• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1994.11a
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• pp.164-167
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• 1994

In this Study, we design the process of 0.1$\mu\textrm{m}$ gate length CMOS that is immunized against Latch-up, and investigate the characteristic of Latch-up of this device by the design rule of layout. Using TSUPREM4 and MEDICI, we design the device and simulate the variable characteristics of it we could understand that the characteristic of Latch-up is changed for the better by varying the critical factor of it. We also investigate the structure of CMOS that can be immunized against Latch-up.

• Journal of electromagnetic engineering and science
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• v.9 no.1
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• pp.32-37
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• 2009

Various Class-E CMOS power amplifiers for GSM applications are presented. A stage-convertible transformer for a dual mode power amplifier is proposed to increase efficiency in the low-output power region. An integrated passive device(IPD) process is used to reduce combiner losses. A split secondary 1:2 transformer with IPD process is designed to obtain efficient and symmetric power combining. A quasi-four-pair structure of CMOS PA is also proposed to overcome the complexities of power combining.

• Journal of the Korean Institute of Telematics and Electronics B
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• v.33B no.9
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• pp.107-116
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• 1996

In the stochastic structure for doing exact calculationk, an input number must be changed to a pulse stream. Because the performance of random number generator (RNG) is controlled by its initial condition, we suggested newly modified cellular automata (MCA) which is uses a counter for boundary condition. We compared newly suggested MCA RNG to previously reported RNGs using the AND gate passing outputs which have the same meaning of multiplication in the stochastic calculation. In order to use stochastic we studied about the method, one large RNG can generate many small random numbers. In this method, RNG must have large drive capabilities for many input comparator. So we studied about drive capabilities using BiCMOS circuit and CMOS circit by SPICE.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.13 no.2
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• pp.106-113
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• 2000

This study describes how a properly calibrated simulation method could be used to investigate the latchup immunity characteristics among the various high energy ion implanted CMOS twin well (retro-grade/BILLI/BL) structures. To obtain the accurate quantitative simulation analysis of retrograde well, a global tuning procedure and a set of grid specifications for simulation accuracy and computational efficiency are carried out. The latchup characteristics of BILLI and BL structures are well predicted by applying a calibrated simulation method for retrograde well. By exploring the potential contour, current flow lines, and electron/hole current densities at the holding condition, we have observed that the holding voltage of BL structure is more sensitive to the well design rule (p+to well edge space /n +to well edge space) than to the retrograde well itself.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.13 no.9
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• pp.729-734
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• 2000

Recently, Very Large Scale Integrated (VLSI) circuit & deep-submicron bulk Complementary Metal Oxide Semiconductor(CMOS) devices require gate electrode materials such as metal-silicide, Titanium-silicide for gate oxides. Many previous authors have researched the improvement sub-micron gate oxide quality. However, few have reported on the electrical quality and reliability on the ultra thin gate oxide. In this paper, at first, I recommand a novel shallow trench isolation structure to suppress the corner metal-oxide semiconductor field-effect transistor(MOSFET) inherent to shallow trench isolation for sub 0.1${\mu}{\textrm}{m}$ gate oxide. Different from using normal LOCOS technology deep-submicron CMOS devices using novel Shallow Trench Isolation(STI) technology have a unique"inverse narrow-channel effects"-when the channel width of the devices is scaled down, their threshold voltage is shrunk instead of increased as for the contribution of the channel edge current to the total channel current as the channel width is reduced. Secondly, Titanium silicide process clarified that fluorine contamination caused by the gate sidewall etching inhibits the silicidation reaction and accelerates agglomeration. To overcome these problems, a novel Two-step Deposited silicide(TDS) process has been developed. The key point of this process is the deposition and subsequent removal of titanium before silicidation. Based on the research, It is found that novel STI structure by the SEM, in addition to thermally stable silicide process was achieved. We also obtained the decrease threshold voltage value of the channel edge. resulting in the better improvement of the narrow channel effect. low sheet resistance and stress, and high threshold voltage. Besides, sheet resistance and stress value, rms(root mean square) by AFM were observed. On the electrical characteristics, low leakage current and trap density at the Si/SiO$_2$were confirmed by the high threshold voltage sub 0.1${\mu}{\textrm}{m}$ gate oxide.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.29 no.11
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• pp.834-841
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• 2018

A power amplifier for subgigahertz short-range wireless communication using $0.18-{\mu}m$ CMOS technology is presented. It is designed as a differential structure to form easily a virtual ground node, to increase output power, and to design a cascode structure to prevent breakdown. The transistor gate width was determined to maximize the output power and power-added efficiency(PAE), and the balun was optimized through electromagnetic simulation to minimize the loss caused by the matching network. This power amplifier had a gain of more than 49.5 dB, a saturation power of 26.7 dBm, a peak PAE of 20.7 % in the frequency range of 860 to 960 MHz, and a chip size of $2.14mm^2$.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.37 no.1
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• pp.83-91
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• 2000

This paper presents a new technique to reduce a large interconnect circuit with tens of thousands of elements into the one that is small enough to be analyzed by circuit simulators such as SPICE. This technique takes a fundamentally different approach form the conventional methods based on the interconnect circuit structure analysis and several rules based on the Elmore time constant. The time moments are computed form the circuit consisting of the interconnect circuit and the CMOS gate driver model computed by the AWE technique. Then, the equivalent RC circuit is synthesized from those moments. The characteristics of the driving CMOS gate can be reflected with the high degree of accuracy and the size of the compressed circuit is determined by the number of output nodes regardless of the size of the original interconnect circuits. This technique has been implemented in C language, applied to several interconnect circuits driven by a 0.5${\mu}m$ CMOS gate and the equivalent RC circuits with more than 99% reduction ratio and accuracy with 1 ~ 10% error in therms of propagation delays were obtained.

• ETRI Journal
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• v.29 no.1
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• pp.59-69
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• 2007

We designed and fabricated a vision chip for edge detection with a $160{\times}120$ pixel array by using 0.35 ${\mu}m$ standard complementary metal-oxide-semiconductor (CMOS) technology. The designed vision chip is based on a retinal structure with a resistive network to improve the speed of operation. To improve the quality of final edge images, we applied a saturating resistive circuit to the resistive network. The light-adaptation mechanism of the edge detection circuit was quantitatively analyzed using a simple model of the saturating resistive element. To verify improvement, we compared the simulation results of the proposed circuit to the results of previous circuits.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2002.05a
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• pp.261-263
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• 2002

CMOS devices have scaled down to sub-50nm gate to achieve high performance and high integration density. Key challenges with the device scaling are non-scalable threshold voltage( $V^{th}$ ), high electric field, parasitic source/drain resistance, and $V^{th}$ variation by random dopant distribution. To solve scale-down problem of conventional structure, a new structure was proposed. In this paper, we have investigated double-gate MOSFET structure, which has the main-gate and the side-gates, to solve these problem.

• 전자공학회논문지 IE
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• v.46 no.4
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• pp.8-15
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• 2009

In this paper, we are indicated CMOS Image sensor circuit SPICE analysis for the Photo Diode and pixel Modeling. We get a characteristic of the photoelectric current using a device simulator Medici and develop the Photodiode model for applying a SPICE simulation. For verifying the result, We compared the result of SPICE simulation with the result of mixed mode simulation about the testing circuit structure consisted photodiode and NMOS.