• Journal of the Korean Crystal Growth and Crystal Technology
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• 제28권3호
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• pp.130-134
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• 2018

In the past few years, various solder compositions have been a representative material to electronic packages and surface mount technology industries as a replacement of Pb-base solder alloy. Therefore, extensive studies on process and/or reliability related with the low Ag composition have been reported because of recent rapid rise in Ag price. In this study, Sn-3.0Ag-0.5Cu, Sn-0.7Cu and Sn-0.3Ag-0.5Cu solder bar samples were fabricated by melting of Sn, Ag and Cu metal powders. Crystal structure and element concentration were analyzed by XRD, XRF, optical microscope, FE-SEM and EDS. The fabricated solder samples were composed of ${\beta}-Sn$, ${\varepsilon}-Ag_3Sn$ and ${\eta}-Cu_6Sn_5$ phases.

• Journal of the Korean Ceramic Society
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• 제36권8호
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• pp.835-842
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• 1999

Si3N4 -Si3N4 joints were made using Ag-Cu-Ti and Ag-Cu-In-Ti via brazing method and the change in joint strength was investigated after heat treatment at $400^{\circ}C$ or $650^{\circ}C$ for up to 2000h. The initial strength of as-brazed joints with Ag-Cu-In-Ti was lower but the reduction of the strength was less dramatic than that with Ag-Cu-Ti. The joints made of a new brazing alloy Au-Ni-Cr-Mo-Fe which is developed for high temperature applications were heat-treated at $650^{\circ}C$ for 1000h. As the heat treatment time increased the bond strength increased. The results of the joining system with Mo or Cu interlayer showed that the strength of the joint with Mo interlayer was higher but the system incurred problems in joint production Also it was found from oxidation experiment that Ti and In affected the oxidation resistance of brazing alloy.

• Korean Journal of Materials Research
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• 제13권9호
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• pp.555-560
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• 2003

Ag-coated Cu particles were prepared by dropping method of coating agent and were evaluated by scanning electron microscope and color difference meter. The shape of Cu particles having obvious crystal plan and edge was changed spherically according to the increase of Ag coating amount. When the Ag coating amount was 50 wt% to Cu particles, the whiteness of Ag-coated Cu particles was almost similar to that of pure Ag particles. Adding $NH_4$OH in reductant solution could increase effectively the whiteness of the Ag-coated particles. The Ag-coated particles having the highest whiteness was obtained when the content of hydrazine in reductant solution was 0.48 M.

• Journal of the Microelectronics and Packaging Society
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• 제9권2호
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• pp.39-43
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• 2002

The eutectic solder Sn-37Pb and the lead free solder alloys with the compositions of Sn-0.7Cu, Sn-3.5Ag, Sn-3.5Ag-0.75Cu, Sn-2.0Ag-0.7Cu-3.0Bi were applied to the 48 BGA packages, and then it was discussed for the shear strength at the solder joints as the hardness and the composition of the small solder ball. As a result of experiments, the high degree of hardness with the displacement of 0.043 mm was obtained in Sn-2.0Ag-0.7Cu-3.0Bi. The shear strength of the lead free solder was higher than that of Sn-37Pb solder, and it can be obtained the maximum value of about 52% in Sn-2.0Ag-0.7Cu-3.0Bi.

• Transactions of Materials Processing
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• 제7권5호
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• pp.465-473
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• 1998

The effect of alloying elements of Ag-Cu-Zr-X brazing alloy on the microstructure and the bond strength of $Al_2O_3/Ni-Cr$ brazed steel joint was investigated. The reaction layer, $ZrO_2$ (a=5.146 ${\AA}$ , b=5.213 ${\AA}$ , c=5.311 ${\AA}$ )was formed at the interface of $Al_2O_3/Ni-Cr$ steel joint by the redox reaction between alumina and Zr. The addition of An and Al to the Ag-Cu-Zr brazing alloy gave rise to changes in the thickness of the reaction product layer and the morphology of the brazement. Sn caused the segregation of Zr was decreased b Al the $ZrO_2$ layer formed at the Ag-Cu-Zr-Al alloy was thinner than that of $ZrO_2$ formed at the Ag-Cu-Zr-An alloy. The fracture shear strength was strongly dependent on the microstructure of the brazement. Brazing with Ag-Cu-Zr-Sn alloy resulted in a better bond strength than with Ag-Cu-Zr or Ag-Cu-Zr-Al alloy.

• Korean Journal of Materials Research
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• 제24권11호
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• pp.617-624
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• 2014

To elucidate the effects of a pretreatment process on the uniformity of Ag electroless plating on Cu flakes, pretreatment time was mainly considered with a mixed solution of 0.15 M ammonium hydroxide and 0.0375 M ammonium sulphate. Optical inspection of Ag-coated Cu flakes determined that the optimal pretreatment time is 120 s. Repetition of the sequence in which Ag plating was done immediately after the pretreatment of 120 s clearly enhanced the plating uniformity. Scanning electron microscopy revealed that holes were formed irregularly on some Cu flakes during the period from the asdropping of an Ag precursor solution to 5 min. The hole formation was judged to be due to continuous removal of Cu on the local surfaces by the repetitive formation and elimination of $Cu_2O$ or $Cu(OH)_2$ layers. However, the increase of the amount of Ag coating suppressed the hole creation and increasingly enhanced the antioxidant property.

• Journal of the Korean institute of surface engineering
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• 제51권5호
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• pp.263-270
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• 2018

Ag-coated Cu dendrites were prepared as a filler for an electromagnetic interference shielding application. Ag layers on the Cu dendrites was coated by two approaches. One is a direct autocatalytic plating with a reducing agent. The other approach was achieved by two-step plating, a galvanic displacement reaction to form Ag seed layers on Cu following by an autocatalytic plating with a reducing agent. The procedure-dependent average particle size and tap density of Ag-coated Cu dendrites were characterized. The electrical resistance and electromagnetic interference shielding effect (EMI SE) were analyzed with the Ag-coated Cu dendrites prepared in the two approaches. Additionally, the content of the Ag coated on Cu dendrites was controlled from 2% to 20%. The electrical resistance and EMI SE were critically determined by Ag contents coated on Cu.

• Journal of the Microelectronics and Packaging Society
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• 제23권3호
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• pp.51-56
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• 2016

To fabricate a copper (Cu)-based fine conductive filler having antioxidation property, submicron silver (Ag)-coated Cu particles were fabricated and their antioxidation property was evaluated. After synthesizing the Cu particles of $0.705{\mu}m$ in average diameter by a wet-reduction process, Ag-coated Cu particles were fabricated by successive Ag plating using ethylene grycol solvent. Main process parameters in the Ag plating were the concentration of reductant (ascorbic acid), the injection rate of Ag precursor solution, and the stirring rate in mixed solution. Thus, Ag plating characteristics and the formation of separate fine pure Ag phase were observed with different combinations of process parameters. As a result, formation of the separate pure Ag phase and aggregation between Ag-coated Cu particles could be suppressed by optimization of the process parameters. The Ag-coated Cu particles which were fabricated using optimal conditions showed slight aggregation, but excellent antioxidation property. For example, the particles indicated the weight gain not exceeding 0.1% until $225^{\circ}C$ when they were heated in air at the rate of $10^{\circ}C/min$ and no weight gain until 75 min when they were heated in air at $150^{\circ}C$.

• Journal of Welding and Joining
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• 제29권1호
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• pp.41-45
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• 2011

SnAgCu lead-free solder alloy is considered as the best alternative to eutectic tin-lead solder. However, the detailed material properties of SnAgCu solder are not available in public. Hence, this paper presents an estimation of mechanical properties of SnAgCu lead-free solder. In particular, the weight percent of Ag was varied as 1.0wt%, 2.5wt%, 3.0wt%, and 4.5wt% in order to estimate the effect of Ag in the Sn-xAg-0.5Cu ternary alloy system. For this purpose, four types of SnAgCu bars were first molded by casting and then standard specimens were cut out of molded bars. Micro-Vickers hardness, tensile tests were finally performed to estimate the variations in mechanical properties according to the weight percent of Ag. Test results reveal that the higher the weight percent of Ag is, the higher the hardness, yield strength, and ultimate tensile strength become. More material properties will be further investigated in the future work.

• Proceedings of the KWS Conference
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• 대한용접접합학회 2007년 추계학술발표대회 개요집
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• pp.211-214
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• 2007

Sn-0.3Ag-0.7Cu 조성의 젖음 특성과 반응 특성을 Sn-1.0Ag-0.5Cu 및 Sn-3.0Ag-0.5Cu 합금의 결과와 비교, 분석하였다. 또한 Sn-0.3Ag-0.7Cu 조성의 용융 및 응고 특성을 DSC로 측정하고, 인장시험을 통한 stress-strain curve를 관찰하였다. 아울러 할로겐 함유량이 많은 플럭스를 사용하여 Sn-0.3Ag-0.7Cu 조성의 젖음 특성을 향상 시킬 수 있는지를 조사하였으며, Sn-0.3Ag-0.7Cu 조성에 미량의 In을 첨가하여 젖음 특성의 개선 정도를 분석하였다. 그 결과 할로겐 함유량이 높은 플럭스를 사용한 경우보다 미량의 In을 첨가한 경우에서 wettability의 향상을 보다 효과적으로 유도할 수 있음을 관찰할 수 있었다.