• Resources Recycling
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• v.23 no.3
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• pp.61-70
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• 2014

Tin has been widely used to solder, tin plated steel, bronze alloy, sputtering target for transparent electrode and chemical additives. It has been widely reported to the recycling technologies for tin scraps because of the scarcity and economic efficiency of the reserve. This study was analyzed by using open/registered patents KR, US, CN, JP and EP related to recycling technologies for processing scrap, sludges, waste fluid for plating process and spent alloy containing tin in between 1970 and 2013. Patents were collected using key-words searching and filtered by filtering criteria. The trends of the patents were analyzed by year, country, appliant and technology.

• Proceedings of the Korean Environmental Sciences Society Conference
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• 2019.10a
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• pp.83-83
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• 2019

Increasing the CO₂ concentration in the atmosphere induce high temperature and rising sea levels. So the technology that capture and reuse of the CO₂ have been recently become popular. Among other methods, CRR(CO2₂ reduction reaction) is typical method of CO₂ reusing. Electrocatalyst can show more higher efficiencies in CRR than photocatalyst because it doesn't use nature source. Nowadays, finding high efficient electrocatalyst by controlling electronic (affected by stoichiometry) and geometric (affected by atomic arrangement) factors are very important issues. Mono-atomic electro-catalyst has limitations on controlling binding energy because each intermediate has own binding energy range. So the Multi-metallic electro-catalyst is important to stabilize intermediate at the same time. Carbon monoxide(CO) which is our target product and important feedstock of useful products. Au is known for the most high CO production metal. With copper, Not only gold/copper has advantages which is they have FCC packing for easily forming solid solution regardless of stoichiometry but also presence of adsorbed CO on Cu promotes the desorption of CO on Au because of strong repulsion. And gold/copper bi-metal catalyst can show high catalytic activity(mass activity) although it has low selectivity relatively Gold. Actually, multi-metallic catalyst structure control method is limited in the solution method which is takes a lot of time. In here, we introduce CTS(carbo thermal shock) method which is using heat to make MMNP in a few seconds for making gold-copper system. This method is very simple and efficient in terms of time(very short reaction time and using carbon substrate as a direct working electrode) and increasing reaction sites(highly dispersed and mixing alloy structures). Last one is easy to control degree of mixing and it can induce 5 or more metals in one alloy system. Gold/copper by CTS can show higher catalytic activity depending on metal ratio which is altered easily by changing simple variables. The ultimate goals are making CO₂ test system by CTS which can check the selectivity depending on metal types in a very short time.

• Journal of the Korean Vacuum Society
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• v.16 no.2
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• pp.116-121
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• 2007

TiNi shape memory alloy(SMA) was fabricated by PLD(plused laser deposition) using equiatomic TiNi target. Composition and crystallization of TiNi thin films which were fabricated in ambient Ar gas(200m Torr)and vacuum($5{\times}10^{-6}\;Torr$) were investigated. Composition of TiNi thin films was characterized by energy-dispersive X-ray spectrometry (EDXS) and crystallization was confirmed by X-ray diffraction (XRD). The composition of films depends on the distance between target and substrate but does not sensitively depend on the substrate temperature. It is found that the composition of films can be easily controlled when substrate is placed inside plume in ambient Ar gas. It is also found that the in situ crystallization temperature ($ca.\;400^{\circ}C$) in ambient Ar gas is lowered in comparison with that of TiNi film prepared under vacuum. The low crystallization temperature in ambient Ar gas makes it possible to prepare the crystalline TiNi thin film without contamination.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.40 no.5
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• pp.305-311
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• 2016

Induction heating is the process in which an electrically conducting object (usually a metal) is heated by electromagnetic induction through heat generated in the object by eddy currents. The main advantage of an induction heating device is the generation of the heat inside the target object itself. Hence, non-contact and safe heating devices are widely used in many industrial and medical fields. Recently, a new dental implant system was developed using a shape-memory alloy, wherein an artificial tooth could be easily removed from the dental implant by heating. This paper discusses the development of an induction-heating device to remove the dental crown in the new implant system. First, the finite element simulation of electromagnetic and thermal coupling analysis was implemented to obtain the temperature distributions of the target object for various frequencies, input currents, and coil shapes. Based on the simulation results, experiments were conducted by using prototypes, and an induction heating device was developed to remove the dental crown from the implant.

• Journal of Ceramic Processing Research
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• v.13 no.spc2
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• pp.328-331
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• 2012

With the recent development of super-precision optical instruments, camera modules for devices, such as portable terminals and digital camera lenses, are increasingly being used. Since an optical lens is usually produced by high-temperature compression molding methods using tungsten carbide (WC) alloy molding cores, it is necessary to develop and study technology for super-precision processing of molding cores and coatings for the core surface. In this study, Rhenium-Iridium (Re-Ir) thin films were deposited onto a WC molding core using a sputtering system. The Re-Ir thin films were prepared by a multi-target sputtering technique, using iridium, rhenium, and chromium as the sources. Argon and nitrogen were introduced through an inlet into the chamber to be the plasma and reactive gases. The Re-Ir thin films were prepared with targets having a composition ratio of 30 : 70, and the Re-Ir thin films were formed with a 240 nm thickness. Re-Ir thin films on WC molding core were analyzed by scanning electron microscope (SEM), atomic force microscope (AFM), and Ra (the arithmetical average surface roughness). Also, adhesion strength and coefficient friction of Re-Ir thin films were examined. The Re-Ir coating technique has received intensive attention in the coating processes field because of promising features, such as hardness, high elasticity, abrasion resistance and mechanical stability that result from the process. Re-Ir coating technique has also been applied widely in industrial and biomedical applications. In this study, WC molding core was manufactured, using high-performance precision machining and the effects of the Re-Ir coating on the surface roughness.

• Proceedings of the Korean Vacuum Society Conference
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• 2011.02a
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• pp.189-190
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• 2011

Cu가 기존 배선물질인 Al을 대체함에 따라 resistance-capacitance (RC) delay나 electromigration (EM) 등의 문제들이 어느 정도 해결되었다. 그러나 지속적인 배선 폭의 감소로 배선의 저항 증가, EM 현상 강화 그리고 stability 악화 등의 문제가 지속적으로 야기되고 있다. 이를 해결하기 위한 방법으로 Cu alloy seed layer를 이용한 barrier 자가형성 공정에 대한 연구를 진행하였다. 이 공정은 Cu 합금을 seed layer로 사용하여 도금을 한 후 열처리를 통해 SiO2와의 계면에서 barrier를 자가 형성시키는 공정이다. 이 공정은 매우 균일하고 얇은 barrier를 형성할 수 있고 별도의 barrier와 glue layer를 형성하지 않아 seed layer를 위한 공간을 추가로 확보할 수 있는 장점을 가지고 있다. 또한, via bottom에 barrier가 형성되지 않아 배선 전체 저항을 급격히 낮출 수 있다. 합금 물질로는 초기 Al이나 Mg에 대한 연구가 진행되었으나, 낮은 oxide formation energy로 인해 SiO2에 과도한 손상을 주는 문제점이 제기되었다. 최근 Mn을 합금 물질로 사용한 안정적인 barrier 형성 공정이 보고 되고 있다. 하지만, barrier 형성을 하기 위해 300도 이상의 열처리 온도가 필요하고 열처리 시간 또한 긴 단점이 있다. 본 실험에서는 co-sputtering system을 사용하여 Cu-V 합금을 형성하였고, barrier를 자가 형성을 위해 300도에서 500도까지 열처리 온도를 변화시키며 1시간 동안 열처리를 실시하였다. Cu-V 공정 조건 확립을 위해 AFM, XRD, 4-point probe system을 이용하여 표면 거칠기, 결정성과 비저항을 평가하였다. Cu-V 박막 내 V의 함량은 V target의 plasma power density를 변화시켜 조절 하였으며 XPS를 통해 분석하였다. 열처리 후 시편의 단면을 TEM으로 분석하여 Cu-V 박막과 SiO2 사이에 interlayer가 형성된 것을 확인 하였으며 EDS를 이용한 element mapping을 통해 Cu-V 내 V의 거동과 interlayer의 성분을 확인하였다. PVD Cu-V 박막은 기판 온도에 큰 영향을 받았고, 200 도 이상에서는 Cu의 높은 표면에너지에 의한 agglomeration 현상으로 거친 표면을 가지는 박막이 형성되었다. 7.61 at.%의 V함량을 가지는 Cu-V 박막을 300도에서 1시간 열처리 한 결과 4.5 nm의 V based oxide interlayer가 형성된 것을 확인하였다. 열처리에 의해 Cu-V 박막 내 V은 SiO2와의 계면과 박막 표면으로 확산하며 oxide를 형성했으며 Cu-V 박막 내 V 함량은 줄어들었다. 300, 400, 500도에서 열처리 한 결과 동일 조성과 열처리 온도에서 Cu-Mn에 의해 형성된 interlayer의 두께 보다 두껍게 성장 했다. 이는 V의 oxide formation nergyrk Mn 보다 작으므로 SiO2와의 계면에서 산화막 형성이 쉽기 때문으로 판단된다. 또한, V+5 이온 반경이 Mn+2 이온 반경보다 작아 oxide 내부에서 확산이 용이하며 oxide 박막 내에 여기되는 전기장이 더 큰 산화수를 가지는 V의 경우 더 크기 때문으로 판단된다.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.02a
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• pp.256-256
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• 2012

Cu가 기존 배선물질인 Al을 대체함에 따라 resistance-capacitance delay와 electromigration (EM) 등의 문제들이 어느 정도 해결되었다. 그러나 지속적인 배선 폭의 감소로 배선의 저항 증가, EM 현상 강화 그리고 stability 악화 등의 문제가 지속적으로 야기되고 있다. 이를 해결하기 위한 방법으로 Cu alloy seed layer를 이용한 barrier 자가형성 공정에 대한 연구를 진행하였다. 이 공정은 Cu 합금을 seed layer로 사용하여 도금을 한 후 열처리를 통해 $SiO_2$와의 계면에서 barrier를 자가 형성시키는 공정이다. 이 공정은 매우 균일하고 얇은 barrier를 형성할 수 있고 별도의 barrier와 glue layer를 형성하지 않아 seed layer를 위한 공간을 추가로 확보할 수 있는 장점을 가지고 있다. 또한, via bottom에 barrier가 형성되지 않아 배선 전체 저항을 급격히 낮출 수 있다. 합금 물질로는 초기 Al이나 Mg에 대한 연구가 진행되었으나, 낮은 oxide formation energy로 인해 SiO2에 과도한 손상을 주는 문제점이 제기되었다. 최근 Mn을 합금 물질로 사용한 안정적인 barrier 형성 공정이 보고 되고 있다. 하지만, barrier 형성을 하기 위해 300도 이상의 열처리 온도가 필요하고 열처리 시간 또한 긴 단점이 있다. 본 실험에서는 co-sputtering system을 사용하여 Cu-V 합금을 형성하였고, barrier를 자가 형성을 위해 300도에서 500도까지 열처리 온도를 변화시키며 1시간 동안 열처리를 실시하였다. Cu-V 공정 조건 확립을 위해 AFM, XRD, 4-point probe system을 이용하여 표면 거칠기, 결정성과 비저항을 평가하였다. Cu-V 박막 내 V의 함량은 V target의 plasma power density를 변화시켜 조절 하였으며 XPS를 통해 분석하였다. 열처리 후 시편의 단면을 TEM으로 분석하여 Cu-V 박막과 $SiO_2$ 사이에 interlayer가 형성된 것을 확인 하였으며 EDS를 이용한 element mapping을 통해 Cu-V 내 V의 거동과 interlayer의 성분을 확인하였다. PVD Cu-V 박막은 기판 온도에 큰 영향을 받았고, 200도 이상에서는 Cu의 높은 표면에너지에 의한 agglomeration 현상으로 거친 표면을 가지는 박막이 형성되었다. 7.61 at.%의 V함량을 가지는 Cu-V 박막을 300도에서 1시간 열처리 한 결과 4.5 nm의 V based oxide interlayer가 형성된 것을 확인하였다. 열처리에 의해 Cu-V 박막 내 V은 $SiO_2$와의 계면과 박막 표면으로 확산하며 oxide를 형성했으며 Cu-V 박막 내 V 함량은 줄어들었다. 300, 400, 500도에서 열처리 한 결과 동일 조성과 열처리 온도에서 Cu-Mn에 의해 형성된 interlayer의 두께 보다 두껍게 성장했다. 이는 V의 oxide formation energy가 Mn 보다 작으므로 SiO2와의 계면에서 산화막 형성이 쉽기 때문으로 판단된다. 또한, $V^{+5}$이온 반경이 $Mn^{+2}$이온 반경보다 작아 oxide 내부에서 확산이 용이하며 oxide 박막 내에 여기되는 전기장이 더 큰 산화수를 가지는 V의 경우 더 크기 때문으로 판단된다.

• Tribology and Lubricants
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• v.39 no.2
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• pp.49-55
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• 2023

Currently, the demand for green technologies toward a sustainable future is rapidly increasing due to growing concern over environmental issues. Methanol is biodegradable and can provide clean combustion to reduce sulfur oxide and nitrogen oxide emissions, and therefore it is a candidate fuel for marine engines. However, the effect of methanol on tribological characteristic degradation should be addressed for methanol-fueled engines. In this study, the methanol addition effects on tribological characteristic degradation is experimentally assessed using a pin-on-disk tribo-tester. Ni-based alloy is used as a target material due to its broad applicability as an engine component material. For a lubricant, engine oil with and without methanol are used. The tests are conducted for up to 10,000 cycles under boundary lubrication while the change in friction force is monitored. Additionally, the wear rate is determined based on laser scanning confocal microscope data. An additional test in which methanol is added at regular intervals is performed with an aim to directly observe its effect on friction. Overall, the friction coefficient increases slightly with increasing methanol concentration. Furthermore, the wear rate of the pin and disk increase significantly with methanol addition. The results also indicate that the friction increases instantaneously with methanol addition at the contacting interface. These findings may be useful for better understanding the methanol effect on the tribological characteristics of Ni-based alloys for methanol-fueled engines with improved performance.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.18 no.8
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• pp.714-719
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• 2005

NiCr thin film was deposited by DC magnetron sputtering on $A;_2O_3$/Si substrate with NiCr (80:20) alloy target. NiCr thin films were annealed at $300^{\circ}C,\;400^{\circ}C,\;500^{\circ}C,\;600^{\circ}C,\;and\;700^{\circ}C$ for 6 hr in $H_2$ after annealing at $500^{\circ}C$ for 6hr in air atmosphere, respectively. To analyze NiCr thin film properties, the changes of its micro structure were Investigated through field emission scanning electron microscope (FESEM). X-ray photoelectron spectroscopy (XPS) was used to analyze a surface of NiCr thin film. Resistance of NiCr thin film was measured by 4-point probe technique. The generated heats were measured by infrared thermometer through the application of DC voltage (5 V/l2 V). NiCr thin film treated by gradational double annealing process had uniform and small grains. Maximum temperature generated heat by NiCr micro heater was $173^{\circ}C$. We expect that our results will be a useful reference in the realization of NiCr micro heater.

• Journal of Korean Neurosurgical Society
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• v.30 no.8
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• pp.981-984
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• 2001

Object : To treat hydrocephalus by ventriculo-peritoneal shunt operation, the correct positioning of the proximal catheter in the ventricle is very important. The purpose of this study was to develop the "shunt guiding kit" for the proper positioning of the proximal shunt catheter to the ventricle in the ventriculo-peritoneal shunt operation. Materials and Methods: The "shunt guiding kit" is made of tungsten alloy and it consists of one frame, two screws and one guider. Through the guider, the proximal shunt catheter operates by mechanically coupling the posterior burr hole to the anterior target point. Results: We have treated three hydrocephalus patients with use of the "shunt guiding kit", and achieved good location of proximal shunt catheters. Conclusion: We developed the "shunt guiding kit" for the proper positioning of the proximal shunt catheter to the ventricle, and this would be very useful for preventing ventriculo-peritoneal shunt malfunction and preventing possible brain injury during the procedures.