• Asian-Australasian Journal of Animal Sciences
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• v.27 no.7
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• pp.965-973
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• 2014

Three studies were conducted to investigate whether a chelated Cu can replace $CuSO_4$ as a growth promoter in pigs. In Exp. 1, a total of 240 piglets (Large White${\times}$Landrace, $7.36{\pm}0.10kg$) were randomly allocated to 1 of 3 treatments with 8 replicates and 10 piglets per pen. Treatments included a NRC control ($CuSO_4$, 6 mg/kg), two Cu supplementations from either $CuSO_4$ or $Cu(HMTBa)_2$ at 170 mg/kg. Pigs fed $Cu(HMTBa)_2$ were 6.0% heavier than pigs fed either the NRC control or 170 mg/kg $CuSO_4$ (p = 0.03) at the end of the experiment. During the 42 days of experimental period, pigs fed $Cu(HMTBa)_2$ gained 9.0% more (p = 0.01), tended to eat more feed (p = 0.09), and had better feed efficiency (p = 0.06) than those fed $CuSO_4$. Compared with the 6 mg/kg $CuSO_4$ NRC control, liver Cu was increased 2.7 times with 170 mg/kg $CuSO_4$ supplementation, and was further increased with $Cu(HMTBa)_2$ (4.5 times, p<0.05). In Exp. 2, a total of 616 crossbred piglets (PIC, $5.01{\pm}0.25kg$) were randomly allocated to 1 of 4 treatments with 7 replicates and 22 piglets per pen. Treatments included a NRC control (from $CuSO_4$), and three pharmaceutical levels of Cu (150 mg/kg) supplemented either from C$CuSO_4$, tri-basic copper chloride ($Cu_2[OH]_3C1$), or $Cu(HMTBa)_2$. Pigs fed $CuSO_4$ or $Cu(HMTBa)_2$ had better feed efficiency (p = 0.01) and tended to gain more (p = 0.08) compared with those fed the NRC control. Pigs fed $Cu_2[OH]_2C1$ were intermediate. Pigs fed $Cu(HMTBa)_2$ had the highest liver Cu, which was significantly higher than those fed ($Cu_2[OH]_3C1$) or the negative control (p = 0.01). In Exp. 3, a total of 1,048 pigs (PIC, $32.36{\pm}0.29kg$) were allotted to 6 treatments with 8 replicates per treatment and 20 to 22 pigs per pen. The treatments included a NRC control with 4 mg/kg Cu from $CuSO_4$, a positive control with 160 mg/kg Cu from $CuSO_4$, and incremental levels of $Cu(HMTBa)_2$ at 20, 40, 80, and 160 mg/kg. During the overall experimental period of 100 days, no benefit from 160 mg/kg $CuSO_4$ was observed. Pigs fed $Cu(HMTBa)_2$ had increased ADG (linear and quadratic, $p{\leq}0.05$) and feed efficiency (linear and quadratic, $p{\leq}0.05$) up to 80 mg/kg and no further improvement was observed at 160 mg/kg for the whole experimental period. Pigs fed 80 mg/kg $Cu(HMTBa)_2$ weighed 1.8 kg more (p = 0.07) and were 2.3 kg heavier in carcass (p<0.01) compared with pigs fed 160 mg/kg $CuSO_4$. In addition, loin depth was increased with increased $Cu(HMTBa)_2$ supplementation with pigs fed 80 mg/kg $Cu(HMTBa)_2$ had the greatest loin depth (p<0.05). In summary, $Cu(HMTBa)_2$ can be used to replace high $CuSO_4$ as a growth promoter in nursery and grower-finisher pigs.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2013.05a
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• pp.183-183
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• 2013

본 연구는 전착법으로 형성된 $Cu_2O$ 박막의 광특성 변화를 고찰한 것이다. 0.3M $CuSO_4$과 4M Lactic acid에 4M NaOH로 전해액의 pH를 조절하여 $Cu_2O$ 박막의 결정성 및 극성을 조절하였다. $Cu_2O$ 박막의 결정성 및 극성에 따른 광특성을 고찰한 결과, 극성인 (111)면에서 광특성이 우수함을 확인하였다. 하지만, 측정시간의 증가에 따라 표면에 Cu 금속이 형성되어 광전류가 감소함을 확인 할 수 있었다. rGO는 페르미전위가 $Cu_2O$ 환원 전위보다 위쪽에 위치한다. 따라서 $Cu_2O$ 박막위에 rGO를 형성시켜 Cu 발생반응을 제한하고 광전류를 증가시키고자한다.

• Journal of Powder Materials
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• v.13 no.1 s.54
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• pp.33-38
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• 2006

The effect of Cu content on microstructure and mechanical properties of nano-sized Cu dispersed $Al_2O_3(Al_2O_3/Cu)$ nanocomposites was investigated. The nanocomposites with Cu content of 2.5 to 10 vol% were prepared by reduction and hot-pressing of $Al_2O_3/CuO$ powder mixtures. The nanocomposites with Cu content of 2.5 and 5vol% exhibited the maximum fracture strength of 820MPa and enhanced toughness compared with monolithic $Al_2O_3$. The strengthening was mainly attributed to the refinement of $Al_2O_3$ matrix grains. The toughening mechanism was discussed by the observed microstructural feature based on crack bridging.

• Analytical Science and Technology
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• v.10 no.4
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• pp.291-299
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• 1997

2,2'-iminodibenzoic acid-cellulose was prepared by reacting 2,2'-iminodibenzoic acid salt with cellulose-Cl obtained by chlorination of cellulose-OH which is the major component of sawdust. The adsorptivity of Pb(II) and Cu(II) was studied using the synthetic chelating adsorbent. The adsorption amounts of those ions increased with increasing pH and the optimum adsorption time of metal ion was about 1hr. The adsorptivity of Pb(II) was larger than that of Cu(II).

• Korean Journal of Metals and Materials
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• v.49 no.3
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• pp.250-255
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• 2011

The basic properties and electrical characteristics of sputtering films deposited with a commercial cast target and Spark Plasma Sintering (SPS) were compared and analyzed. From the results, the Cu film prepared heating $60^{\circ}C/min$ (SPS process) showed a similar specific resistance compared to the commercial cast Cu film. Also, auording to the results of XRD, SIMS, and TEM. There was not much difference in the crystal structure and impurities between the two films. Consequently, the SPS Cu target was found to have quite similar properties with the commercial one and it is expected to be applied in futare research to the metal wiring material for semiconductor/display devices.

• Journal of the Korean Chemical Society
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• v.62 no.2
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• pp.79-86
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• 2018

This study reported the adsorption of Cu(II) ions onto activated carbon prepared from Myristica Fragrans shell (MFS AC) over independent variables of contact time, activating chemical (NaOH) concentration, initial adsorbate concentration, initial pH of adsorbate solution and adsorption temperature. The MFS AC structure, morphology and total surface area were characterized by FTIR, SEM and BET techniques, respectively. The Cu(II) ions adsorption on the MFS AC (activated using 0.5 M NaOH) fitted best to Freundlich adsorption isotherm (FAI), and the FAI constant obtained was 0.845 L/g at $30^{\circ}C$ and pH 4.5. It followed the pseudo first order of adsorption kinetic (PFOAK) model, and the PFOAK based adsorption capacity was 107.65 mg/g. Thermodynamic study confirmed the Cu(II) ions adsorption should be exothermic and non-spontaneous process, physical adsorption should be taken place. The total surface area and pore volume based on BET analysis was $99.85m^2/g$ and 0.086 cc/g, respectively.

• Korean Journal of Metals and Materials
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• v.48 no.6
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• pp.557-564
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• 2010

Formation of Sn through-silicon-via (TSV) and its interconnection processes were studied in order to form a three-dimensional interconnection structure of chip-stack packages. Different from the conventional formation of Cu TSVs, which require a complicated Cu electroplating process, Sn TSVs can be formed easily by Sn electroplating and reflow. Sn via-filling behavior did not depend on the shape of the Sn electroplated layer, allowing a much wider process window for the formation of Sn TSVs compared to the conventional Cu TSV process. Interlocking joints were processed by intercalation of Cu bumps into Sn vias to form interconnections between chips with Sn TSVs, and the mechanical integrity of the interlocking joints was evaluated with a die shear test.

• Journal of the Korean Chemical Society
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• v.24 no.2
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• pp.129-138
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• 1980

The formation constants of the mixed-ligand complexes in the Cd(II), Cu(II) and Pb(II)-Trien-OH system were studied by polarograph. The formation constant $(log{\beta}_{ij})$ was determined at $25^{\circ}C$ in the ionic strength of 0.1. It was also confirmed that the mixed ligand complexes in this system were formed above pH 10.2, 10.5 and 9.0 for Cu(II), Cd(II) and Pb(II) by the calculation of the distribution for complexes at the various pH. Masking of Cd(II) by conversion to anionic EDTA-complexes has been used to separate Cu(II) from Cd(II) through passage of a combined Trien-EDTA solution on an cationic resin column. The optimal condition for the separation of Cu(II) from Cd(II) is confirmed at the pH range above 9.0, not only by considering the theoretical equation of the conditional-exchange-constant of metal on the cation exchange resin,but also by calculating the distribution of the mixed ligand complexes in the resin at the various pH with computer. By analyzing the synthetic sample of Cu(II) and Cd(II) with a EDTA masking at pH 9.5, it is found that the results of the experiment are satisfied with the theoretical value.

• Polymer(Korea)
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• v.25 no.2
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• pp.302-310
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• 2001

Cu/PET film composites were prepared by electroless copper plating method. In order to improve adhesion between electroless Cu plated layer and polyester (PET) film, the effect of pretreatment conditions such as etching method and mixed catalyst composition, and accelerator was investigated. Compared to NaOH etching medium, PET film was more finely etched by HCl solution, resulting in an improvement in adhesion between Cu layer and PET film. However, there were no significant differences in electromagnetic interference shielding effectiveness as a function of etching medium. The surface morphology of Cu plated PET film revealed that Pd/Sn colloidal particles became more evenly distributed in the smaller size by increasing the molar ratio of PdCl$_2$ : SnCl$_2$ from 1 : 4 to 1 : 16. With increasing the molar ratio of mixed catalyst, the adhesion and the shielding effectiveness of Cu plated PET film were increased. Furthermore, HCl was turned out to be a better accelerator than NaOH in order to enhance the activity of the mixed PdCl$_2$/SnCl$_2$ catalyst, which facilitated the formation of more uniform copper deposit on the PET film.

• Journal of the Korean Chemical Society
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• v.30 no.6
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• pp.526-531
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• 1986

The stability constants of 1,15-diaza-3,4:12,13-dibenzo-5,8,11-trioxacycloheptadecane (NenOdien H$_4$, L) with transition metal ions such as $Co^{2+},\;Ni^{2+},\;Cu^{2+},\;and\;Zn^{2+}$ have been determined by potentiometry in 95% methanol solution at 25$^{\circ}$C. The complex formation of the NenOdien $_4$ with the transition metal ions depends on the basicity of the donor atoms. The order of complex stability was Co(II) < Ni(II) < Cu(II) > Zn(II). The geometries of the complexes in solid state were discussed by visible-near infrared and infrared spectrophotometry, elemental analysis and electro-conductivity. The results suggest that the geometries of the solid complexes are octahedral for $[CoL_2(OH_2)Cl]Cl{\cdot}2H_2O$, $[NiL_2(OH_2)Cl]Cl{\cdot}2H_2O$, and $[ZnLCl_2]{\cdot}\frac{1}{2}H_2O$ and square pyramidal for [CuLCl]Cl, respectively.