Transactions of the Korean Society of Mechanical Engineers B (대한기계학회논문집B)

The Korean Society of Mechanical Engineers (대한기계학회)
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Induction Heating Device for Dental Implant Removal

인공치아의 임플란트 탈착을 위한 유도가열장치 연구

  • Received : 2016.02.02
  • Accepted : 2016.04.06
  • Published : 2016.05.01
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Abstract

Induction heating is the process in which an electrically conducting object (usually a metal) is heated by electromagnetic induction through heat generated in the object by eddy currents. The main advantage of an induction heating device is the generation of the heat inside the target object itself. Hence, non-contact and safe heating devices are widely used in many industrial and medical fields. Recently, a new dental implant system was developed using a shape-memory alloy, wherein an artificial tooth could be easily removed from the dental implant by heating. This paper discusses the development of an induction-heating device to remove the dental crown in the new implant system. First, the finite element simulation of electromagnetic and thermal coupling analysis was implemented to obtain the temperature distributions of the target object for various frequencies, input currents, and coil shapes. Based on the simulation results, experiments were conducted by using prototypes, and an induction heating device was developed to remove the dental crown from the implant.

유도가열은 유도전류를 이용하여 도체에 열을 가하는 방식이다. 유도가열은 열을 가하고자 하는 물체 내부에서 열이 발생하고, 비접촉이며 안전하기 때문에 산업이나 의료분야에서 광범위하게 사용되고 있다. 최근에 형상기억합금을 사용하여 열에 의해 인공치아가 임플란트에서 쉽게 빠질 수 있게 하는 임플란트 시스템이 개발되었다. 본 논문에서는 새로운 임플란트 시스템에서 인공치아를 쉽게 제거할 수 있는 유도가열 장치를 개발하였다. 먼저 전자장-열 구조 유한요소 연성 해석을 통해 다양한 입력 전류와 코일 형상에 대해 온도를 시뮬레이션 상으로 확인해보았다. 해석 결과를 토대로 유도가열장치 시작품을 제작하여 실험을 통해 86초에 인공 치아가 분리됨을 확인하였다.

Keywords

References

  1. Seo, Y., 2011, "Dental Retention Systems," US Patent 8,047,844 B2, Rodo Medical INC., Sunnyvale, CA (US).
  2. Lozinskii, M. G., 1969, "Industrial Applications of Induction Heating," 1st English ed. New York, NY, USA: Pergamon.
  3. Moreland W. C., 1973, "The Induction Range: Its Performance and its Development Problems," IEEE Transactions on Industry Applications, Vol. 9, No. 1, pp. 81-85.
  4. Stauffer, P. R., Cetas, T. C. and Jones R. C., 1984, "Magnetic Induction Heating of Ferromagnetic Implants for Inducing Localized Hyperthermia in Deepseated Tumors," IEEE Transactions on Biomedical Engineering, Vol. BME-31, No. 2, pp. 235-251. https://doi.org/10.1109/TBME.1984.325334
  5. Jung, Y. C., Park, B. W. Park, and Jo, K. Y., 2001, "Trend Technology for Induction Heat of Home Appliances," Proceedings of Korean Institute of Electrical Engineers, Vol. 50, pp. 15-20.
  6. Shin W. S. and Park H. C., 2011, "Inverter for Induction Heating using Simultaneous Dual-Frequency Method," The Transactions of Korean Institute of Power Electronics, Vol. 16, No. 6, pp. 554-560. https://doi.org/10.6113/TKPE.2011.16.6.554
  7. Ogiwar, H. and Nakaoka, M., 2003, "ZCS High Frequency Inverter Using SIT for Induction Heating Applications," IEE Proceedings-Electric Power Applications, Vol. 150, p. 185.
  8. Kang, B. K., Lee, S. M. and Park, J. W., 2009, "A Study on the Parameter Optimization of Inverter for Induction Heating Cooking Appliance," Transactions of the Korean Institute of Electrical Engineers, Vol. 58, No. 1, p. 77.
  9. Woo, H. G. and Shin, D. C., 2013, "A study on the Distance and Frequency Variable Characteristics of Flat Plate Induction Heating Element," Journal of KIEE, Vol. 27, pp. 68-74.
  10. Zinn, S. and Semiatin, S. L., 1988, "Elements of Induction Heating Design, Control, and Applications," Second edition, ASM International, Ohio, pp. 9-42.
  11. Kwon O. K., Jeong H. T., Yun J. H. and Park K., 2007, "A Study on Rapid Mold Heating System using High-Frequency Induction Heating," Transactions of the Korean Society of Mechanical Engineers A, Vol. 31, pp. 594-600. https://doi.org/10.3795/KSME-A.2007.31.5.594
  12. Douglas W. Dietrich, 1990, "ASM Handbook, Vol. 2, Properties and Selection: Nonferrous Alloys and Special-Purpose Materials," ASM International, Ohio, Vol. 2, pp. 2207-2213.
  13. Hong, S. C., Jeon, H. J., Baek, H. R. and Won C. Y., 2002, "Power Electronics used PSpice," Intervision, pp. 431-433.