• Proceedings of the Korean Institute of Building Construction Conference
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• 2023.11a
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• pp.37-38
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• 2023

The purpose of this study is to manufacture mortars incorporating oyster shells and install them in the form of shaped, shaped butt joints, and flat boards to see what difference there is in the back temperature depending on the joint method and the type of installation. Based on the fact that similar backside temperatures were measured regardless of the presence or absence of a joint It is judged that the joint will not affect the backside temperature if it is constructed closely, In the case of ㄱ shaped, it is believed that the backside temperature higher than the backside temperature of the flat board was measured because heat accumulates on the backside during heating.

• Journal of the Microelectronics and Packaging Society
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• v.27 no.1
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• pp.1-7
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• 2020

The backside metallization process is typically used to attach a chip to a lead frame for semiconductor packaging because it has excellent bond-line and good electrical and thermal conduction. In particular, the backside metal with the Ag/Sn/Ag sandwich structure has a low-temperature bonding process and high remelting temperature because the interfacial structure composed of intermetallic compounds with higher melting temperatures than pure metal layers after die attach process. Here, we introduce a die attach process with the Ag/Sn/Ag sandwich structure to apply commercial semiconductor packages. After the die attachment, we investigated the evolution of the interfacial structures and evaluated the shear strength of the Ag/Sn/Ag sandwich structure and compared to those of a commercial backside metal (Au-12Ge).

• Journal of the Korean Society for Precision Engineering
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• v.20 no.1
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• pp.85-90
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• 2003

Removal rate and Within Wafer Non-Uniformity (WIWNU), the most critical issues in Chemical Mechanical Polish (CMP) process, are related to the pressure distribution, wafer shape, slurry flow, mechanical property of pad and etc. Among them, wafer warp generated by other various manufacturing process of wafer may induce the deviation of pressure distribution on the backside of wafer. In the convex shaped wafer the pressure onto the backside of wafer is higher than that of perfectly flat shaped wafer. Besides, such an added pressure is in proportion to the curvature of wafer. That is, the bigger the curvature of wafer becomes the higher the removal rate goes. And the WIWNU is known to be directly related to the pressure distribution on the wafer as well. In other words, the deviation of pressure distribution is in proportion to the WIWNU. In this paper, it is found that the wafer shape may be modified through heating the backside of it and thus properly changed pressure onto the backside of it may improve the WIWNU.

• Proceedings of the KIEE Conference
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• 2011.07a
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• pp.1302-1303
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• 2011

Building-Integrated Photovoltaic System(BIPV) has a muti-functional to generate electrical power and be able to be exterior materials for building. When PV modules are applied as envelope materials for building, the PV modules are considered on characteristics of the thermal effect and performance of PV module to optimize BIPV system synthetically. The purpose of this study is analysis of the changes of temperature and performance on PV modules. after installing four PV modules that have different ventilation type of PV module backside. Measurement results on this experiment is that the ventilation of PV module backside can control elevated module temperature and improve the performance of PV module. So, the technology development on the ventilation of PV module is suggested introducing effective BIPV system.

• Fire Science and Engineering
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• v.33 no.1
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• pp.60-68
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• 2019

The paper reports the characteristics of conduction heat transfer to the backside part according to the heating temperature of a composite wall in a lightweight partition used for indoor space compartments. Stud partitions, SGP partitions, sandwich panels, urethane foam panels, and glass wool panels. which are generally used as light-weight partition walls, were selected as experiment samples, and the characteristics of conduction heat transfer to the backside part as the top surface were analyzed by applying heating temperatures of $200^{\circ}C$, $300^{\circ}C$, $400^{\circ}C$, and $500^{\circ}C$ to the bottom surface for 1800 s. According to the experimental results, the maximum backside temperatures at the maximum heating temperature of $500^{\circ}C$ was $51.6^{\circ}C$, $63.6^{\circ}C$, $317.2^{\circ}C$, $124.9^{\circ}C$, and $42.2^{\circ}C$ for the stud partition, SGP partition, sandwich panel, urethane foam panel, and glass wool panel, respectively. The maximum conduction heat- transfer rates at $500^{\circ}C$ were 17.16 W, 18.39 W, 136.65 W, 14.34 W, and 5.57 W for the stud partition, SGP partition, sandwich panel, urethane foam, and glass wool panel, respectively.

• Journal of the Korean Solar Energy Society
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• v.26 no.1
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• pp.81-89
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• 2006

Building integrated photovoltaic (BIPV) system operates as a multi-functional building construction material. They not only produce electricity, but also are building integral components such as facade, roof, window and shading device. On the other hands lots of architectural considerations should be reflected such as Installation position, shading, temperature effect and so on. As PV modules function like building envelope in BIPV, combined thermal and PV performance should be simultaneously evaluated This study is on the combined thermal and PV performance evaluation of BIPV modules. The purpose of this study is to investigate a temperature effect of PV module depending on the ventilation type of PV module backside. Test cell experiment was performed to identify the thermal and power effect of PV modules. Measurement results on the correlation of temperature and power generation were obtained. Those results can be utilized for the development of optimal BIPV installation details in the very early design stage.

• Fire Science and Engineering
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• v.34 no.2
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• pp.14-21
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• 2020

This paper presents the study of a fire risk to the backside of two miniatures of ISO 9705 2/5 using a lightweight partition for indoor space division and reproduction of the ISO 9705 test. An SGP partition, stud partition, glass wool panel, urethane foam panel, sandwich panel, and glass partition were selected as the test specimens, which are frequently used in construction. According to the ISO 9705 test standard, stabilization was achieved using a measuring device that recorded data before the ignition of a burner and continued recording for 120 s thereafter. After ignition was achieved, the power was increased to 300 kW for 600 s and then reduced to 100 kW for 600 s. The specimens were subsequently observed for 180 s, and the fire risk to the backside and the fire pattern of the wall unit were analyzed. Owing to the amount of heat generated by the ignition source, the maximum temperature of the backside was observed to be 67.7 ℃ for the SGP partition, 55.1 ℃ for the stud partition, 52.4 ℃ for the glass wool panel, 727.4 ℃ for the sandwich panel, 561 ℃ for the urethane foam panel, and 630.5 ℃ for the glass partition. In the cases of the sandwich and urethane foam panels, the explosion of flammable gas occurred by virtue of fusion of the interior materials. The reinforced glass was fractured owing to the temperature difference between the heat- and nonheat-responsive parts. Ultimately, the fire risk to the nearby section room was deemed to be high.

• Proceedings of the KIEE Conference
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• 2011.07a
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• pp.1300-1301
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• 2011

The purpose of this study is to analyze the electrical performance characteristics of semi-transparent BIPV modules. This study dealt with four different types of semi-transparent PV modules depending on the backside glass material, such as clear glass, bronze glass, reflecting glass and low-e glass. The monitoring data shows that the PV module temperature and solar radiation were closely related to the electrical performance of the modules.

• Proceedings of the KIEE Conference
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• 2000.07c
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• pp.1510-1512
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• 2000

Due to the shrinking of the chip size and increasing of the complexity in the modern electronic devices. the defect of wafer are so important to decide the yield in the device process. The engineers has studied the wafer defects and the characteristics. They published lots of the experimental methods. I did an experiment the gettering effect of the defects due to the high temperature and the long time diffusion. Actually, As the thickness of the wafer backside polysilicon is thicker and the diffusion time is faster. the defects on the wafer are decreased. The polysilicon gram boundaries of the wafer backside played an important part as the defect gettering site.

• 한국태양에너지학회:학술대회논문집
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• 2011.11a
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• pp.364-369
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• 2011

Recently, the cases of BIPV(Building-integrated Photovoltaic) have been increased with interest in renewable energy application for buildings. PV System in building can perform a variety of roles as an energy supplier, exterior materials, aesthetic element and etc. To apply PV modules in buildings, various factors should be considered, such as the installation angle and orientation of PV module, shading, and temperature. The temperature of PV modules that are attached to building surfaces especially is one of the most important factors, as it affects both the electrical efficiency of a PV module and the energy load in a building. BIPV modules designed as finished material for spandrels are presented in this paper. The purpose of this study is to analysis on the thermal performance characteristics of BIPV modules. This study dealt with different types of BIPV modules depending on the backside material, such as clear glass and backsheet. The analysis of monitoring data shows that the PV module temperature was closely related to the solar radiation on the BIPV module surface, and the BIPV used at the backside also had an effect on the PV module temperature that in turn determines its thermal performance.