Journal of the Microelectronics and Packaging Society (마이크로전자및패키징학회지)
- Volume 9 Issue 2
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- Pages.39-43
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- 2002
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- 1226-9360(pISSN)
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- 2287-7525(eISSN)
A Study on the Process Condition Optimization and Shear Strength of Lead Free Solder Ball
무연 솔더 볼의 전단강도와 공정조건 최적화에 관한 연구
Abstract
The eutectic solder Sn-37Pb and the lead free solder alloys with the compositions of Sn-0.7Cu, Sn-3.5Ag, Sn-3.5Ag-0.75Cu, Sn-2.0Ag-0.7Cu-3.0Bi were applied to the 48 BGA packages, and then it was discussed for the shear strength at the solder joints as the hardness and the composition of the small solder ball. As a result of experiments, the high degree of hardness with the displacement of 0.043 mm was obtained in Sn-2.0Ag-0.7Cu-3.0Bi. The shear strength of the lead free solder was higher than that of Sn-37Pb solder, and it can be obtained the maximum value of about 52% in Sn-2.0Ag-0.7Cu-3.0Bi.
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