• Title/Summary/Keyword: 직접접합

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An Estimating Model for Job-Site Overhead Costs according to Progress Rate (공정률에 따른 아파트 건설공사 현장관리비 산정모델)

  • Jeong, Kichang;Lee, Jaeseob
    • Korean Journal of Construction Engineering and Management
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    • v.19 no.5
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    • pp.43-52
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    • 2018
  • Generally, research on construction cost has been done mostly regarding its direct cost, thus model regarding indirect cost lacks attention. This research seeks to introduce a model to predict on-site overhead cost for apartment construction projects, which constitutes a big portion in Korean construction industry. We devised an equation of 9th degree via curve-fitting, using multiple on-site actual expense data, which can be used to calculate per-progress rate, per-day on-site overhead cost. We further show prospective usage of the model by applying it on construction projects sizing about 30 billion won. Regarding the fact that previous studies could not recognize pattern changes of a total on-site overhead cost, this model is worthy of its conveniency and thoroughness, as well as providing reasonal ground for its derivation in predicting on-site overhead cost of apartment construction projects.

A Study on the Method and Application of Shaft Repair using Directed Energy Deposition Process (직접식 에너지 용착 공정을 활용한 축 보수 방법 및 활용 사례 연구)

  • Lee, Yoon Sun;Lee, Min Kyu;Sung, Ji Hyun;Hong, Myeong Pyo;Son, Yong;An, Seouk;Jeong, Oe Cheol;Lee, Ho Jin
    • Journal of the Korean Society of Manufacturing Process Engineers
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    • v.20 no.9
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    • pp.1-10
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    • 2021
  • Recently, the repair and recycling of damaged mechanical parts via metal additive manufacturing processes have been industrial points of interest. This is because the repair and recycling of damaged mechanical parts can reduce energy and resource consumption. The directed energy deposition(DED) process has various advantages such as the possibility of selective deposition, large building space, and a small heat-affected zone. Hence, it is a suitable process for repairing damaged mechanical parts. The shaft is a core component of various mechanical systems. Although there is a high demand for the repair of the shaft, it is difficult to repair with traditional welding processes because of the thermal deformation problem. The objective of this study is to propose a repair procedure for a damaged shaft using the DED process and discuss its applications. Three types of cases, including a small shaft with a damaged surface, a medium-size shaft with a worn bearing joint, and a large shaft with serious damage, were repaired using the proposed procedure. The microstructure and hardness were examined to discuss the characteristics of the repaired component. The efficiency of the repair of the damaged shaft is also discussed.

An Experimental Study on the Bonding Shear Performance Evaluation of the UHPC According to an Bonding Interface Treatment of the Construction Joint (시공이음부 계면처리방법에 따른 초고성능 콘크리트의 전단부착성능 평가에 관한 실험적 연구)

  • Jang, Hyun-O;Kim, Bo-Seok;Lee, Han-Seung
    • Journal of the Korea Institute of Building Construction
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    • v.16 no.3
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    • pp.237-245
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    • 2016
  • Structural performance and durability of ultra high performance concrete could demonstrate optimal performance when unity was kept. Accordingly, it is necessary to involve the characteristics and quantitative surface treatment at the same time in order to retain oneness of Ultra-High-Performance Concrete(UHPC) according to construction joint occurrence. Therefore, this study derives a reasonable surface treatment method in a material's point of view through the shear adhesion performance evaluation according to the construction joints surface processing method as a part for securing the adhesion performance of the construction joints when casting UHPC. 180 MPa of required average strength was used for mix of UHPC and surface treatment method was set to totally 7 level that MN, GR-10-0, GR-20-0, GR-30-0, SH-30-5, SH-30-10. After the specimen were manufactured to a size of $150{\times}150{\times}150mm$, Direct shear test was performed to evaluate the shear adhesion strength. As a result, it was confirmed that the adhesion performance was improved when executing a surface treatment for the construction joint interface and standard of failure mode of specimen was over Type C. Also, It was considered that interface of cross section and depth of concavo-convex should be concerned.

The new approach to maxillary and mandibular anterior dental arch forms - In Korean normal occlusion models (상하악 전치부 치열궁 형태에 대한 새로운 접근 - 한국성인 정상교합자 모델에서)

  • Ha, Man-Hee;Son, Woo-Sung;Yang, Hoon-Chul
    • The korean journal of orthodontics
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    • v.31 no.3 s.86
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    • pp.347-355
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    • 2001
  • Maxillary and mandibular anterior dental arches often have the problems of occlusal relation and esthetics by malformations of teeth, congenital missing, et at. Though the clinician usually use the anterior ratio to overcome this problems, he has the limitation of a direct application this ratio to the prediction of anterior occlusal relationship by the change of anterior ratio as dental arch form, intercanine width, segment depth and arch perimeter. So this study examine maxillary and mandibular anterior dental arch forms by least square method using Korean normal occlusion models(man : 20 casts, woman : 20 casts). Maxillary and mandibular anterior dental arches of Korean normal occlusion models are curve fitted to polynomial function, beta function, hyperbolic cosine function in order. And this accuracy of curve fitting is constant regardless of man/woman and maxilla/mandible. The relationships between intercanine width, segment depth, and arch perimeter based on this owe fitted dental arch form are acquired. This relationships will give the prediction of anterior dental arch form and the information of more accurate anterior ratio according to intercanine width.

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A High Yield Rate MEMS Gyroscope with a Packaged SiOG Process (SiOG 공정을 이용한 고 신뢰성 MEMS 자이로스코프)

  • Lee Moon Chul;Kang Seok Jin;Jung Kyu Dong;Choa Sung-Hoon;Cho Yang Chul
    • Journal of the Microelectronics and Packaging Society
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    • v.12 no.3 s.36
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    • pp.187-196
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    • 2005
  • MEMS devices such as a vibratory gyroscope often suffer from a lower yield rate due to fabrication errors and the external stress. In the decoupled vibratory gyroscope, the main factor that determines the yield rate is the frequency difference between the sensing and driving modes. The gyroscope, fabricated with SOI (Silicon-On-Insulator) wafer and packaged using the anodic bonding, has a large wafer bowing caused by thermal expansion mismatch as well as non-uniform surfaces of the structures caused by the notching effect. These effects result in large distribution in the frequency difference, and thereby a lower yield rate. To improve the yield rate we propose a packaged SiOG (Silicon On Glass) technology. It uses a silicon wafer and two glass wafers to minimize the wafer bowing and a metallic membrane to avoid the notching. In the packaged SiOG gyroscope, the notching effect is eliminated and the warpage of the wafer is greatly reduced. Consequently the frequency difference is more uniformly distributed and its variation is greatly improved. Therefore we can achieve a more robust vibratory MEMS gyroscope with a higher yield rate.

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Radiation detector material development with multi-layer by hetero-junction for the reduction of leakage current (헤테르접합을 이용한 누설전류 저감을 위한 다층구조의 방사선 검출 물질 개발)

  • Oh, Kyung-Min;Yoon, Min-Seok;Kim, Min-Woo;Cho, Sung-Ho;Nam, Sang-Hee;Park, Ji-Goon
    • Journal of the Korean Society of Radiology
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    • v.3 no.1
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    • pp.11-15
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    • 2009
  • In this study, the basic research verifying possibility of applications as radiology image sensor in Digital Radiography was performed, the radiology image sensor was fabricated using a multi-layer technique to decrease dark current. High efficiency materials in substitution for Amorphous Selenium(a-Se) have been studied as a direct method of imaging detector in Digital Radiography to decrease dark current by using PN junction or Hetero junction already used as solar cell, semiconductor. Particle-In -Binder method is used to fabricate radiology image sensor because it has a lot of advantages such as fabrication convenient, high yield, suitability for large area sensor. But high leakage current is one of main problem in Particle-In -Binder method. To make up for the weak points, multi-layer technique is used, and it is considered that high efficient digital radiation sensor can be fabricated with easy and convenient process. In this study, electrical properties such as leakage current, sensitivity, signal linearity is measured to evaluate multi-layer radiation sensor material.

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Advanced Aluminum Welding Technologies for Productivity Improvement (생산성 향상을 위한 신개념 알루미늄 용접 방법)

  • Cho, Yong-Joon;Lee, So-Young;Chang, In-Sung;Do, Sung-Sup
    • Proceedings of the KWS Conference
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    • 2009.11a
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    • pp.19-19
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    • 2009
  • 최근, 유한한 에너지 자원의 한계와 지구 온난화 등으로 세계의 제조 산업은 새로운 국면을 맞이하고 있으며, 특히, 자동차 산업은 화석연료를 주 에너지원으로 사용한다는 점과 이 연료를 연소시킬 때 발생하는 이산화탄소가 지구 온난화의 주된 원인이 될 수 있다는 점에서 상기 문제들을 해결하기 위한 다양한 방법에 주목하고 있다. 그 중에서 자동차의 생산기술 측면에서 볼 때, 가장 중요한 이슈는 차체 경량화다. 자동차 차체는 자동차를 구성하고 있는 여러 가지 부품 중에서 약 40% 정도의 무게 비율을 차지하고 있기 때문에, 차체 경량화는 연비향상과 이산화탄소 배출가스 감소와 직접적인 관계를 가지고 있다. 다양한 차체 경량화 방법 중에서 가장 쉽게 접근할 수 있는 방법이 경량소재 적용에 의한 경량화 방법이다. 현재, 탄소섬유 강화 플라스틱과 같이 무게 절감 비율을 최대화 할 수 있는 소재들도 개발되어 일부 적용되고 있지만, 일반적으로 차체 경량화 소재로 가장 널리 사용되고 있는 소재는 알루미늄 합금이며, 이에 대한 차체 적용 비율이 점차로 높아지는 추세에 있다. 이에, 본 연구에서는 알루미늄 합금이 차체에 적용되었을 때의 장단점을 살펴보고, 알루미늄 합금을 적용한 차체 생산과정에서 유의해야 될 사항들과 이를 바탕으로 하는 생산성 극대화 방안에 대하여 고찰하였다. 먼저, 기존의 알루미늄 저항 점 용접공법의 단점을 최소화하고 대량생산 체계에 적합하도록 개발된 새로운 개념의 저항 점 용접 시스템에 대해 그 성능과 양산성을 검증하였다. 구리 전극과 알루미늄 피용접물 사이에 프로세스 테이프를 삽입하여 용접하는 이 시스템은 열전도성이 큰 알루미늄 용접부에서 저전류의 조건에서도 효과적으로 균일한 발열현상이 발생하게 하였으며, 전극 팁 드레싱 없이 모든 용접점이 항상 동일한 조건에서 용접이 이루어질 수 있도록 하였다. 용접 조건 설정에 있어서도 용접전류가 통전되는 순간에 전극 가압력을 자유로이 변형시켜 용접부 크랙 발생을 최소화할 수 있음을 확인하였다. 알루미늄의 또 다른 대표적인 접합방법인 아크용접에 있어서는 용접 입열량을 조절하여 용접변형을 최소화 할 수 있는 아크용접 시스템에 대해 양산성과 적용 타당성을 검토하였다. 와이어 송급 방향을 자유자재로 바꿀 수 있는 이 시스템의 특성에 의해 스패터를 최소화하면서 용융금속이 효과적으로 모재에 금속이행 될 수 있음을 확인하였으며, 판재, 압출재, 및 다이캐스팅재 등 다양한 차체 소재에 대한 용접 가능성 및 미그-레이저 하이브리드 용접과의 비교분석을 통하여 차체 박판 용접에서도 최소의 열변형으로 효과적으로 사용될 수 있음을 보였다.

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Cu Electroplating on the Si Wafer and Reliability Assessment of Low Alpha Solder Bump for 3-D Packaging (3차원 실장용 실리콘 웨이퍼 Cu 전해도금 및 로우알파솔더 범프의 신뢰성 평가)

  • Jung, Do Hyun;Lee, Joon Hyung;Jung, Jae Pil
    • Proceedings of the Korean Institute of Surface Engineering Conference
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    • 2012.11a
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    • pp.123-123
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    • 2012
  • 최근 연구되고 있는 TSV(Through Silicon Via) 기술은 Si 웨이퍼 상에 직접 전기적 연결 통로인 관통홀을 형성하는 방법으로 칩간 연결거리를 최소화 할 수 있으며, 부피의 감소, 연결부 단축에 따른 빠른 신호 전달을 가능하게 한다. 이러한 TSV 기술은 최근의 초경량화와 고집적화로 대표되는 전자제품의 요구를 만족시킬 수 있는 차세대 실장법으로 기대를 모으고 있다. 한편, 납땜 재료의 주 원료인 주석은 주로 반도체 소자의 제조, 반도체 칩과 기판의 접합 및 플립 칩 (Flip Chip) 제조시의 범프 형성 등 반도체용 배선재료에 널리 사용되고 있다. 최근에는 납의 유해성 때문에 대부분의 전자제품은 무연솔더를 이용하여 제조되고 있지만, 주석을 이용한 반도체 소자가 고밀도화, 고 용량화 및 미세피치(Fine Pitch)화 되고 있기 때문에, 반도체 칩의 근방에 배치된 주석으로부터 많은 알파 방사선이 방출되어 메모리 셀의 정보를 유실시키는 소프트 에러 (Soft Error)가 발생되는 위험이 많아지고 있다. 이로 인해, 반도체 소자 및 납땜 재료의 주 원료인 주석의 고순도화가 요구되고 있으며, 특히 알파 방사선의 방출이 낮은 로우알파솔더 (Low Alpha Solder)가 요구되고 있다. 이에 따라 본 연구는 4인치 실리콘 웨이퍼상에 직경 $60{\mu}m$, 깊이 $120{\mu}m$의 비아홀을 형성하고, 비아 홀 내에 기능 박막증착 및 전해도금을 이용하여 전도성 물질인 Cu를 충전한 후 직경 $80{\mu}m$의 로우알파 Sn-1.0Ag-0.5Cu 솔더를 접합 한 후, 접합부 신뢰성 평가를 수행을 위해 고속 전단시험을 실시하였다. 비아 홀 내 미세구조와 범프의 형상 및 전단시험 후 파괴모드의 분석은 FE-SEM (Field Emission Scanning Electron Microscope)을 이용하여 관찰하였다. 연구 결과 비아의 입구 막힘이나 보이드(Void)와 같은 결함 없이 Cu를 충전하였으며, 고속전단의 경우는 전단 속도가 증가할수록 취성파괴가 증가하는 경향을 보였다. 본 연구를 통하여 전해도금을 이용한 비아 홀 내 Cu의 고속 충전 및 로우알파 솔더 볼의 범프 형성이 가능하였으며, 이로 인한 전자제품의 소프트에러의 감소가 기대된다.

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A study on the manufacture of dissimilar metal jewelry using 3D printer (3D printer를 이용한 이종금속 주얼리 제작에 관한 연구)

  • Lee, Jung-Soo;Cha, Kyung-Chul
    • Journal of the Korean Crystal Growth and Crystal Technology
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    • v.26 no.1
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    • pp.19-22
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    • 2016
  • In the late 1990's implementation of CAD/CAM systems in 3D printer has been led to many changes in the jewelry industry. Low cost 3D printer has been started advertising in the jewelry in 2009 after expiration of key patents of FDM scheme. Mass jewelry production process will vary in appliance with direct production process of 3D printer production line. The studies presented in this variation is the jewelry manufacturing process using a 3D Printer and the different metals with different colors were also produced for bonding the prototype jewelry. Increasing the possibilities of 3D printer through them, presents a variety of jewelry mass production methods.

Development of Linear Annealing Method for Silicon Direct Bonding and Application to SOI structure (실리콘 직접 접합을 위한 선형가열법의 개발 및 SOI 기판에의 적용)

  • 이진우;강춘식;송오성;양철웅
    • Journal of the Korean institute of surface engineering
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    • v.33 no.2
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    • pp.101-106
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    • 2000
  • SOI (Silicon-On-Insulator) substrates were fabricated with varying annealing temperature of $25-660^{\circ}C$ by a linear annealing method, which was modified RTA process using a linear shape heat source. The annealing method was applied to Si ∥ $SiO_2$/Si pair pre-contacted at room temperature after wet cleaning process. The bonding strength of SOI substrates was measured by two methods of Razor-blade crack opening and direct tensile test. The fractured surfaces after direct tensile test were also investigated by the optical microscope as well as $\alpha$-STEP gauge. The interface bonding energy was 1140mJ/m$^2$ at the annealing temperature of $430^{\circ}C$. The fracture strength was about 21MPa at the temperature of $430^{\circ}C$. These mechanical properties were not reported with the conventional furnace annealing or rapid thermal annealing method at the temperature below $500^{\circ}C$. Our results imply that the bonded wafer pair could endure CMP (Chemo-Mechanical Polishing) or Lapping process without debonding, fracture or dopant redistribution.

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