• Journal of the Korean Institute of Telematics and Electronics
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• v.27 no.11
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• pp.126-134
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• 1990

In order to implement high-speed data acquistion system in CMOS VLSI technology, means must be found to overcome the relatively low transconductance and large device mismatch characteristic of MOS device. Because of these device limitations, circuit design approaches tradition-ally used in high-speed bipolar analog-to-digital converter(ADC) are suited to CMOS implementation. Also the design of VLSI CMOS comparator wherein voltage comparision is accomplished by means of a pipelined cascade RSA (Regenerative Sense Amplifier). So, in this paper we designed the A/D converter incorporates the pipelined CMOS comparator.

• Journal of the Korean Institute of Telematics and Electronics
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• v.27 no.3
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• pp.137-144
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• 1990

We describe how single layer perceptrons and new nonsymmetry feedback type neural networks can be implemented by VLSI CMOS technology. The network described provides a flexible tool for evaluation of boolean expressions and arithmetic equations. About 50 CMOS VLSI chips with an architecture based on two neural networks have been designed and me being fabricated by 2-micrometer double metal design rules. These chips have been developed to study the potential of neural network models for the use in character recognition and for a neural compute.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.40 no.12
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• pp.63-71
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• 2003

IDDQ testing is indispensable in improving Duality and reliability of CMOS VLSI circuits. But the major problem of IDDQ testing is slow testing speed due to time-consuming IDDQ current measurement. So one requirement is to reduce the number of target faults or to make the test sets compact in fault model. In this paper, we consider equivalent fault collapsing for transistor short faults, a fault model often used in IDDQ testing and propose an efficient algorithm for reducing the number of faults that need to be considered by equivalent fault collapsing. Experimental results for ISCAS benchmark circuits show the effectiveness of the proposed method.

• Journal of the Korean Society of Industry Convergence
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• v.5 no.1
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• pp.39-43
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• 2002

In present much CMOS devices used in VLSI circuit and Logic circuit. With increasing a number of device in VLSI, the confidence becomes more serious. This paper describe the mechanism of breakdown on CMOS, especially n-MOS, based on Hydro Dynamic model with device self-heating. Additionally, illustrate the CMOS latch-up characteristics on simplified device structure on this paper.

• Journal of the Korean Institute of Telematics and Electronics A
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• v.30A no.11
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• pp.140-148
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• 1993

High Integration ratio of CMOS circuits incredily increases the test cost during the design and fabrication processes because of the FET fault(Stuck-on faults and Stuck-off faults) which are due to the operational characteristics of CMOS circuits. This paper proposes a test generation algorithm for an arbitrarily large CMOS circuit, which can unify the test steps during the design and fabrication procedure and be applied to both static and dynaic circuits. This algorithm uses the logic equations set for the subroutines resulted from arbitrarily dividing the full circuit hierarchically or horizontally. Also it involves a driving procedure from output stage to input stage, in which to drive a test set corresponding to a subcircuit, only the subcircuits connected to that to be driven are used as the driving resource. With this algorithm the test cost for the large circuit such as VLSI can be reduced very much.

• Proceedings of the IEEK Conference
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• 1998.10a
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• pp.1057-1060
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• 1998

Power Dissipation and circuit speed become the most importance parameters in VLSI system maximum power dissipation for VLSI system design. We remodeled CMOS inverter according to the operating region, saturation region or linear regin, and calculate maximum power dissipation point of CMOS inverter. The result of proposed maximum power dissipation model compared with those from SPICE simulation which results that the proposed maximum power dissipation model has the error rate within 10% to SPICE simulation.

• Journal of the Korean Institute of Telematics and Electronics A
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• v.33A no.3
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• pp.176-186
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• 1996

As the density of VLSI increases, the conventional logic testing is not sufficient to completely detect the new faults generated in design and fabrication processing. Recently, IDDQ testing becomes very attractive since it can overcome the limitations of logic testing. In this paper, G-ATPG (gyeongsang automatic test pattern genrator) is designed which is able to be adapted to IDDQ testing for combinational CMOS VLSI. In G-ATPG, stuck-at, transistor stuck-on, GOS (gate oxide short)or bridging faults which can occur within priitive gate or XOR is modelled to primitive fault patterns and the concept of a fault-sensitizing gate is used to simulate only gates that need to sensitize the faulty gate because IDDQ test does not require the process of fault propagation. Primitive fault patterns are graded to reduce CPU time for the gates in a circuit whenever a test pattern is generated. the simulation results in bench mark circuits show that CPU time and fault coverage are enhanced more than the conventional ATPG using IDDQ test.

• Journal of the Korea Society of Computer and Information
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• v.6 no.1
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• pp.7-13
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• 2001

As the density of VLSI increases, the conventional logic testing is not sufficient to completely detect the new faults generated in design and fabrication processing. Recently. IDDQ testing becomes very attractive since it can overcome the limitations of logic testing. This paper presents a new BIC for the internal current test in CMOS logic circuit. Our circuit is composed of Magnetoresistive current sensor, level shifter, comparator, reference voltage circuit and a circuit be IDDQ tested as a kind of self-testing fashion by using the proposed BIC.

• The Journal of Korean Institute of Communications and Information Sciences
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• v.29 no.10A
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• pp.1205-1214
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• 2004

For tile physical defects occurring in CMOS circuits which are not handled well by voltage-based testing, current testing is remarkable testing technique. Fault models based on defects must accurately describe the behaviour of the circuit containing the defect. In this paper, An efficient collapsing algorithm for fault models often used in current testing is proposed. Experimental results for ISCAS benchmark circuits show the effectiveness of the proposed method in reducing the number of faults that have to be considered by fault collapsing and its usefulness in various current based testing models.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.8 no.7
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• pp.1442-1447
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• 2004

In this paper, a 6-Bit CMOS Folding and Interpolating AD Converter is presented. The converter is considered to be useful as an integrated part of a VLSI circuit handling both analog and digital signals as in the case of HDD or LAN applications. A built-in analog circuit for VLSI of a high-speed data communication requires a small chip area, low power consumption, and fast data processing. The proposed folding and interpolating AD Converter uses a very small number of comparators and interpolation resistors, which is achieved by cascading a couple of folders working in different principles. This reduced number of parts is a big advantage for a built-in AD converter design. The design is based on 0.25m double-poly 2 metal n-well CMOS process. In the simulation, with the applied 2.5V and a sampling frequency of 500MHz, the measurements are as follows: power consumption of 27mw, INL and DNL of $\pm$0.1LSB, $\pm$0.15LSB each, SNDR of 42dB with an input signal of 10MHz.