• Title/Summary/Keyword: Board composition

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Bonding Performance of Maltodextrin and Citric Acid for Particleboard Made From Nipa Fronds

  • Santoso, Mahdi;Widyorini, Ragil;Prayitno, Tibertius Agus;Sulistyo, Joko
    • Journal of the Korean Wood Science and Technology
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    • v.45 no.4
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    • pp.432-443
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    • 2017
  • Maltodextrin and citric acid are two types of natural materials with the potential as an eco-friendly binder. Maltodextrin is a natural substance rich in hydroxyl groups and can form hydrogen bonds with lignoselulosic material, while citric acid is a polycarboxylic acid which can form an ester bond with a hydroxyl group at lignoselulosic material. The combination of maltodextrin and citric acid as a natural binder materials supposed to be increase the ester bonds formed within the particleboard. This research determined to investigate the bonding properties of a new adhesive composed of maltodextrin/citric acid for nipa frond particleboard. Maltodextrin and citric acid were dissolved in distillated water at the ratios of 100/0, 87.5/12.5, 75/25 and 0/100, and the concentration of the solution was adjusted to 50% for maltodextrin and 60% citric acid (wt%). This adhesive solution was sprayed onto the particles at 20% resin content based on the weight of oven dried particles. Particleboards with a size of $25{\times}25{\times}1cm$, a target density $800kg/m^3$ were prepared by hot-pressing at press temperatures of $180^{\circ}C$ or $200^{\circ}C$, a press time of 10 minute and board pressure 3.6 MPa. Physical and mechanical properties of particleboard were tested by a standard method (JIS A 5908). The results showed that added citric acid level in maltodextrin/citric acid composition and hot-pressing temperature had affected to the properties of particleboard. The optimum properties of the board were achieved at a pressing temperature of $180^{\circ}C$ and the addition of only 20% citric acid. The results also indicated that the peak intensity of C=O group increased and OH group decreased with the addition of citric acid and an increase in the pressing temperature, suggesting an interreaction between the hydroxyl groups from the lignocellulosic materials and carboxyl groups from citric acid to form the ester groups.

A Preliminary Study of the Application of Prototyping Tools for Design Education Plans; Focusing on Open Source Microcontroller Boards

  • Nam, Wonsuk
    • International Journal of Advanced Culture Technology
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    • v.6 no.2
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    • pp.107-116
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    • 2018
  • In the past, design has been recognized as a means to determine colors, shapes, and functions Recently, however, it has been accepted in a wider sense, namely designing the entire service, including product and user experience design. In this way, in addition to creativity and expressive power that designers have as their main competence, according to the expansion of this design object, designers are required to have comprehensive abilities in related fields and accompanying technical professional abilities. If designing as a technology application as a direction toward this situation, design education can be carried out by approaching technology as a method of expression or design subject. It can also be an effective alternative towards improving the understanding of technology. Meanwhile, many small microcontroller board products with advanced functions and multi-functional specialized programming integrated development environments (IDEs) are becoming widespread due to their open source, low cost, and scalable features. However, students in the design department who lack the basic knowledge of science and engineering have difficulties learning, which requires considerable time and is required for practical use. From this point of view, we have made advancements in the technical understanding of design education by conducting fundamental research to the effectiveness of microcontroller-based prototyping tools as means of expression. We also conducted basic education of microcontroller boards for a certain period of time on students who majored in design in conjunction with the basic survey and investigated the obstacle factors using a questionnaire. Through these surveys, we have confirmed the necessity of designing microcontroller boards of low difficulty, which simplify the coding process that can act as a barrier in difficulty for design students to apply smoothly in design education. In addition, we intend to carry out a basic study on the guideline of microcontroller design for design education and composition of education programs.

Study on the Compositions of Photosensitive Resistor Paste Using Epoxy Acrylate Oligomers and Conductive Carbonblack (에폭시 아크릴레이트 올리고머와 전도성 카본블랙을 이용한 감광성 저항 페이스트 조성 연구)

  • Park, Seong-Dae;Kang, Nam-Kee;Lim, Jin-Kyu;Kim, Dong-Kook
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2008.11a
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    • pp.421-421
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    • 2008
  • Generally, the polymer thick-film resistors for embedded organic or hybrid substrate are patterned by screen printing so that the accuracy of resistor pattern is not good and the tolerance of resistance is too high(${\pm}$20~30%). To reform these demerits, a method using Fodel$^{(R)}$ technology, which is the patterning method using a photosensitive resin to be developable by aqueous alkali-solution as a base polymer for thick-film pastes, was recently incorporated for the patterning of thermosetting thick-film resistor paste. Alkali-solution developable photosensitive resin system has a merit that the precise patterns can be obtained by UV exposure and aqueous development, so the essential point is to get the composition similar to PSR(photo solder resist) used for PCB process. In present research, we made the photopatternable resistor pastes using 8 kinds of epoxy acrylates and a conductive carbonblack (CDX-7055 Ultra), evaluated their developing performance, and then measured the resistance after final curing. To become developable by alkali-solution, epoxy acrylate oligomers with carboxyl group were prepared. Test coupons were fabricated by patterning copper foil on FR-4 CCL board, plating Ni/Au on the patterned copper electrode, applying the resistor paste on the board, exposing the applied paste to UV through Cr mask with resistor patterns, developing the exposed paste with aqueous alkali-solution (1wt% $Na_2CO_3$), drying the patterned paste at $80^{\circ}C$ oven, and then curing it at $200^{\circ}C$ during 1 hour. As a result, some test compositions couldn't be developed according to the kind of oligomer and, in the developed compositions, the measured resistance showed different results depending on the paste compositions though they had the same amount of carbonblack.

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Electroless Plated Copper Thin Film for Metallization on Printed Circuit Board : Neutral Process (인쇄회로기판상의 금속 배선을 위한 구리 도금막 형성 : 무전해 중성공정)

  • Cho, Yang-Rae;Lee, Youn-Seoung;Rha, Sa-Kyun
    • Korean Journal of Materials Research
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    • v.23 no.11
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    • pp.661-665
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    • 2013
  • We investigated the characteristics of electroless plated Cu films on screen printed Ag/Anodized Al substrate. Cu plating was attempted using neutral electroless plating processes to minimize damage of the anodized Al substrate; this method used sodium hypophosphite instead of formaldehyde as a reducing agent. The basic electroless solution consisted of $CuSO_4{\cdot}5H_2O$ as the main metal source, $NaH_2PO_2{\cdot}H_2O$ as the reducing agent, $C_6H_5Na_3O_7{\cdot}2H_2O$ and $NH_4Cl$ as the complex agents, and $NiSO_4{\cdot}6H_2O$ as the catalyser for the oxidation of the reducing agent, dissolved in deionized water. The pH of the Cu plating solutions was adjusted using $NH_4OH$. According to the variation of pH in the range of 6.5~8, the electroless plated Cu films were coated on screen printed Ag pattern/anodized Al/Al at $70^{\circ}C$. We investigated the surface morphology change of the Cu films using FE-SEM (Field Emission Scanning Electron Microscopy). The chemical composition of the Cu film was determined using XPS (X-ray Photoelectron Spectroscopy). The crystal structures of the Cu films were investigated using XRD (X-ray Diffraction). Using electroless plating at pH 7, the structures of the plated Cu-rich films were typical fcc-Cu; however, a slight Ni component was co-deposited. Finally, we found that the formation of Cu film plated selectively on PCB without any lithography is possible using a neutral electroless plating process.

Viscosity Change of Al2O3-SiO2-CaO Slag System with Used Electronic Scrap (산화처리된 PCB 스크랩을 첨가한 Al2O3-SiO2-CaO 3성분계 슬래그의 점도)

  • Kwon, Eui-Hyuk;Han, Sin-Suk;Ji, Jae-Hong;Han, Jeong-Whan;You, Byung-Don;Kim, Byung-Soo;Lee, Jae-Chun
    • Korean Journal of Materials Research
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    • v.13 no.4
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    • pp.239-245
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    • 2003
  • In order to explore the possibility to extract precious metals from PCB(Printed Circuit Board) scrap by gravity separation, a high temperature melting process was adopted, from the recycling view point, to investigate the influence of viscosity on A1$_2$$O_3$-CaO$-SiO_2$ slag system composed of PCB scrap. For optimizing the pre-treatment process of PCB scrap, an experimental condition for the complete calcination and oxidation of organic materials in PCB scrap was established and a quantitative analysis of oxidized PCB scrap was also carrie out. It was found that 6 hours were enough for the complete oxidation of PCB scrap at 1273 K in an atmosphere condition. A slag, l5wt%$A1_2$$O_3$-45wt%CaO-40wt%SiO$_2$, was chosen as a basic slag composition which is determined based on the quantitative analysis of PCB scrap. Viscosities were measured in slag systems both made from pure fluxes and from PCB scrap with additional fluxes. Slag viscosities composed of pure fluxes were measured to be 5.29 poise and 30.52 poise at temperatures of 1773 and 1573 K, whereas that of PCB scrap with additional fluxes were 3.37 poise and 69.89 poise, respectively.

An Research Into The Reactive Safety Action Program for Promoting Aviation Safety Culture

  • Kim, Dae Ho
    • Journal of the Ergonomics Society of Korea
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    • v.35 no.3
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    • pp.165-173
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    • 2016
  • Objective: The objective of this research is to inquire about safety information from the standpoint of its usefulness to suggest the significance of the Reactive Safety Action Program, which serves to promote aviation safety culture. Background: Safety information plays an important role in operating safety programs. Each organization learns lessons from safety information collected from aviation accidents and incidents. When an accident occurs, it is only through safety investigation and a close inquiry on the cause that we can come up with an appropriate countermeasure which would contribute to preventing the recurrence of the same or similar accident. However, the usefulness of safety information produced from unsatisfactory safety investigation is insufficient. Method: This research analyzed the characteristics of aviation accidents, the differences between safety investigations and legal accident investigations in systematic and operative perspectives, and safety culture as a measure to activate reporting systems (compulsory/voluntary). Results: This research defined the investigation scope and processes of safety investigations and legal accident investigations. It also suggested factors such as just culture based on trust, non-punitiveness, confidentiality, the participation of the entire staff through the use of inclusive reporting base, ensuring the independence of the operating organization as a way to promote safety through reporting systems. Conclusion: The organization's effort is the important aspect in obtaining exact and accurate safety information from accidents/incidents. The separate running of SIB (Safety Investigation Board) and AIB (Accident Investigation Board), the systematization of safety information reporting system, and prescribing (legislating) the composition of related organizations are some representative programs. Application: This research inquired experiences that contributed in promoting aviation safety culture in a reactive perspective, and will serve a role in spreading safety culture by enabling the use of application experiences of the aviation field in other domains.

Studies on Linerboard Compositions of Corrugated Fibreboard Containers for Apples (사과 포장용 골판지상자의 재질구성에 관한 연구)

  • Kim, Su-Il;Kim, Jong-Kyong;Ha, Young-Sun
    • KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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    • v.4 no.1
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    • pp.3-10
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    • 1997
  • The purpose of this research was to complete basic study about standardization of corrugated fibreboard containers for apples. Various corrugated fibreboard containers are studied and the results are shown below. 1. WLK, SK, and KA are usually used for outer liner boards, S and $K_2$ are for medium or inner liner boards. 2. According to the study, about twenty different liner compositions are currently used for apple packaging. However, for the containers with white liner board, the liner composition is WLK210/M200/S120/$M200/K_{2}200$, for the containers with colored liner board, SK180/M200/S120/$M200/K_{2}200$ are mostly used. 3. Sixteen percents of cost saving are expected when subsitute white outer liner boards by those of colored.

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Studies on Manufacturing Possibility of Paper Sludge-Cement Boards (II) - Physical and Mechanical Properties and SEM Observation - (제지(製紙) 슬러지-시멘트보드이 제조가능성(製造可能성)에 관(關)한 연구(硏究)(II) - 물리(物理)·기계적(機械的) 성질(性質) 및 SEM 측정(測定) -)

  • Kim, Sa-Ick;Oh, Jung-Soo
    • Journal of the Korean Wood Science and Technology
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    • v.22 no.2
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    • pp.37-45
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    • 1994
  • The possibility of reusing the paper sludge as a raw material of composition board mixed with cement was investigated. For the measurement of physical and mechanical properties, wood coment board and sludge combinend cement boards were fabricated with the three weigh ratios of paper sludge 10 % (SI), 20 % (S II) and 30 % (S III) to cement weight. For adding the cement hardning, $CaCl_2$ was also added to each mixed paste with the ratio of 1 %, 3 % and 5 % to cement weight, respectively. Crystal formation in paper sludge-, wood-cement composites was observed by scanning electron microscope. The results were summarized as follows. 1. Density and partial compressive strength of each specimens were relatively high in the order of sludge I, sludge II, Korean pine, Italian poplar and sludge III, sludge I, Korean pine, sludge II, Italian poplar and sludge III. 2. The mechanical properties of sludge-cement boards (S I and II) were higher than that of wood-cement boards prepared with Korean pine and Italian poplar. But the mechanical properties of wood-cement boards were improved by the adding of $CaCl_2$. 3. Water absorption and thickness swelling were increased with increase of sludge content to cement weight. 4. In SEM observation, sludge-cement composites showed sufficiently formed crystals but wood-cement composites showed poorly formed crystals.

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Melting of PCB scrap for the Extraction of Metallic Components (PCB스크랩으로부터 유가금속성분 회수를 위한 용융처리)

  • Kwon Eui-Hyuk;Jang Sung-Hwan;Han Jeong-Whan;Kim Byung-Su;Jeong Jin-Ki;Lee Jae-Chun
    • Korean Journal of Materials Research
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    • v.15 no.1
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    • pp.31-36
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    • 2005
  • It is well known that PCB (Printed Circuit Board) is a complex mixture of various metals mixed with various types of plastics and ceramics. In this study, high temperature pyre-metallurgical process was investigated to extract valuable metallic components from the PCB scrap. For this purpose, PCB scrap was shredded and oxidized to remove plastic materials, and then, quantitative analyses were made. After the oxidation of the PCB scrap, $30.6wt\%SiO_2,\;19.3wt\%Al_2O_3\;and\;14wt{\%}CaO$ were analyzed as major oxides, and thereafter, a typical composition of $32wt\%SiO_2-20wt\%Al_2O_3-38wt{\%}CaO-10wt\%MgO$ was chosen as a basic slag system for the separation of metallic components. Moreover a size effect of crushed PCB scrap was also investigated. During experiments a high frequency induction furnace was used to melt and separate metallic components. As a result, it was found that the size of oxidized PCB scrap was needed to be less 0.9 m to make a homogeneous liquid slag and to recycle metallic components over $95\%$.

Phase Analysis and Thermodynamic Simulation for Recovery of Copper Metal in Sludge Originated from Printed Circuit Board Manufacturing Process by Pyro-metallurgical Process (인쇄회로기판 제조공정 중 발생한 슬러지 내 건식환원 처리를 통한 구리 회수를 위한 슬러지 분석 및 열역학적 계산)

  • Han, Chulwoong;Kim, Young-Min;Kim, Yong Hwan;Son, Seong Ho;Lee, Man Seung;Lee, Ki Woong
    • Resources Recycling
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    • v.26 no.5
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    • pp.85-96
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    • 2017
  • In this study, we tried to select a slag system capable of pyro-metallurgical process through analysis of sludge generated from PCB plating and etching process solution. Based on this, the possibility of extracting valuable metals in the sludge was studied by experimental and thermodynamic approaches. The sludge was dried at $100{\sim}500^{\circ}C$ and the morphology, chemical composition and phase of the sludge were analyzed. The possibility of pyro-metallurgical process of sludge was investigated through thermodynamic approach using FactSage software.