• Journal of Aerospace System Engineering
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• v.17 no.2
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• pp.1-8
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• 2023

Power transmission shafts in rotary wing aircraft use a hollow shaft to reduce weight. We can apply linear elastic fracture mechanics to predict crack propagation behavior. This paper predicted crack growth life of a hollow shaft with a circumferential through-type crack by finite element analysis. A 2D finite element model was created by applying a torsion and forming elements considering cracks. We defined the initial crack length and performed the finite element analysis by increasing the crack length to derive stress intensity factor at crack tips. We defined the length just prior to the stress intensity factor exceeding the fracture toughness as the crack limit length. We calculated the crack limit length using a handbook and numerically integrated the crack growth rate equation to derive growth life of each crack. The growth life of each crack was compared to verify the proposed finite element analysis method.

• Journal of the Korean Society of Groundwater Environment
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• v.6 no.1
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• pp.42-47
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• 1999

This study considers pseudosteady-state flow to a restricted-entry well in a single or multilayer aquifer with crossflow. A simple method for calculating the pseudoskin factor caused by partial penetration is presented to overcome a limited applicability in geometrical or computational aspects of previous methods. The computation is based on the solution of a simplified pseudosteady-state equation that describes the long-time behavior of the closed radial system. We illustrate the applicability of this method to various types of cylindrical systems and provide the results graphically. Comparisons with previously published results have indicated that this method yields highly accurate estimates of pseu-doskin factor with minimum computational effort. This method has also shown to be particularly useful for geometrically-complicated systems. Greatly improved computational efficiency of pseudosteady-state approach permits the engineer to easily account for the effect of partial penetration on the late-time performance of a well.

• Proceedings of the KWS Conference
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• 2010.05a
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• pp.75-75
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• 2010

3D 패키징 기술은 전기소자의 소형화, 고용량화, 저전력화, 높은 신뢰성등의 요구와 함께 그 중요성이 대두대고 있다. 이러한 3D 패키징의 연결방법은 와이어 본딩 또는 플립칩등의 기존의 방법에서 TSV(Through Silicon Via)를 이용하여 적층하는 방법이 주목받고 있다. TSV는 기존의 와이어 본딩과 비교하여 고집적도, 빠른 신호전달, 낮은 전력소비 등의 장점을 가지고 있어 많은 연구가 진행되고 있다. TSV의 세부 공정 중 비아필링(Via filling)기술은 I/O수 증가와 미세피치화에 따른 비아(Via) 직경의 감소 및 종횡비(Via Aspect Ratio)증가로 인해 기존 필링 공정으로는 한계가 있다. 기존의 비아 홀(Via hole)에 금속을 필링하기 위한 방법으로 전기도금법이 많이 사용되고 있으나, 전기도금법은 전기도금액 조성, 첨가제의 종류, 전류밀도, 전류모드 등에 따라 결과물에 큰 차이가 발생되어, 최적공정조건의 도출이 어렵다. 또한 20um이하의 비아직경과 높은 종횡비로 인하여 충진시 void형성등의 문제점이 발생하기도 한다. 본 연구에서는 용융솔더와 진공을 이용하여 비아를 필링시켰다. 이 방법은 관통된 비아가 형성된 웨이퍼 양단에 압력차를 주어, 작은 직경을 갖는 비아 홀의 표면장력을 극복하고, 용융상태의 솔더가 관통된 비아 홀 내부로 필링되는 방법이다. 관통 비아홀이 형성 된 웨이퍼 위에 솔더페이스트를 $250^{\circ}C$이상 온도를 가해 용융상태로 만든 후 웨이퍼 하부에 진공을 형성하여 필링하는 방법과 용융솔더를 노즐을 통하여 위쪽으로 유동시켜 그 위에 비아홀이 형성된 웨이퍼를 접촉하고 웨이퍼 상부에 진공을 형성하여 필링하는 방법으로 실험을 각각 실시하였다. 이 때, 웨이퍼 두께는 100um이하이며 홀 직경은 20, 30um, 웨이퍼 상부와 하부의 진공차는 약 0.02~0.08Mpa, 진공 유지시간은 1~3s로 실시하여 최적 조건을 고찰하였다. 각 조건에 따른 필링 후 단면을 전자현미경(FE-SEM)을 통해 관찰하였다. 실험 결과 0.04Mpa 이상에서 1s내의 시간에 모든 비아홀이 기공(Void)없이 완벽하게 필링되는 것을 관찰하였으며 이 결과는 기존의 방법에 비하여 공정시간을 감소시켜 생산성이 대폭 향상 될 수 있는 방법임을 확인하였다.

• Journal of The Korean Association of Information Education
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• v.21 no.3
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• pp.297-307
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• 2017

The purpose of this study is to propose algorithm classification system for algorithm education for Elementary and Secondary Students. We defines the components of the algorithm and expresses the algorithm classification system by the analysis synthesis method. The contents of the study are as follows. First, we conducted a theoretical search on the classification purpose and classification. Second, the contents and limitations of the classification system for the proposed algorithm contents were examined. In addition, we examined the contents and selection criteria of algorithms used in algorithm education research. Third, the algorithm components were redefined using the core idea and crosscutting concept proposed by the NRC. And the crosscutting concept of algorithm is subdivided into algorithm data structure and algorithm design strategy, and its contents are presented using analytic synthesis classification scheme. Finally, the validity of the proposed contents was verified by the review of the expert group. It is expected that the study on the algorithm classification system will provide many implications for the contents selection and training method in the algorithm education.

• Proceedings of the Korea Water Resources Association Conference
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• 2004.05b
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• pp.547-551
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• 2004

연안유역으로 유입되는 소하천의 유량 및 오염물질의 농도는 유역의 기상상태(강우량 및 증발량), 토지피복도, 인공구조물의 운영규clr 등에 의하여 변화한다. 특히, 강우에 의한 오염부하량 변화는 평상시의 오염부하량에 비하여 그 변화량이 매우 크기 때문에 평상시의 측정간격으로는 보다 정확한 오염부하량 산정에 한계가 있다. 따라서, 본 연구에서는 충청남도 보령시를 관통하는 대천천을 대상으로 강우에 의한 오염부하량 변화를 연속적으로 측정하였다. 대천천은 상류지역에 청천저수지가 형성되어 있으며, 보령시내를 관통하는 과정에서 도시 오염물질이 유입되는 양상을 보이고 있으며, 천수만 입구지역으로 유입되는 지방하천이다. 유역오염부하량 계산에 필요한 유량은 보(weir)에서 측정한 수위자료를 이용하여 환산하였으며, 수온, 탁도 및 염도는 OBS-3A 장비를 이용하여 연속측정하였다. 또한, 영양염류의 오염물질 농도는 30분 간격으로 채수하여 분석하였다. 분석결과, 오염물질 항목에 따라 시간에 따른 오염부하량 변화양상이 매우 상이하게 나타났으며, 변화 폭도 매우 크게 나타나서 강우시의 오염부하량을 추정하기 위해서는 1시간 간격 이내의 관측자료를 이용하여 추정하는 방법이 타당한 것으로 파악되었다.

• Journal of the Earthquake Engineering Society of Korea
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• v.14 no.5
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• pp.23-31
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• 2010

In this study, a shaking table test was performed for the evaluation of the failure capacity of an anchor foundation system in the case of an aged condition. For the shaking table test, three kinds of specimens were manufactured as follows: 1) a non-damaged anchor; 2) a specimen with cracks running through the anchor; and 3) a specimen with cracks along the expected corn-shape fracture away from the anchor. A dynamic characteristic was determined through a measurement of the frequency response function (FRF), and the seismic capacity was evaluated by using a shaking table test. Failure capacities were calculated using an acceleration response and it was compared with the anchor design code.

• Journal of the Korean Society for Precision Engineering
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• v.20 no.12
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• pp.126-134
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• 2003

In order to investigate the effect of surface treatment in Aluminium alloy and Titanium alloy which are used to armor material during ballistic impact, a ballistic testing was conducted. Anodizing was used to achieve higher surface hardness of Aluminium alloy and Iron plating in PVD(Physical Vapor Deposition) method was used to achieve higher surface hardness of Titanium alloy. Surface hardness test were conducted using a Micro victor's hardness tester. Ballistic resistance of these materials was measured by protection ballistic limit(V-50), a statical velocity with 50% probability penetration. Fracture behaviors and ballistic tolerance, described by penetration modes, are respectfully observed from the results of V-50 test and Projectile Through Plates (PTP) test at velocities greater than V-50. PTP tests were conducted with 0$^{\circ}$obliquity at room temperature using 5.56mm ball projectile. V-50 tests were conducted with 0$^{\circ}$obliquity at room temperature with projectiles that were able to achieve near or complete penetration during PTP tests. Surface hardness, resistance to penetration. and penetration modes of surface treated alloy laminates are compared to those of surface non-treated alloy laminates. A high speed photography was used to analyze the dynamic perforation phenomena of the test materials.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.27 no.1
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• pp.26-33
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• 2003

Based on detailed FE limit analyses, the present paper provides tractable approximations fer plastic limit pressure solutions fur axially through-wall-cracked pipe; axially (inner) surface-cracked pipe; circumferentially through-wall-cracked pipe; and circumferentially (inner) surface-cracked pipe. In particular, for surface crack problems, the effect of the crack shape, the semi-elliptical shape or the rectangular shape, on the limit pressure is quantified. Comparisons with existing analytical and empirical solutions show a large discrepancy in circumferential short through-wall cracks and in surface cracks (both axial and circumferential). Being based on detailed 3-D FE limit analysis, the present solutions are believed to be the most accurate, and thus to be valuable information not only for plastic collapse analysis of pressurised piping but also for estimating non-linear fracture mechanics parameters based on the reference stress approach.

• Journal of Welding and Joining
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• v.12 no.3
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• pp.82-89
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• 1994

In this paper the effect of stress ratio on the fatigue crack growth rate of aluminum alloy A5083-O was examined. The fatigue tests were carried out using CCT (center cracked tension) specimens and CT(compact tension) specimens which were subjected to 0.5 and -1.0 stress ratio respectively. The obtained results are as follows; 1) The $\DeltaK_{th}$ as the function of stress ratio R was introduced in evaluating the fatigue crack growth rate of A5083-O. 2) A new model evaluating the effect of stress ratio on the fatigue crack growth rate was developed over the region of low and high propagation rate.

• Korean Chemical Engineering Research
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• v.54 no.6
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• pp.723-733
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• 2016

Intensive researches have been focused on the 3-dimensional packaging technology using through silicon via (TSV) to overcome the limitation in Cu interconnection scaling. Void-free filling of TSV by the Cu electrodeposition is required for the fabrication of reliable electronic devices. It is generally known that sufficient inhibition on the top and the sidewall of TSV, accompanying the selective Cu deposition on the bottom, enables the void-free bottom-up filling. Organic additives contained in the electrolyte locally determine the deposition rate of Cu inside the TSV. Investigation on the additive chemistry is essential for understanding the filling mechanisms of TSV based on the effects of additives in the Cu electrodeposition process. In this review, we introduce various filling mechanisms suggested by analyzing the additives effect, research on the three-additive system containing new levelers synthesized to increase efficiency of the filling process, and methods to improve the filling performance by modifying the functional groups of the additives or deposition mode.