• ETRI Journal
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• v.37 no.3
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• pp.584-594
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• 2015

To date, many different kinds of logic styles for hardware countermeasures have been developed; for example, SABL, TDPL, and DyCML. Current mode-based logic styles are useful as they consume less power compared to voltage mode-based logic styles such as SABL and TDPL. Although we developed TPDyCML in 2012 and presented it at the WISA 2012 conference, we have further optimized it in this paper using a binary decision diagram algorithm and confirmed its properties through a practical implementation of the AES S-box. In this paper, we will explain the outcome of HSPICE simulations, which included correlation power attacks, on AES S-boxes configured using a compact NMOS tree constructed from either SABL, CMOS, TDPL, DyCML, or TPDyCML. In addition, to compare the performance of each logic style in greater detail, we will carry out a mutual information analysis (MIA). Our results confirm that our logic style has good properties as a hardware countermeasure and 15% less information leakage than those secure logic styles used in our MIA.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.44 no.9
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• pp.54-58
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• 2007

Development of high performance LTPS TFTs contributed to open up new SOP technology with various digital circuits integrated in display panels. This work introduces the current mode logic(CML) gate design method with which one can replace slow CMOS logic gates. The CML inverter exhibited small logic swing, fast response with high power consumption. But the power consumption became compatible with CMOS gates at higher clock speed. Due to small current values in CML, layout area is smaller than the CMOS counterpart even though CML uses larger number of devices. CML exhibited higher noise immunity thanks to its non-inverting and inverting outputs. Multi-input NAND/AND and NOR/OR gates were implemented by the same circuit architecture with different input confirugation. Same holds for MUX and XNOR/XOR CML gates. We concluded that the CML gates can be designed with few simple circuits and they can improve power consumption, chip area, and speed of operation.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.45 no.8
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• pp.37-43
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• 2008

This paper introduces a high-speed low-power self-timed current-mode logic (STCML) that reduces both dynamic and leakage power dissipation. STCML significantly reduces the leakage portion of the power consumption using a pulse-mode control for shorting the virtual ground node. The proposed logic style also minimizes the dynamic portion of the power consumption due to short-circuit current by employing an enhanced self-timing buffer. Comparison results using a 80-nm CMOS technology show that STCML achieves 26 times reduction on leakage power consumption and 27% reduction on dynamic power consumption as compared to the conventional current-mode logic. They also indicate that up to 59% reduction on leakage power consumption compared to differential cascode voltage switch logic (DCVS).

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.45 no.5
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• pp.58-64
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• 2008

A 6Gbps 1:2 demultiplexer(DEMUX) IC using $0.18{\mu}m$ CMOS was designed and fabricated. For high speed performance current mode logic(CML) flipflop was used and inductive peaking technology was used so as to obtain higher speed than conventional Current mode logic flipflop. On-chip spiral inductor was designed to maximize the inductive peaking effect using stack structure. Total twelve inductors of $100{\mu}m^2$ area increase was used. The measurement was processed on wafer and 1:2 demultiplexer with and without micro stacked spiral inductors were compared. For 6Gbps data rate measurement, eye width was improved 7.27% and Jitter was improved 43% respectively. Power consumption was 76.8mW and eye height was 180mV at 6 Gbps

• JSTS:Journal of Semiconductor Technology and Science
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• v.17 no.3
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• pp.370-377
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• 2017

This paper presents a simple noise margin (NM) model of MOS current mode logic (MCML) gates especially in CMOS processes where a large device mismatch deteriorates logic reliability. Trade-offs between speed and logic reliability are discussed, and a simple yet accurate NM equation to capture process-dependent degradation is proposed. The proposed NM equation is verified for 130-nm, 110-nm, 65-nm, and 40-nm CMOS processes and has errors less than 4% for all cases.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.46 no.10
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• pp.79-85
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• 2009

The design of a 3.2 Gb/s serial link receiver in $0.18{\mu}m$ CMOS process is presented. The major factors limiting the performance of high-speed links are transmission channel bandwidth, timing uncertainty. The design uses a multi-level signaling(4-PAM) to overcome these problems. Moreover, to increase data bit-rate and lower BER, we designed this circuit by using a current mode amplifier, Current-mode Logic(CML) sampling latches. The 4-PAM receiver achieves 3.2 Gb/s and BER is less than $1.0\;{\times}\;10^{-12}$. The $0.5\;{\times}\;0.6\;mm^2$ chip consumes 49 mA at 3.2 Gb/s from a 1.8-V supply.

• Transactions on Electrical and Electronic Materials
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• v.18 no.4
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• pp.185-189
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• 2017

This paper proposes a low power frequency divider for an integrated CMOS phase-locked loop (PLL). An injection-locked frequency divider (ILFD) was designed, along with a current-mode logic (CML) frequency divider in order to obtain a broadband and high-frequency operation. A ring oscillator was designed to operate at 1.2 GHz, and the ILFD was used to divide the frequency of its input signal by two. The structure of the ILFD is similar to that of the ring oscillator in order to ensure the frequency alignment between the oscillator and the ILFD. The CML frequency divider was used as the second stage of the divider. The proposed frequency divider was applied in a conventional PLL design, using a 0.18 ${\mu}m$ CMOS process. Simulation shows that the proposed divide-by-two ILFD and the divide-by-eight CML frequency dividers operated as expected for an input frequency of 1.2 GHz, with a power consumption of 30 mW.

• The Journal of the Korea institute of electronic communication sciences
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• v.14 no.2
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• pp.309-316
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• 2019

In this paper, a low-jitter delay-locked loop that compensates for local clock skew is presented. The proposed DLL consists of a phase splitter, a phase detector(PD), a charge pump, a bias generator, a voltage-controlled delay line(VCDL), and a level converter. The VCDL uses self-biased delay cells using current mode logic(CML) to have insensitive characteristics to temperature and supply noises. The phase splitter generates two reference clocks which are used as the differential inputs of the VCDL. The PD uses the only single clock from the phase splitter because the PD in the proposed circuit uses CMOS logic that consumes less power compared to CML. Therefore, the output of the VCDL is also converted to the rail-to-rail signal by the level converter for the PD as well as the local clock distribution circuit. The proposed circuit has been designed with a $0.13-{\mu}m$ CMOS process. A global CLK with a frequency of 1-GHz is externally applied to the circuit. As a result, after about 19 cycles, the proposed DLL is locked at a point that the control voltage is 597.83mV with the jitter of 1.05ps.

• Journal of the Korean Institute of Telematics and Electronics
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• v.23 no.1
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• pp.42-45
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• 1986

This paper introduces novel functionally integrated logic elements which are conceptuallized for large scale integrated circuits. Efforts are made to minimize the gate size as well as to reduce the operational voltage, without sacrificing the speed performance of the gates. The process used was a rather conventional collector diffusion isolation(CDI) process. New gate structures are formed by merging several transistors of a gate in the silicon substrate. Thested elements are CML(Current Mode Logic) and EECL (Emitter-to-Emitter Coupled Logic)gates. The obtained experimental results are power-delay product of 6~11pJ and delay time/gate of 1.6~1.8 ns, confirming the possibility of these novel gate structures as a VLSI-candidate.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.20 no.10
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• pp.1107-1113
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• 2009

In this paper, the design and implementation of K-Band frequency dividers using 130 nm CMOS process are presented. A Miller frequency divider is presented, which realizes a division range from 20 to 25 GHz with 7.2 mW power consumption from 1.2 V supply. The layout size of the core circuit is about $315{\times}246\;um^2$. In addition, a CML frequency divider which divides the output signal of the Miller frequency divider is also presented, which realizes a division range from 8.5 to 13 GHz with 5.7 mW power consumption. The layout size of the CML core is about $91{\times}98\;um^2$. Cascading the Miller and CML frequency dividers, we confirmed the divide-by-4 operation for the input signal from 20 to 25 GHz.