Fig. 1. Ag-coated Cu dendritic powder synthesis and paste manufacturing process.
Fig. 2. Particle size distribution and tap density according to the synthesis process of Ag-coated Cu dendritic powders: (a) direct plating, (b) 2-step plating (pH 4), (c) 2-step plating (pH 1) and (d) comparison of particle size distribution and tap density according to synthesis process.
Fig. 3. Ag-coated Cu dendritic powders by 2-step electroless plating (pH 1): (a) low magnification SEM image, (b) high magnification SEM image, (c) Cu EDAX mapping, (d) Ag EDAX mapping.
Fig. 5. EMI SE properties at 1 GHz and resistance according to Ag content of Ag-coated Cu dendritic powders.
Fig. 4. (a) sample prepared for the evaluation of electromagnetic shielding properties, and (b) EMI SE properties at 1 GHz and resistance of Ag-coated Cu dendritic powders according to synthesis process
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