Journal of the Korean Crystal Growth and Crystal Technology (한국결정성장학회지)

The Korea Association of Crystal Growth (한국결정성장학회)
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Fabrication and characterization of Sn-3.0Ag-0.5Cu, Sn-0.7Cu and Sn-0.3Ag-0.5Cu alloys

Sn-3.0Ag-0.5Cu, Sn-0.7Cu 및 Sn-0.3Ag-0.5Cu 합금의 제조 및 특성평가

  • Lee, Jung-Il (Department of Materials Science and Engineering, Korea National University of Transportation) ;
  • Paeng, Jong Min (Department of Materials Science and Engineering, Korea National University of Transportation) ;
  • Cho, Hyun Su (Department of Materials Science and Engineering, Korea National University of Transportation) ;
  • Yang, Su Min (Department of Materials Science and Engineering, Korea National University of Transportation) ;
  • Ryu, Jeong Ho (Department of Materials Science and Engineering, Korea National University of Transportation)
  • 이정일 (한국교통대학교 신소재공학전공) ;
  • 팽종민 (한국교통대학교 신소재공학전공) ;
  • 조현수 (한국교통대학교 신소재공학전공) ;
  • 양수민 (한국교통대학교 신소재공학전공) ;
  • 류정호 (한국교통대학교 신소재공학전공)
  • Received : 2018.06.05
  • Accepted : 2018.06.18
  • Published : 2018.06.30
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Abstract

In the past few years, various solder compositions have been a representative material to electronic packages and surface mount technology industries as a replacement of Pb-base solder alloy. Therefore, extensive studies on process and/or reliability related with the low Ag composition have been reported because of recent rapid rise in Ag price. In this study, Sn-3.0Ag-0.5Cu, Sn-0.7Cu and Sn-0.3Ag-0.5Cu solder bar samples were fabricated by melting of Sn, Ag and Cu metal powders. Crystal structure and element concentration were analyzed by XRD, XRF, optical microscope, FE-SEM and EDS. The fabricated solder samples were composed of ${\beta}-Sn$, ${\varepsilon}-Ag_3Sn$ and ${\eta}-Cu_6Sn_5$ phases.

솔더(solder) 재료는 수 천년 이상 인류 문명과 함께해온 대표적인 금속 합금으로서 현재까지도 전자 패키징(electronic packaging) 및 표면 실장(SMT, surface mount technology) 분야의 핵심 소재로 사용되고 있다 그러나 최근 Ag 가격의 급격한 상승과 전자산업의 저가격화 전략으로 인해 솔더 재료에서의 Ag 함량의 감소가 지속적으로 요구되고 있다. 본 연구에서는 Sn-3.0Ag-0.5Cu, Sn-0.7Cu 및 Sn-0.3Ag-0.5Cu(weight%) 조성의 무연납 솔더바 샘플을 주조법으로 합금화 하였다. 제조한 Sn-3.0Ag-0.5Cu, Sn-0.7Cu 및 Sn-0.3Ag-0.5Cu 샘플에 대한 결정구조, 화학조성 및 미세구조를 XRD, XRF, 광학현미경, FE-SEM 및 EDS 분석을 이용하여 조사하였다. 분석결과, 제조된 샘플은 ${\beta}-Sn$, ${\varepsilon}-Ag_3Sn$ 및 ${\eta}-Cu_6Sn_5$ 결정으로 구성되어 있었을 확인할 수 있었다.

Keywords

References

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