• Journal of Korean Society for Atmospheric Environment
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• 제20권E2호
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• pp.69-75
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• 2004

In this study, thin film gas sensor based on tin oxide was fabricated to examine its characteristics. Target gas is acetonitrile ($CH_3$CN) which is a blood simulant for the chemical warfare agent. Sensing materials are SnO$_2$ SnO$_2$/Pt, and Sn/Pt with thickness from 1000 to 3000 $\AA$. The sensor consists of a sensing electrode with inter-digit (IDT) type in front side and a heater in rear side. Resistance changes of sensing materials are monitored on real time basis using a data acquisition board with a 12-bit analog to digital converter. Sensitivities are measured at different operating temperatures also with different gas concentrations and film thickness. The high sensitivity is obtained for Sn (3000 $\AA$)/Pt (30 $\AA$) at 30$0^{\circ}C$ for 3 ppm. Response and recovery times were about 40 and 160 s, respectively. Repetition measurements showed very good results with $\pm$3% in full scale range.

• 한국자기학회지
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• 제5권5호
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• pp.631-635
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• 1995

Longitudinal magnetic recording process of thin film media was simulated by the 2-D finite element method (FEM). To describe precisely the hysteresis behavior of thin film media, scalar Preisach model was used. In this paper, we discussed the formation of bit patterns and importance of modeling of minor loops in high density recording. The effects of the media coercivity and film thickness on the remanent magnetization and transition shape were investigated.

• ETRI Journal
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• 제35권4호
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• pp.610-616
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• 2013

This paper proposes a transparent logic circuit for radio frequency identification (RFID) tags in amorphous indium-gallium-zinc-oxide (a-IGZO) thin-film transistor (TFT) technology. The RFID logic circuit generates 16-bit code programmed in read-only memory. All circuits are implemented in a pseudo-CMOS logic style using transparent a-IGZO TFTs. The transmittance degradation due to the transparent RFID logic chip is 2.5% to 8% in a 300-nm to 800-nm wavelength. The RFID logic chip generates Manchester-encoded 16-bit data with a 3.2-kHz clock frequency and consumes 170 ${\mu}W$ at $V_{DD}=6$ V. It employs 222 transistors and occupies a chip area of 5.85 $mm^2$.

• 한국재료학회지
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• 제14권10호
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• pp.683-687
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• 2004

The BON thin films were grown on the Si substrate by the RF-PECVD method. When stored at the room temperature, the phase separation or transition of BON thin films occurred on the surface, due to the hydrophilic property of BON. The oxidation of BON thin films occurred mainly by the evaporation of B, O and N. The oxidized BON thin films consisted of an amorphous phase and a bit of the polycrystalline phase.

• 한국전기전자재료학회논문지
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• 제14권12호
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• pp.1001-1007
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• 2001

In this study, high dielectric materials, (Pb,La)Ti $O_3$ thin films were fabricated by PLD (Pulsed Laser Deposition) method and investigated in terms of structural and electrical characteristics in order to develope the dielectric materials for the use of new capacitor layers of Giga bit-level DRAM. The deposition conditions were examined in order to fabricate uniform thin films through systematic changes of oxygen pressures and substrate temperature. The uniform thickness and smooth morphology of (P $b_{0.72}$L $a_{0.28}$)Ti $O_3$ thin films were obtained at the conditions of substrate-target distance 5.5[cm], laser energy density 2.1[J/$\textrm{cm}^2$], oxygen pressure 200[mTorr] and substrate temperature 500[$^{\circ}C$]. After the (P $b_{0.72}$L $a_{0.28}$)Ti $O_3$ thin films were fabricated under the above conditions, they were post-annealed by RTA process in order to increase the dielectric constant. The film thickness of 1200 [$\AA$] had dielectric constant 821. Assuming that operating voltage is 2V, leakage current density of (P $b_{0.72}$L $a_{0.28}$)Ti $O_3$ thin films would result into 10$^{-7}$ [A/$\textrm{cm}^2$] and satisfied the specification of 256M DRAM planar capacitor, 4$\times$10$^{-7}$ [A/$\textrm{cm}^2$]m}^2$]

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2003년도 하계학술대회 논문집 Vol.4 No.1
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• pp.80-83
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• 2003

In this paper, the programming characteristics of the multi-bit devices based on SONOS structure are investigated. Our devices have been fabricated by $0.35\;{\mu}m$ complementary metal-oxide-semiconductor (CMOS) process with LOCOS isolation. In order to achieve the two-bits per cell operation, charges must be locally trapped in the nitride layer above the channel near the junction. Channel hot electron (CHE) injection for programming can operate in multi-bit using localized trap in nitride film. CHE injection in our devices is achieved with the single power supply of 5 V. To demonstrate CHE injection, substrate current (Isub) and one-shot programming curve were investigated. The multi-bit operation which stores two-bit per cell is investigated with a reverse read scheme. Also, hot hole injection for fast erasing is used. Due to the ultra-thin gate dielectrics, our results show many advantages which are simpler process, better scalability and lower programming voltage compared to any other two-bit storage flash memory. This fabricated structure and programming characteristics are shown to be the most promising for the multi-bit flash memory.

• 한국태양에너지학회 논문집
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• 제32권spc3호
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• pp.179-184
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• 2012

This research on building Integrated Photovoltaic System replacing windows and doors with amorphous silicon thin film PV windows and doors installing same exact mount on Mock-up. The windows and doors should be installed in different angle and bearing so that we can analyse the amount of electricity from them. The objective of the research is to evaluate and investigate the relationship between factors(intensity of solar radiation, PV window surface temperature, incidence angle, and sky conditions) that affects performance of PV window and performance. The range and method of this research is to establish monitoring system and analysis the data from the monitoring system to evaluate the performance of PV windows that have thin film of solar battery. We should evaluate the insolation according to the position of PV window, output, and surface temperature according to months and seasons so that we can figure out the relationship between these. And we should investigate the relationship between performance and efficiency according to incidence angle and sky condition so that we can figure out the correlation between factors and performance.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2006년도 추계학술대회 논문집 Vol.19
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• pp.192-193
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• 2006

A 16Mb ITIC FeRAM device was fabricated with BLT capacitors. The average value of the switchable 2 polarization obtained m the 32k-array (unit capacitor size: 068 ${mu}m^2$) capacitors was about 16 ${\mu}C/cm^2$ at 3V and the uniformity within an 8-inch wafer was about 2.8%. But a lot of cells were failed randomly during the measuring the bit-line signal of each cell. It was revealed that the Grain size and orientation of the BLT thin film were severely non-uniform. Therefore, the uniformity of the grain size and orientation was improved by changing the process conditions of post heat treatment. The temperature of nucleation step was the very effective on varying the microstructure of the BLT thin film. The optimized temperature of the nucleation step was $560^{\circ}C$.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2007년도 7th International Meeting on Information Display 제7권1호
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• pp.417-420
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• 2007

A 12k-bit SRAM has been developed for line memory of system-on-glass (SoG) with lowtemperature poly-silicon (LTPS) thin film transistor (TFT). For accurate sensing even with the large variation and mismatches in the characteristics of LTPS TFT, mismatch immune sense amplifier is developed. The SRAM shows 30ns read access time with 7V supply voltage while dissipating 4.05mW and 1.75mW for write and read operation, respectively

• 한국재료학회:학술대회논문집
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• 한국재료학회 2012년도 춘계학술발표대회
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• pp.66.1-66.1
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• 2012

Although all printed cost-less radio frequency identification (RFID) tags have been considered as a core tool for bringing up a ubiquitous society, the difficulties in integrating thin film transistors (TFTs), diodes and capacitors on plastic foils using a single in-line printing method nullify their roles for the realization of the ubiquitous society1,2. To prove the concept of all printed cost-less RFID tag, the practical degree of the integration of those devices on the plastic foils should be successfully printed to demonstrate multi bit RFID tag. The tag contains key device units such as 13.56 MHz modulating TFT, digital logic gates and 13.56 MHz rectifier to generate and transfer multi bit digital codes via a wireless communication (13.56 MHz). However, those key devices have never been integrated on the plastic foils using printing method yet because the electrical fluctuation of fully printed TFTs and diodes on plastic foils could not be controlled to show the function of desired devices. In this work, fully gravure printing process in printing 13.56 MHz operated 32 bit RFID tags on plastic foils has been demonstrated for the first time to prove all printed RFID tags on plastic foils can wirelessly generate and transfer 32 bit digital codes using the radio frequency of 13.56 MHz. This result proved that the electrical fluctuations of printed TFTs and diodes on plastic foils should be controlled in the range of maximum 20% to properly operate 32 bit RFID tags.