Korean Journal of Metals and Materials (대한금속재료학회지)

The Korean Institute of Metals and Materials (대한금속재료학회)
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Evaluation of the Cu Target Fabricated by the SPS Technique and its Sputtered Film

방전플라즈마 소결법에 의해 제조된 Cu 타겟과 스퍼터링 박막의 특성평가

  • Hyun, Hye Young (Measurement & Analysis Team, National Nanofab Center, Korea Institute of Industrial Technology) ;
  • Kim, Min Jung (Measurement & Analysis Team, National Nanofab Center) ;
  • Yoo, Jung Ho (Measurement & Analysis Team, National Nanofab Center) ;
  • Yang, Jun-Mo (Measurement & Analysis Team, National Nanofab Center) ;
  • Oh, Ik Hyun (Korea Institute of Industrial Technology) ;
  • Lee, Seung Min (Korea Institute of Industrial Technology) ;
  • Oh, Yong Jun (Applied Materials Science and Engineering Division, Hanbat National University)
  • 현혜영 (나노종합팹센터 특성평가팀, 한밭대학교응용소재학과) ;
  • 김민정 (나노종합팹센터 특성평가팀) ;
  • 유정호 (나노종합팹센터 특성평가팀) ;
  • 양준모 (나노종합팹센터 특성평가팀) ;
  • 오익현 (한국생산기술연구원) ;
  • 이승민 (한국생산기술연구원) ;
  • 오용준 (한밭대학교 응용소재학과)
  • Received : 2010.08.30
  • Published : 2011.03.25
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Abstract

The basic properties and electrical characteristics of sputtering films deposited with a commercial cast target and Spark Plasma Sintering (SPS) were compared and analyzed. From the results, the Cu film prepared heating $60^{\circ}C/min$ (SPS process) showed a similar specific resistance compared to the commercial cast Cu film. Also, auording to the results of XRD, SIMS, and TEM. There was not much difference in the crystal structure and impurities between the two films. Consequently, the SPS Cu target was found to have quite similar properties with the commercial one and it is expected to be applied in futare research to the metal wiring material for semiconductor/display devices.

Keywords

Acknowledgement

Supported by : 지식경제부

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