• Journal of the Microelectronics and Packaging Society
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• v.18 no.3
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• pp.59-65
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• 2011

According to the trends of electronic package to be smaller, thinner and more integrative, Flip Chip Ball Grid Array (FCBGA) become more used for mobile phone. However, the flip chip necessarily generate the heat by the electrical resistance and generated heat is increased due to reduced distribution area of the heat in accordance with the miniaturization trend of the package. Thermal issues can result in problems of devices that are sensitive to temperature and stress. Then the heat can generate problems to the system. In this paper, in order to improve the thermal issues of FCBGA, thermal characteristics of FCBGA was analyzed qualitatively by using the general heat transfer module of Comsol 3.5a and In order to solve thermal issues, flip chip with new micro structure is proposed by the simulation. and also by comparing existing model and analyzing variables such as pitch, height of the pattern and shape of the heat spreader, the improvement of heat dissipation characteristics about 18% was confirmed.

• Journal of the Institute of Electronics Engineers of Korea SC
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• v.37 no.6
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• pp.25-34
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• 2000

This paper describes design of a 250-Mbps 10-channel optical receiver array for parallel optical interconnection with the general-purpose CMOS technology The optical receiver is one of the most important building blocks to determine performance of the parallel optical interconnection system. The chip in CMOS technology makes it possible to implement the cost-effective system also. Each data channel consists of analog front-end including the integrated photo-detector and amplifier chain, digital block with D-FF and off-chip driver. In addition, the chip includes PLL (Phase-Lock Loop) for synchronous data recovery. The chip was fabricated in a 0.65-${\mu}{\textrm}{m}$ 2-poly, 2-metal CMOS technology. Power dissipation of each channel is 330㎽ for $\pm$2.5V supply.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.63 no.12
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• pp.1671-1674
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• 2014

This paper presents a frequency-dependent cell impedance analysis chip for use in cancer and normal cell discrimination. The previous cell impedance analysis chips for flowing cells cannot allow enough time for cell-to-electrode contact to monitor frequency-dependent impedance response. Another type of the previous cell impedance analysis chips for the cells clamped by membranes need complex sample control for making stable cell-to-electrode contact. We present a new impedance analysis chip using the microchamber array, on which a PDMS cover is placed to make stable cell-to-electrode contact for the individual cell trapped in each microchamber; thus achieving frequency-dependent single-cell impedance analysis without complex sample control. Compared to the normal cells, the magnitude of NHBE cells is $60.07{\sim}97.41k{\Omega}$ higher than A549 cells in the frequency range of 95.6 kHz~2MHz and the phase of NHBE is $3.96^{\circ}{\sim}20.8^{\circ}$ higher than A549 cells in the frequency range of 4.37 kHz~2MHz, respectively. It is demonstrated experimentally that the impedance analysis chip performs frequency-dependent cell impedance analysis by making stable cell-to-electrode contact with simple sample control; thereby applicable to the normal cell and cancer cell discrimination.

• The Journal of Korean Institute of Communications and Information Sciences
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• v.40 no.7
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• pp.1347-1353
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• 2015

We implemented a 10 Gb/s 4-channel vertical cavity surface emission lasers (VCSEL) driver array in a $0.13{\mu}m$ CMOS process technology. To enhance high current resolution, power dissipation, and chip space area, digital APC/AMC with time division sensing technology is primarily adopted. The measured -3 dB frequency bandwidth is 9.2 GHz; the small signal gain is 10.5 dB; the current resolution is 0.01 mA/step, suitable for the wavelength operation up to 10 Gb/s over a wide temperature range. The proposed APC and AMC demonstrate 5 to 20 mA of bias current control and 5 to 20 mA of modulation current control. The whole chip consumes 371 mW of low power under the maximum modulation and bias currents. The active chip size is $3.71{\times}1.3mm^2$.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.28 no.7
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• pp.571-575
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• 2017

This paper presents a C-band bi-directional T/R chipset in $0.13{\mu}m$ TSMC CMOS technology for phased array antenna. The T/R chipset, which is a key component of phased array antenna, consists of a 6 bit phase shifter, a 6 bit step attenuator, and three bi-directional gain amplifiers. The phase shifter is controlled up to $354^{\circ}$ with $5.625^{\circ}$ phase step for precise beam steering. The step attenuator is also controlled up to 31.5 dB with 0.5 dB attenuation step for the side lobe level rejection. The LDO(Low Drop Output) regulator for stable 1.2 V DC power and the SPI(Serial Peripheral Interface) for digital control are integrated in the chipset. The chip size is $2.5{\times}1.5mm^2$ including pads.

• Journal of the Institute of Electronics Engineers of Korea TC
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• v.47 no.6
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• pp.1-9
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• 2010

In this paper, we propose a hi-speed/low-power Extended QRD-RLS(QR-Decomposition Recursive Least Squares) equalizer with systolic array structure. In the conventional systolic array structure, vector mode CORDIC on the boundary cell calculates angle of input vector, and the rotation mode CORDIC on the internal cell rotates vector. But, in the proposed structure, it is shown that implementation complexity can be reduced using the rotation direction of vector mode CORDIC and rotation mode CORDIC. Furthermore, calculation time can be reduced by 1/2 since vector mode and rotation mode CORDIC operate at the same time. Through HDL coding and chip implementation, it is shown that implementation area is reduced by 23.8% compared with one of conventional structure.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.25 no.6
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• pp.628-636
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• 2014

This paper describes the design and analysis of five-element planar array antenna of an anti-jamming satellite navigation system. We propose a design of multi-layer patch antenna for Global Positioning System(GPS) $L_1/L_2$ dual bands. The proposed antenna has two ports feeding network with a hybrid chip coupler for a broad bandwidth with Right-Handed Circular Polarization(RHCP). The measurement results show the bore-sight gains of 1.10 dBic($L_1$) and 0.37 dBic($L_2$) for the center element. The bore-sight gains of an edge element are 0.99 dBic($L_1$) and -0.57 dBic($L_2$). At a fixed elevation angle of $30^{\circ}$, antennas show average gains of -2.08 dBic ($L_1$) and -5.33 dBic($L_2$) for the center element, and average gains of -0.40 dBic($L_1$) and -2.09 dBic($L_2$) for the edge elements. The results demonstrate that the proposed array antenna is suitable for anti-jamming applications.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.02a
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• pp.431-432
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• 2012

In the era of 20 nm scaled semiconductor volume manufacturing, Microelectronics Manufacturing Engineering Education is presented in this paper. The purpose of microelectronic engineering education is to educate engineers to work in the semiconductor industry; it is therefore should be considered even before than technology development. Three Microelectronics Manufacturing Engineering related courses are introduced, and how undergraduate students acquired hands-on experience on Microelectronics fabrication and manufacturing. Conventionally employed wire bonding was recognized as not only an additional parasitic source in high-frequency mobile applications due to the increased inductance caused from the wiring loop, but also a huddle for minimizing IC packaging footprint. To alleviate the concerns, chip bumping technologies such as flip chip bumping and pillar bumping have been suggested as promising chip assembly methods to provide high-density interconnects and lower signal propagation delay [1,2]. Aluminum as metal interconnecting material over the decades in integrated circuits (ICs) manufacturing has been rapidly replaced with copper in majority IC products. A single copper metal layer with various test patterns of lines and vias and $400{\mu}m$ by $400{\mu}m$ interconnected pads are formed. Mask M1 allows metal interconnection patterns on 4" wafers with AZ1512 positive tone photoresist, and Cu/TiN/Ti layers are wet etched in two steps. We employed WPR, a thick patternable negative photoresist, manufactured by JSR Corp., which is specifically developed as dielectric material for multi- chip packaging (MCP) and package-on-package (PoP). Spin-coating at 1,000 rpm, i-line UV exposure, and 1 hour curing at $110^{\circ}C$ allows about $25{\mu}m$ thick passivation layer before performing wafer level soldering. Conventional Si3N4 passivation between Cu and WPR layer using plasma CVD can be an optional. To practice the board level flip chip assembly, individual students draw their own fan-outs of 40 rectangle pads using Eagle CAD, a free PCB artwork EDA. Individuals then transfer the test circuitry on a blank CCFL board followed by Cu etching and solder mask processes. Negative dry film resist (DFR), Accimage$^{(R)}$, manufactured by Kolon Industries, Inc., was used for solder resist for ball grid array (BGA). We demonstrated how Microelectronics Manufacturing Engineering education has been performed by presenting brief intermediate by-product from undergraduate and graduate students. Microelectronics Manufacturing Engineering, once again, is to educating engineers to actively work in the area of semiconductor manufacturing. Through one semester senior level hands-on laboratory course, participating students will have clearer understanding on microelectronics manufacturing and realized the importance of manufacturing yield in practice.

• Proceedings of the Korean Institute of Intelligent Systems Conference
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• 1993.06a
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• pp.975-976
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• 1993

This talk presents the overview of the author's research and development activities on fuzzy inference hardware. We involved it with two distinct approaches. The first approach is to use application specific integrated circuits (ASIC) technology. The fuzzy inference method is directly implemented in silicon. The second approach, which is in its preliminary stage, is to use more conventional microprocessor architecture. Here, we use a quantitative technique used by designer of reduced instruction set computer (RISC) to modify an architecture of a microprocessor. In the ASIC approach, we implemented the most widely used fuzzy inference mechanism directly on silicon. The mechanism is beaded on a max-min compositional rule of inference, and Mandami's method of fuzzy implication. The two VLSI fuzzy inference chips are designed, fabricated, and fully tested. Both used a full-custom CMOS technology. The second and more claborate chip was designed at the University of North Carolina(U C) in cooperation with MCNC. Both VLSI chips had muliple datapaths for rule digital fuzzy inference chips had multiple datapaths for rule evaluation, and they executed multiple fuzzy if-then rules in parallel. The AT & T chip is the first digital fuzzy inference chip in the world. It ran with a 20 MHz clock cycle and achieved an approximately 80.000 Fuzzy Logical inferences Per Second (FLIPS). It stored and executed 16 fuzzy if-then rules. Since it was designed as a proof of concept prototype chip, it had minimal amount of peripheral logic for system integration. UNC/MCNC chip consists of 688,131 transistors of which 476,160 are used for RAM memory. It ran with a 10 MHz clock cycle. The chip has a 3-staged pipeline and initiates a computation of new inference every 64 cycle. This chip achieved an approximately 160,000 FLIPS. The new architecture have the following important improvements from the AT & T chip: Programmable rule set memory (RAM). On-chip fuzzification operation by a table lookup method. On-chip defuzzification operation by a centroid method. Reconfigurable architecture for processing two rule formats. RAM/datapath redundancy for higher yield It can store and execute 51 if-then rule of the following format: IF A and B and C and D Then Do E, and Then Do F. With this format, the chip takes four inputs and produces two outputs. By software reconfiguration, it can store and execute 102 if-then rules of the following simpler format using the same datapath: IF A and B Then Do E. With this format the chip takes two inputs and produces one outputs. We have built two VME-bus board systems based on this chip for Oak Ridge National Laboratory (ORNL). The board is now installed in a robot at ORNL. Researchers uses this board for experiment in autonomous robot navigation. The Fuzzy Logic system board places the Fuzzy chip into a VMEbus environment. High level C language functions hide the operational details of the board from the applications programme . The programmer treats rule memories and fuzzification function memories as local structures passed as parameters to the C functions. ASIC fuzzy inference hardware is extremely fast, but they are limited in generality. Many aspects of the design are limited or fixed. We have proposed to designing a are limited or fixed. We have proposed to designing a fuzzy information processor as an application specific processor using a quantitative approach. The quantitative approach was developed by RISC designers. In effect, we are interested in evaluating the effectiveness of a specialized RISC processor for fuzzy information processing. As the first step, we measured the possible speed-up of a fuzzy inference program based on if-then rules by an introduction of specialized instructions, i.e., min and max instructions. The minimum and maximum operations are heavily used in fuzzy logic applications as fuzzy intersection and union. We performed measurements using a MIPS R3000 as a base micropro essor. The initial result is encouraging. We can achieve as high as a 2.5 increase in inference speed if the R3000 had min and max instructions. Also, they are useful for speeding up other fuzzy operations such as bounded product and bounded sum. The embedded processor's main task is to control some device or process. It usually runs a single or a embedded processer to create an embedded processor for fuzzy control is very effective. Table I shows the measured speed of the inference by a MIPS R3000 microprocessor, a fictitious MIPS R3000 microprocessor with min and max instructions, and a UNC/MCNC ASIC fuzzy inference chip. The software that used on microprocessors is a simulator of the ASIC chip. The first row is the computation time in seconds of 6000 inferences using 51 rules where each fuzzy set is represented by an array of 64 elements. The second row is the time required to perform a single inference. The last row is the fuzzy logical inferences per second (FLIPS) measured for ach device. There is a large gap in run time between the ASIC and software approaches even if we resort to a specialized fuzzy microprocessor. As for design time and cost, these two approaches represent two extremes. An ASIC approach is extremely expensive. It is, therefore, an important research topic to design a specialized computing architecture for fuzzy applications that falls between these two extremes both in run time and design time/cost. TABLEI INFERENCE TIME BY 51 RULES {{{{Time }}{{MIPS R3000 }}{{ASIC }}{{Regular }}{{With min/mix }}{{6000 inference 1 inference FLIPS }}{{125s 20.8ms 48 }}{{49s 8.2ms 122 }}{{0.0038s 6.4㎲ 156,250 }} }}

• Journal of electromagnetic engineering and science
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• v.12 no.4
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• pp.234-239
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• 2012

This paper presents a compact K-band Doppler radar sensor for human vital signal detection that uses a radar configuration with only single coupler. The proposed radar front-end configuration can reduce the chip size and the additional RF power loss. The radar front-end IC is composed of a Lange coupler, VCO, and single balanced mixer. The oscillation frequency of the VCO is from 27.3 to 27.8 GHz. The phase noise of the VCO is -91.2 dBc/Hz at a 1 MHz offset frequency, and the output power is -4.8 dBm. The conversion gain of the mixer is about 11 dB. The chip size is $0.89{\times}1.47mm^2$. The compact Ka-band Doppler radar system was developed in order to demonstrate remote human vital signal detection. The radar system consists of a Ka-band Doppler radar module with a $2{\times}2$ patch array antenna, baseband signal conditioning block, DAQ system, and signal processing program. The front-end module size is $2.5{\times}2.5cm^2$. The proposed radar sensor can properly capture a human heartbeat and respiration rate at the distance of 50 cm.