental technologies for the deep sub-micron device, high speed and low power devices can be fabricated. These junction formation technologies based on damage-free process for replacing of low energy ion implantation involve solid phase diffusion and vapor phase diffusion. As a result, ultra shallow junction depths by ELA are analyzed to 10~20nm for arsenic dosage(2${\times}$10$\_$14//$\textrm{cm}^2$), exciter laser source(λ=248nm) is KrF, and sheet resistances are measured to 1k$\Omega$/$\square$ at junction depth of 15nm and realized sub-50nm n-MOSFET.

• Proceedings of the KIEE Conference
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• 2002.11a
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• pp.130-133
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• 2002

엑시머 레이저를 이용한 저온($450^{\circ}C$ 이하) 다결정 실리콘 박막 트랜지스터 제작 시, 소오스/드레인 이온 주입에 의한 실리콘 박막의 격자 손상은 엑시머 레이저 어닐링(Excimer Laser Annealing; ELA) 방법으로 치유한다. 그러나 게이트 전극 모서리에서의 레이저광 회절 현상으로 인해 소오스/드레인 접합부에 도달하는 레이저 에너지 밀도가 감소하여 다량의 결정 결함이 치유되지 못한 채 남게 된다. 이러한 결정 결함은 박막 트랜지스터의 전계 효과 이동도를 저하시키는 요인이 된다. 새롭게 제안한 사선 입사 엑시머 레이저 어닐링(Oblique Incidence Excimer Laser Annealing; OI-ELA) 방법으로 소오스/드레인 접합부의 결정 결함을 제거하고 다결정 박막 트랜지스터의 특성을 향상시켰다.

• Journal of the Korean Vacuum Society
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• v.10 no.1
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• pp.72-80
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• 2001

In this paper, we present a systematic method of extracting the input parameters of poly-Si TFT(Thin-Film Transistor) for Spice simulations. This method has been applied to two different types of poly-Si TFTs such as ELA (Excimer Laser Annealing) and SMC (Silicide Mediated Crystallization) with good fitting results to experimental data. Among the Spice circuit simulators, the PSpice has the GUI(graphic user interface) feature making the composition of complicated circuits easier. We added successfully the poly-Si TFT model of AIM-Spice to the PSpice simulator, and analyzed easily to compare the electrical characteristics of pixels without or with the line RC delay. In the comparative results, the ELA poly-Si TFT is superior to the SMC poly-Si TFT in the charging time and the kickback voltage for the TFT-LCD (Thin Film Transistor-Liquid Crystal Display).