• The KIPS Transactions:PartD
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• v.13D no.1 s.104
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• pp.51-60
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• 2006

Product Line Engineering(PLE) is an effective software development technique which produces applications using core assets. Because of reusing the core assets, PLE can save cost for developing products in a domain but increase reusability. There are about ten PLE methodologies available, but there are not yet common agreements on PLE process and artifacts. This makes developers harder to choose a methodology and to apply it in practice. A comprehensive technical evaluation and comparison on existing PLE methodologies would be essential for practitioners. In this paper, we present a technical assessment of representative PLE methodologies; FAST, SEI SPL, PuLSE, Bosch's PL proceis, FOPLE, ESAPS, KobrA/PoLITe, Alexandria, COPA, QADA. They are compared in the criteria of process, artifacts, instructions, and special features. And we identify common or variable elements between methodologies and confirm elements to be improved in each PLE methodology. The assessment result would be well utilized in defining a practical methodology for PLE projects and in choosing an appropriate methodology among available ones.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.13 no.12
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• pp.5764-5769
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• 2012

Business relationships can be divided in vertical and horizontal relationships. Vertical relations, such as the relation to suppliers and contractors, are of great importance and often determine a firms success. In general, many scholars produced numerous models of business relationships covering with a wide array of variables. However, models with a focus on vertical relationship did not receive much attention. This paper deals with problems related to vertical relationships and a the business model paying special attention to vertical relationships is developed. Vertical relationships span over a wide range of industries, including industrial electronics and automotive firms. In Chapter 2, the theoretical approach needed to develop a process model to examine the vertical relationships is developed. Chapter 3 features core findings about business relationships. Chapter 4 deals with vertical relationships as developed between the core business process model. Finally, Chapter 5 of the study covers limitations and future research directions.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.67 no.1
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• pp.87-95
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• 2018

The high-precision magnetic levitation transport system is a transport device applying the principle of magnetic levitation. So it is preferable for manufactory process of semiconductor and display industries. In this system, the gap sensors are arranged discontinuously and turned on or off when the tray moves in the running direction. Therefore, precise gap data is important for precise control of the carrier. However, a slight error occurs in the process of installing the gap sensor. So, in this paper, we introduce the high-precision magnetic levitation transport system for OLED evaporation process. Also, we propose a strategy for stable flight control and an offset algorithm for tracking installation errors transport system. The performances of the proposed algorithm are validated through simulation.

• Journal of Environmental Impact Assessment
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• v.2 no.2
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• pp.55-58
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• 1993

After establishing the EIA(Environmental Impact Assessment) act in the Federal Republic of Germany there still remain methodical and substantial deficits. So nearly every environmental impact study went to be a matter of experiments. The requirement for standardization of data sampling and evaluation has permanently been increasing. This is meant to ensure quality standards for the assessment of environmental impacts as well as to maintain reliability required by the projecting company. Such a harmonization is of special importance because of the strongly accelerated expansion of traffic infrastructure caused by the reunification of Germany. That is why the guideline "EIA carried out" for the German Railways company is in process of development This guideline, focussing on practical demands, comprises impacts of railways, adequate sets of indicators, feasible tools for the prognosis and evaluation of environmental reactions. "EIA carried out" will be introduced not only as a manual but also through workshops and pilot studies.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.56 no.12
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• pp.2221-2225
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• 2007

Hollow-type microneedle array can be used for painless, continuous and stable drug delivery through a human skin. The needles must be sharp and have sufficient length in order to penetrate the epidermis. An array of hollow-type silicon microneedles was fabricated by using deep reactive ion etching and HNA wet etching with two oxide masks. Isotropic etching was used to create tapered tips of the needles, and anisotropic etching of Bosch process was used to make the extended length and holes of microneedles. The microneedles were formed by three steps of isotropic, anisotropic, and isotropic etching in order. The holes were made by one anisotropic etching step. The fabricated microneedles have $170{\mu}m$ width, $40{\mu}m$ hole diameter and $230{\mu}m$ length.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.17 no.4
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• pp.448-452
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• 2004

The micromachined variable optical attenuator(VOA) was presented in the paper. The VOA has two single mode fiber(SMF) aligned with free space and symmetric parallel plate actuator with microshutter, which can control a amount of light by driving the actuator. In the paper, analysis on driving performances of the VOA was performed and can be reduced threshold voltage through the decreasing displacement actuating range. This paper presents a VOA that is fabricated using bosch deep silicon etching process with silicon on insulator(SOD wafer. The VOA consists of driving electrode, ground electrode, actuating microshutter, and mechanical stopper. In this VOA, actuating shutter is driven by electrostatic force and the threshold voltage is close to 28V, 46V come along with the spring width of 5${\mu}{\textrm}{m}$, 7${\mu}{\textrm}{m}$ respectively. Attenuation range is measured from 2.4㏈ to 16.7㏈.

• Proceedings of the KIEE Conference
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• 2003.07c
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• pp.1912-1913
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• 2003

This paper presents a variable optical attenuator (VOA) that is fabricated using bosch deep silicon etching process [1] with silicon-on- insulator (SOI) wafer. The VOA consists of driving electrode, ground electrode, actuating mirror, and mechanical slower. In this VOA, actuating mirror is driven by electrostatic force [2] and the pull-in voltage is close to 13V, 28 V, 46V come along with the spring width of $3{\mu}m,\;5{\mu}m,\;7{\mu}m$ respectively.

• Korean Journal of Optics and Photonics
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• v.24 no.4
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• pp.184-188
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• 2013

Two types of polymer-based optical splitters with $200{\mu}m$ large core are presented for optical multimode networks, such as smart home networks, intelligent automotive networks, etc. Optical splitters that have 1:1 symmetric and 9:1 asymmetric structure were fabricated by a ultra violet(UV)-imprint technology using a deep etched Si(silicon) master by the Bosch process. In this paper, we successfully fabricated the symmetric and asymmetric optical splitters with suitable optical network applications.

• Clean Technology
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• v.9 no.3
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• pp.101-105
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• 2003

Plasma etching technology has been developed since it is recognized that silicon etching is very crucial in MEMS(Micro Electro Mechanical System) technology. In this study ICP(Inductive Coupled Plasma) technology was used as a new plasma etching to increase ion density without increasing ion energy, and to maintain the etching directions. This plasma etching can be used for many MEMS applications, but it has been used for PCR(Polymerase Chain Reaction) device fabrication. Platen power, Coil power and process pressure were parameters for observing the etching rate changes. Conclusively Platen power 12W, Coil power 500W, etchng/passivation cycle 6/7sec gives the etching rate of $1.2{\mu}m/min$ and sidewall profile of $90{\pm}0.7^{\circ}$, exclusively. It was concluded from this study that it was possible to minimize the environmental effect by optimizing the etching process using SF6 gas.

• Journal of Advanced Marine Engineering and Technology
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• v.35 no.4
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• pp.460-467
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• 2011

Cavitation phenomena during the spill process of the Bosch type fuel injection pump for medium-speed diesel engine were investigated by optical observations. Typically, these phenomena can cause a surface damage with material removal or round-off at the plunger and barrel port etc., and may shorten their expected life time. The images, which were recorded with high speed CCD camera and borescope, show that the plunger damage is mainly affected by fountain-like cavitation generated before the end of delivery. And the damages of barrel port and deflector are caused by jet-type cavitation generated after end of delivery.