• Title/Summary/Keyword: DC Level Shifter

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Design of DC Level Shifter for Daisy Chain Interface (Daisy Chain Interface를 위한 DC Level Shifter 설계)

  • Yeo, Sung-Dae;Cho, Tae-Il;Cho, Seung-Il;Kim, Seong-Kweon
    • The Journal of the Korea institute of electronic communication sciences
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    • v.11 no.5
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    • pp.479-484
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    • 2016
  • In this paper, a design of DC level shifter transmitting and receiving control and data signal which have various DC level through daisy chain interface between master IC and slave is introduced in the cell voltage monitoring (CVM). Circuit designed with a latch structure have a function to operate in high speed and for output of variable DC level through transmission gate. As a result of the simulation and the measurement, it was confirmed that control and data signal could be transferred according to the change of DC level from 0V to 30V. Delay time was measured about 170ns. but, it was considered as a negligible tolerance due to a parasitic capacitance of measuring probe and test board.

An Efficient High Voltage Level Shifter using Coupling Capacitor for a High Side Buck Converter

  • Seong, Kwang-Su
    • Journal of Electrical Engineering and Technology
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    • v.11 no.1
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    • pp.125-134
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    • 2016
  • We propose an efficient high voltage level shifter for a high side Buck converter driving a light-emitting diode (LED) lamp. The proposed circuit is comprised of a low voltage pulse width modulation (PWM) signal driver, a coupling capacitor, a resistor, and a diode. The proposed method uses a property of a PWM signal. The property is that the signal repeatedly transits between a low and high level at a certain frequency. A low voltage PWM signal is boosted to a high voltage PWM signal through a coupling capacitor using the property of the PWM signal, and the boosted high voltage PWM signal drives a p-channel metal oxide semiconductor (PMOS) transistor on the high side Buck converter. Experimental results show that the proposed level shifter boosts a low voltage (0 to 20 V) PWM signal at 125 kHz to a high voltage (370 to 380 V) PWM signal with a duty ratio of up to 0.9941.

A Design of High-Speed Level-Shifter using Reduced Swing and Low-Vt High-Voltage Devices (Reduced Swing 방식과 Low-Vt 고전압 소자를 이용한 고속 레벨시프터 설계)

  • Seo, Hae-Jun;Kim, Young-Woon;Ryu, Gi-Ju;Ahn, Jong-Bok;Cho, Tae-Won
    • Proceedings of the IEEK Conference
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    • 2008.06a
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    • pp.525-526
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    • 2008
  • This paper proposes a new high-speed level shifter using a special high voltage device with low threshold voltage. Also, novel low voltage swing method is proposed. The high voltage device is a standard LDMOS(Laterally Diffused MOS) device in a $0.18{\mu}m$ CMOS process without adding extra mask or process step to realize it. A level shifter uses 5V LDMOSs as voltage clamps to protect 1.8V NMOS switches from high voltage stress the gate oxide. Also, level-up transition from 1.8V to 5V takes only 1.5ns in time. These circuits do not consume static DC power, therefore they are very suitable for low-power and high-speed interfaces in the deep sub-quarter-micron CMOS technologies.

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Four Channel Step Up DC-DC Converter for Capacitive SP4T RF MEMS Switch Application (정전 용량형 SP4T RF MEMS 스위치 구동용 4채널 승압 DC-DC 컨버터)

  • Jang, Yeon-Su;Kim, Hyeon-Cheol;Kim, Su-Hwan;Chun, Kuk-Jin
    • Journal of the Institute of Electronics Engineers of Korea SD
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    • v.46 no.2
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    • pp.93-100
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    • 2009
  • This paper presents a step up four channel DC-DC converter using charge pump voltage doubler structure. Our goal is to design and implement DC-DC converter for capacitive SP4T RF MEMS switch in front end module in wireless transceiver system. Charge pump structure is small and consume low power 3.3V input voltage is boosted by DC-DC Converter to $11.3{\pm}0.1V$, $12.4{\pm}0.1V$, $14.1{\pm}0.2V$ output voltage With 10MHz switching frequency. By using voltage level shifter structure, output of DC-DC converter is selected by 3.3V four channel selection signals and transferred to capacitive MEMS devices. External passive devices are not used for driving DC-DC converter. The total chip area is $2.8{\times}2.1mm^2$ including pads and the power consumption is 7.52mW, 7.82mW, 8.61mW.

Reliability Evaluation of the WSW Device for Hot-carrier Immunity (핫-캐리어 내성을 갖는 WSW 소자의 신뢰성 평가)

  • 김현호;장인갑
    • Journal of the Korea Society of Computer and Information
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    • v.9 no.1
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    • pp.9-15
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    • 2004
  • New WSW(Wrap Side Wall) is proposed to decrease junction electric field in this paper. WSW process is fabricated after first gate etch, followed NM1 ion implantation and deposition & etch nitride layer. New WSW structure has buffer layer to decrease electric field. Also we compared the hot carrier characteristics of WSW and conventional. Also, we design a test pattern including pulse generator, level shifter and frequency divider, so that we can evaluate AC hot carrier degradation on-chip. It came to light that the universality of the hot carrier degradation between DC and AC stress condition exists, which indicates that the device degradation comes from the same physical mechanism for both AC and DC stress. From this universality, AC lifetime under circuit operation condition can be estimated from DC hot carrier degradation characteristics.

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A Design of Gate Driver Circuits in DMPPT Control for Photovoltaic System (태양광 분산형 최대전력점 추적 제어를 위한 고전압 게이트 드라이버 설계)

  • Kim, Min-Ki;Lim, Shin-Il
    • Journal of Korea Society of Industrial Information Systems
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    • v.19 no.3
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    • pp.25-30
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    • 2014
  • This paper describes the design of gate driver circuits in distributed maximum power point tracking(DMPPT) controller for photovoltaic system. For the effective DMPPT control in the existence of shadowed modules, high voltage gate driver is applied to drive the DC-DC converter in each module. Some analog blocks such as 12-b ADC, PLL, and gate driver are integrated in the SoC for DMPPT. To reduce the power consumption and to avoid the high voltage damage, a short pulse generator is added in the high side level shifter. The circuit was implemented with BCDMOS 0.35um technology and can support the maximum current of 2A and the maximum voltage of 50V.

A C-Band CMOS Bi-Directional T/R Chipset for Phased Array Antenna (위상 배열 안테나를 위한 C-대역 CMOS 양방향 T/R 칩셋)

  • Han, Jang-Hoon;Kim, Jeong-Geun
    • The Journal of Korean Institute of Electromagnetic Engineering and Science
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    • v.28 no.7
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    • pp.571-575
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    • 2017
  • This paper presents a C-band bi-directional T/R chipset in $0.13{\mu}m$ TSMC CMOS technology for phased array antenna. The T/R chipset, which is a key component of phased array antenna, consists of a 6 bit phase shifter, a 6 bit step attenuator, and three bi-directional gain amplifiers. The phase shifter is controlled up to $354^{\circ}$ with $5.625^{\circ}$ phase step for precise beam steering. The step attenuator is also controlled up to 31.5 dB with 0.5 dB attenuation step for the side lobe level rejection. The LDO(Low Drop Output) regulator for stable 1.2 V DC power and the SPI(Serial Peripheral Interface) for digital control are integrated in the chipset. The chip size is $2.5{\times}1.5mm^2$ including pads.

A Design of Full-wave Rectifier for Measurement Instrument (계측기용 새로운 전파정류 회로 설계)

  • Bae Sung-Hoon;Lim Shin-Il
    • Journal of the Institute of Electronics Engineers of Korea SC
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    • v.43 no.4 s.310
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    • pp.53-59
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    • 2006
  • This paper describes the new design technique of full wave rectifier (FWR) for precise measurement instrument and the chip implementation of this FWR circuit with measurement results. Conventional circuits have some problems of complex design and limited output range( $VDD/2{\sim}VLIIV1IT+$). Proposed FWR circuit was simply designed with two 2x1 MUXs, one high speed comparator, and one differential difference amplifier(DDA). One rail-to-rail differential difference amplifier(DDA) performs the DC level shifting to VSS and 2X amplification simultaneously, and enables the full range ($Vss{\sim}VDD$) operation. The proposed FWR circuits shows more than 50% reduction of chip area and power consumption compared to conventional one. Proposed circuit was implemented with 0.35um 1-poly 2-metal CMOS process. Core size is $150um{\times}450um$ and power dissipation is 840uW with 3.3V single supply.

Design and Experiment of Ku_band Linear Active Phased Array Antenna System (Ku 대역 선형 능동 위상 배열 안테나 시스템 설계 및 실험)

  • Ryu Sung-Wook;Eom Soon-Young;Yun Jae-Hoon;Jeon Soon-Ick;Kim Nam
    • The Journal of Korean Institute of Electromagnetic Engineering and Science
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    • v.17 no.7 s.110
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    • pp.694-705
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    • 2006
  • In this paper, the linear active phased array antenna system operated in Ku DBS band was designed and experimented. The antenna system was composed of sixteen radiating active channels and Wilkinson power combiners with 16-channel inputs, a stabilizing DC bias and phase control board. Electrical beams of the antenna system can be formed by controling the phase-states of 3-bit digital phase shifter inside each active channel by virtue of the phase control board. The amplitude and phase deviations measured between active channels were less than ${\pm}0.8dB$ and ${\pm}15^{\circ}$, respectively, and the noise figure of each active channel was measured less than 1.2 dB in the operating band. The measured performances of the overall antenna system showed the antenna gain of more than 23.07 dBi and the sidelobe level of less than -11.17 dBc, and the bore-sight cross-polarization level of less than -12.75 dBc in the operating band. Also, by phase-controlling active channels, the beam scan patterns at $10^{\circ},\;20^{\circ},\;30^{\circ}$ were measured, and the losses caused by the corresponding beam scanning were 1.1 dB, 2.5 dB and 3.6 dB from the measurements, respectively.