• Proceedings of the Korean Vacuum Society Conference
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• 2012.08a
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• pp.423-423
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• 2012

Recently, many researchers made progress in various studies improving the efficiency of dye-sensitized solar cell. In this paper, we used glass textured by wet-chemical etching process for improvement of photocurrent density in dye-sensitized solar cells. This is owing to increase coefficient of light utilization. Consequently, DSSC using the textured glass exhibit a Jsc of 9.49 mA/$cm^2$, a Voc of 0.73 V and a fill factor (FF) of 0.67 with an overall conversion efficiency of 4.64. This result showed increasing of 20% current density and 16% conversion efficiency using the textured glass. These results suggested that glass texturing was very effective in controlling the light-scattering properties into the photovoltaic cell.

• Proceedings of the Korean Vacuum Society Conference
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• 2016.02a
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• pp.161.1-161.1
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• 2016

박막 태양전지의 광 산란을 위한 텍스쳐 된 표면은 반사 손실을 감소시키기 위한 것이다. 그러나, 투명한 전극(TCO)의 텍스쳐 된 표면은 빛의 가용성을 제한하고, 장파장 영역에서 haze의 수치를 감소시키며, 전반사의 증가는 박막 태양전지의 Jsc를 감소시킨다. 본 논문에서는 높은 빛의 가용성을 위하여 HF+HCl 혼합용액을 이용하여 표면의 질을 향상시키기 위한 해결책을 제시했다. 같은 HF+HCl 혼합용액을 사용하여, 540 nm의 파장에서 약 85 %의 높은 haze 수치를 달성했으며, ZnO:Al 막의 증착 후에 식각된 유리 기판과 함께 비교했을 때, 2.3%의 haze 수치의 감소를 얻었다. 또, 깊은 습식 식각에 의하여 Haze 수치를 증가시키기 위한 메커니즘 간단히 설명했다. 텍스쳐 된 유리 기판의 haze 수치의 측면에서 광학 이득은 일반적인 Asahi FTO 유리(${\lambda}=540nm$의 13.5%)에 비해 상당히 높다. 이러한 높은 haze 수치의 AZO 박막은 박막 태양전지의 Jsc를 개선하는데 이용할 수 있다.

• Proceedings of the Korean Society of Propulsion Engineers Conference
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• 2009.11a
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• pp.289-292
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• 2009

The fabrication method of glass bipolar plates for micro PEM fuel cell application has been established and performance evaluation has been carried out. The advantages of glass bipolar plates for micro PEM fuel cells are light weight, high chemical resistivity, and easy manufacture. The MEMS fabrication process of anisotropic wet etching, thermal & UV bonding along with metal layer deposition has been introduced. From performance evaluation, it was shown that the micro fuel cell with a metal layer deposited on the reactive area yielded higher power density than the one without it. But both power densities of the two cases showed out to be adequate with the current status of micro fuel cell technology.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.07b
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• pp.912-915
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• 2004

Inductors material utilized in the downsizing passive devices and Rf components requires the physical and electrical properties at given area such as inductors thickness reduction, inductance and q-factor increase, low leakage current and thermal stability. In this study, Spiral inductors on the $SiO_2/Si$(100) substrate were fabricated by the magnetron sputtering method. Cu thin film with the thickness of $2{\mu}m$ was deposited on the substrate. Also we fabricated square inductors through the wet chemical etching technique. The inductors are completely specified by the turn width and the spacing between spirals. Both the width and spacing between spirals were varied from 10 to $60{\mu}m$ and from 20 to $70{\mu}m$, respectively. Inductance and Q factor dependent on the RF frequency were investigated to analyze performance of inductor arrays

• Korean Journal of Optics and Photonics
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• v.6 no.2
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• pp.148-155
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• 1995

The low loss single-mode $Al_{0.042}Ga_{0.958}As/GaAs/Al_{0.042}Ga_{0.958}As$ strip-loaded waveguides had been designed using an effective index method and fabricated using a MOCVD technique and chemical wet etching method. The propagation loss and facet reflectivity were measured by the Fabry-Perot resonance method and sequential cleaving experiment at $1.31{\mu}m$ wavelength. As a result, the propagation loss is as low as 0.62 dB/cm and the facet refiectivity(R) equals to 0.299 for straight waveguides with width $ w=4.1{\mu}m$..

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.25 no.1
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• pp.58-61
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• 2012

In our report a relatively simple process for fast nano-texturing of p-type(100) CZ- silicon surface using silver catalyzed wet chemical etching in aqueous hydrofluoric acid (HF) and hydrogen peroxide solution($H_2O_2$) at room temperature. The wafers were saw-damaged by NaOH(6 wt%) at $60^{\circ}C$ for 150s. To obtain a nano-structured black surface, a thin layer of silver with thickness of 1 - 10 nm was deposited on the surfaces by evaporation system. After this process the samples were etched in HF : $H_2O_2$ : $H_2O$ = 1:5:10 at room temperature for 80s - 220s. Due to the local catalytic of the Ag clusters, this treatment results in the nano-scale texturing on the surface. This resulted in average reflectance values less than 9% after the silver on the surface of the wafers were removed.

• The Transactions of the Korean Institute of Electrical Engineers C
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• v.49 no.7
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• pp.375-381
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• 2000

In this paper, we described the characterization of High-Tc Superconducting(HTS) microstrip antenna using non-radiating edge feeding technique and reported the microwave properties of HTS antennas with temperature. To do this, we prepared the $YBa_2Cu_3O_{7-x}$ superconducting thin film on MgO substrate using pulse-laser deposition techniques. The HTS microstrip antenna using non-radiating feeding technique was fabricated using chemical wet-etching. Then it was compared with identical antenna patterned with evaporated gold. The diverse measured results have been reported in terms of the input impedance, resonant frequency and return loss. In additional, at around the critical temperature, the effect of kinetic inductance which affect the resonant characteristic of the HTS microstrip antenna was reported.

• Transactions on Electrical and Electronic Materials
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• v.3 no.1
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• pp.4-8
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• 2002

The typical mold method for FED (field emission display) fabrication is used to form a gate electrode, a gate oxide layer, and emitter tip after fabrication of a mold shape using wet-etching of Si substrate. However, in this study, new mold method using a side wall space structure was developed to make sharp emitter tips with the gate electrode. In new method, gate oxide layer and gate electrode layer were deposited on a Si wafer by LPCVD (low pressure chemical vapor deposition), and then BPSG (Boro phosphor silicate glass) thin film was deposited. After then, the BPSG thin film was flowed into the mold at high temperature in order to form a sharp mold structure. TiN was deposited as an emitter tip on it. The unfinished device was bonded to a glass substrate by anodic bonding techniques. The Si wafer was etched from backside by KOH-deionized water solution. Finally, the sharp field emitter array with gate electrode on the glass substrate was formed.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2005.07a
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• pp.655-656
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• 2005

In the future, plastic based system will play a crucial role in modem life, for examples, transparent display or disposable electronics and so on. In this paper, we introduced a new method to fabricate the metal line on the plastic substrate. Metal lines were fabricated by hot embossing and CMP process on PMMA (polymethylmethacrylate) substrates. A Si mold was made by wet etching process and a PMMA wafer was cut off from I mm thick PMMA sheet. A 100 nm thick Al was deposited on PMMA wafers. The Al deposited PMMA wafer and the Si mold carefully sandwiched which was directly imprinted by hot embossing. After imprinting process, a residual Al layer was removed by CMP process. Finally, we found the entire process may be very useful to fabricate the metal line on plastic substrates.

• Journal of Industrial and Engineering Chemistry
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• v.68
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• pp.387-392
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• 2018

Various technical approaches and concepts have been proposed to develop conductive super-hydrophobic (SH) surfaces. However, most of these approaches are not usable in practical applications because of insufficient adhesion and cost issues. Additionally, durability and uniformity issues are still in need of improvement. The goal of this research is to produce a large-area conductive SH surface with improved adhesion performance and uniformity. To this end, carbon nanotubes (CNT) with a high aspect ratio and elastomeric polymer were utilized as a conductive filler and matrix, respectively, to form a coating layer. Additionally, nanoscale silica particles were utilized for stable implementation of the conductive SH surface. To improve the adhesion properties between the SH coating layer and substrate, pretreatment of the substrate was conducted by utilizing both wet and dry etching processes to create specific organic functional groups on the substrate. Following pretreatment of the surface, a zirco-aluminate coupling agent was utilized to enhance adhesion properties between the substrate and the SH coating layer. Raman spectroscopy revealed that adhesion was greatly improved by the formation of a chemical bond between the substrate and the SH coating layer at an optimal coupling agent concentration. The developed conductive SH coating attained a high electromagnetic interference (EMI) shielding effectiveness, which is advantageous in self-cleaning EMI shielding applications.