Journal of the Microelectronics and Packaging Society (마이크로전자및패키징학회지)

The Korean Microelectronics and Packaging Society (한국마이크로전자및패키징학회)
권호 표지
DOI QR코드

DOI QR Code

The Optimization of FCBGA thermal Design by Micro Pattern Structure

마이크로 패턴 구조를 이용한 플립칩 패키지 BGA의 최적 열설계

  • Lee, Tae-Kyoung (Education program for samsung advanced integrated circuit, Pusan National University) ;
  • Kim, Dong-Min (Education program for samsung advanced integrated circuit, Pusan National University) ;
  • Jun, Ho-In (Education program for samsung advanced integrated circuit, Pusan National University) ;
  • Ha, Sang-Won (SEMCO ACI Division) ;
  • Jeong, Myung-Yung (Department of Cogno-Mechatronics Engineering, Pusan National University)
  • 이태경 (부산대학교 나노과학기술대학 차세대전자기판회로학과) ;
  • 김동민 (부산대학교 나노과학기술대학 차세대전자기판회로학과) ;
  • 전호인 (부산대학교 나노과학기술대학 차세대전자기판회로학과) ;
  • 하상원 (삼성전기) ;
  • 정명영 (부산대학교 나노과학기술대학 인지메카트로닉스공학과)
  • Received : 2011.09.05
  • Accepted : 2011.09.27
  • Published : 2011.09.30
Download PDF
⟨ Previous Next ⟩

Abstract

According to the trends of electronic package to be smaller, thinner and more integrative, Flip Chip Ball Grid Array (FCBGA) become more used for mobile phone. However, the flip chip necessarily generate the heat by the electrical resistance and generated heat is increased due to reduced distribution area of the heat in accordance with the miniaturization trend of the package. Thermal issues can result in problems of devices that are sensitive to temperature and stress. Then the heat can generate problems to the system. In this paper, in order to improve the thermal issues of FCBGA, thermal characteristics of FCBGA was analyzed qualitatively by using the general heat transfer module of Comsol 3.5a and In order to solve thermal issues, flip chip with new micro structure is proposed by the simulation. and also by comparing existing model and analyzing variables such as pitch, height of the pattern and shape of the heat spreader, the improvement of heat dissipation characteristics about 18% was confirmed.

소형화, 박형화 및 집적화의 경향에 따라 FCBGA가 휴대폰과 같은 전자제품에 활발히 사용되고 있다. 그러나, 플립칩은 전기적 저항에 의한 열이 필연적으로 발생하며, 발생된 열은 패키지의 소형화에 따라 열의 분산 면적 감소로 인하여 발열의 증가가 나타나게 된다. 발열은 온도와 응력에 민감하게 반응하는 소자의 수명을 저해하고, 시스템에 있어 고장의 발생을 가져올 수 있다. 따라서 본 논문에서는 플립칩의 발열문제를 해결하기 위하여 Comsol 3.5a의 heat transfer module을 이용하여 FCBGA의 발열 특성을 정량적으로 분석하였다. 그리고 열 문제를 해결하기 위하여 시뮬레이션을 통한 새로운 마이크로 구조가 부착된 플립칩을 제안하였다. 또한 마이크로 패턴 구조의 형상, 높이, 간격에 대한 열 소산을 분석함으로써, 기존 플립칩에 비하여 열소산 특성이 18% 향상됨을 확인하였다.

Keywords

References

  1. C. F. Coombs, "Printed Circuits Handbook," McGraw Hill Book Co., Chap.3, (2007).
  2. Y. Song, S. B. Lee, S. H. Jeon, B. S. Yim, H. S. Chung and J. M. Kim "Underfill Flow Characteristics for Flip-Chip Packaging" J. Microelectron. Packag. Soc., 16(3), 39 (2009).
  3. J. H. Ann, K. S. Kim, Y. C. Lee, Y. Kim and S. B. Jung "Regulation in Shear Test Method for BGA of Flip-chip Package", J. Microelectron. Packag. Soc., 17(3), 1 (2010).
  4. Bai, C, and Veatch, M, "Chip scale package design for thermal performance in mobile handsets" Paper presented at the 2007 Electronic Components and Technology Conference. Proceedings. 57th, 1415 (2007)
  5. S. H. Oh, C. S. Kim, B. S. Rho, S. B. Jung and M. Y. Jeong, "Thermal resistance control of an optical module packaging by a heat sink of high thermal conductivity", Mat. Sci. Forum 580-582, 163 (2008). https://doi.org/10.4028/www.scientific.net/MSF.580-582.163
  6. J. S. Corbin, "Finite Element Analysis for Solder Ball Connect (SBC) Structural design Optimization", IBM J. Research Development, 37(5), 585 (1993). https://doi.org/10.1147/rd.375.0585
  7. T. Lee and L. Jung, "Finite Element Analysis for Solder Ball Failures in Chip Scale Packages", Microelectronics and Reliability, 38(2), 1941 (1998). https://doi.org/10.1016/S0026-2714(98)00163-2
  8. J. W. Joo and D. H. Kim, "Thermo-mechanical Deformation Analysis of Flip Chip PBGA Packages subjected to Temperature Change", J. Microelectron. Packag. Soc., 13(4), 17 (2006).
  9. Retuta, D., Ma, Y.Y., Kanth, R., Tan, H.B., Sun, A.,and Tanary, S., "Thermal Performance Enhancement for CSP Packages," Proc 57th Electronic Components and Technology Conf, Reno, NV, USA, 1690 (2007).
  10. Mingzong Wang, Eason Chen, Jeng Yuan Lai, Yu-Po Wang, "High Power CSP Thermal Solutions", Electronic Packaging Technology, 2007.ICEPT 2007. 8th International Conference on, 1 (2007).