• Journal of the Semiconductor & Display Technology
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• v.9 no.1
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• pp.23-28
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• 2010

In this paper, wafer drop from wafer guide mechanism, which is one of the serious problems in water transfer robot, is analyzed, and new wafer guide mechanisms are proposed to minimize this drop. Three types of new wafer guide mechanisms are proposed: roller type, gear type and L-shape rocker type. We choose one of the proposed mechanism, which is roller type, and verified this mechanism through real transfer experiment. Wafer picking up test is conducted with initial aligning error for simulating the wafer drop. Number of drop is compared between conventional mechanism and proposed mechanism. As a result, we can find the proposed mechanism can reduce the number of wafer drop dramatically.

• Proceedings of the Korean Society Of Semiconductor Equipment Technology
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• 2007.06a
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• pp.174-178
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• 2007

The cleaning process to remove small particles, ions, and other polluted sources is one of the major parts in the recent semiconductor industry because it can cause fatal errors on the quality of the final products. According to the other reports, the major factors of bath's fluid motion are the cleaning method, nozzle, the geometry (of bath, guide and wafer), and the position (of guide and wafer). So to enhance cleaning efficiency in the bath, these factors must be controlled. The purpose of this study is to analyze and visualize fluid motion in the cleaning bath as basic data for designing the nozzle system and finding the process control parameters. For that, we used the general CFD code FLUENT.

• Journal of the Semiconductor & Display Technology
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• v.20 no.4
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• pp.171-176
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• 2021

Die-to-wafer (D2W) hybrid bonding in the multilayer semiconductor manufacturing process is one of wafer direct bonding, and various studies are being conducted around the world. A noteworthy point in the current die-to-wafer process is that a lot of voids occur on the bonding surface of the die during bonding. In this study, as a suggested method for removing voids generated during the D2W hybrid bonding process, a flexible mechanism for implementing convex for die bonding to be applied to the bond head is proposed. In addition, modeling of flexible mechanisms, analysis/design/control/evaluation of static/dynamics properties are performed. The proposed system was controlled by capacitive sensor (lion precision, CPL 290), piezo actuator (P-888,91), and dSpace. This flexure mechanism implemented a working range of 200 ㎛, resolution(3σ) of 7.276nm, Inposition(3σ) of 3.503nm, settling time(2%) of 500.133ms by applying a reverse bridge type mechanism and leaf spring guide, and at the same time realized a maximum step difference of 6 ㎛ between die edge and center. The results of this study are applied to the D2W hybrid bonding process and are expected to bring about an effect of increasing semiconductor yield through void removal. In addition, it is expected that it can be utilized as a system that meets the convex variable amount required for each device by adjusting the elongation amount of the piezo actuator coupled to the flexible mechanism in a precise unit.

• Journal of International Society for Simulation Surgery
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• v.3 no.2
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• pp.87-89
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• 2016

Le fort 1 osteotomy surgery is one of the most popular surgical methods for the treatment of patients with facial bone deformities. An intermediate wafer splint is used to fix the bone segment to the planned position, but there are many steps that can cause errors. To reduce these errors, we propose a method of using a surgical guide made with virtual surgical simulation.

• Journal of the Korean institute of surface engineering
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• v.32 no.3
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• pp.239-243
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• 1999

At Present, 200mm wafer technology is being applied for commercial fabrications of 64, 128, and 256 M DRAM devices, and 300mm technology will be evolved for 1G DRAM devices in the early 21th century, recognizing limitations of several process technologies. In particular recognition has been realized in harmful effects of surface contamination of trace metals introduced during devicing processes. Such a guide line for surface metal contamination has been proposed as 1E9 and 1E10 atoms/$\textrm{cm}^2$ of individual metal contamination for wafering and devicing of 1G DRAM, respectively, and so its measurement limit should be at least 1E8 atoms/$\textrm{cm}^2$. The detection limit of present measurement systems is 2E9 atoms/$\textrm{cm}^2$ obtainable with TRXFA(Total Reflection X-Ray Fluorescence Analysis). TRXFA is nondestructive and the simplest in terms of operation, and it maps the whole wafer surfaces but needs detection improvement. X-Ray intensity produced with synchrotron accelerator is much higher than that of conventional X-ray sources by order of 4-5 magnitudes. Hence theoretically its reactivity with silicon surfaces is expected to be much higher than the conventional one, realizing improvement of detection limit. X-ray produced with synchrotron accelerator is illuminated at a very low angle with silicon wafer surfaces such as 0.1 degree and reflects totally. Hence informations only from surface can be collected and utilized without overlapping with bulk informations. This study shows the total reflection phenomenon and quantitative improvement of detection limit for metallic contamination. It is confirmed that synchrotron X-ray can be a very promising alternative for realizing improvement of detection limit for the next generation devices.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.22 no.6
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• pp.996-1002
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• 2013

This study addresses the development of a full duplex robotic system for transferring flat-panel display glass. We propose to accomplish this using a bidirectional linear transfer mechanism in place of the conventional rotary transfer mechanism. The developed full duplex robot comprises a driving part that carries the glass panel laterally, vertical part that can be moved up and down by means of a ball screw and linear motion guide arrangement, and hand part that slides by the cylinder of the driving part along the guide rail with a V-guide bearing attached to the bottom of the support. In addition, an alignment part prevents the hand part from derailing and holds the hand part while the driving part moves horizontally. The full duplex robot lifts and drives a glass panel directly while transferring it to the buffer and does not require rotational motion. Therefore, both transferring and stacking are realized with a single device. This device can be used in existing industrial facilities as an alternative to existing industrial robots in current as well as future process lines. The proposed full duplex robot is expected to save considerable amounts of time and space, and increase product throughput.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.23 no.4
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• pp.392-397
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• 2014

Recently, there is an increase in the need for precision linear stages with vacuum compatibility in such areas as lithography equipment for wafer or mask manufacturing, mask mastering equipment for optical data storage and electron beam equipment. A simple design, high stiffness and low cost can be achieved by using ball bearings. However, a ball bearing have friction and wear problems just as in ambient air. In order to decrease the friction, a special finish, a diamond-like carbon (DLC) film coating, is applied to the surface of a guide rail by sputtering deposition. This paper presents the result of an experimental investigation on the control performance of a ball bearing-guided linear motion stage under two environmental conditions: in air and vacuum. A comparison between the results with and without the DLC coating was also considered in the experimental investigation.

• Journal of the Korean Society for Precision Engineering
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• v.23 no.9 s.186
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• pp.174-178
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• 2006

Pyramid shape of micro pattern is applied to the light guide panel (LGP) to enhance the uniformity of the brightness of the LCD. The micro pyramids are molded in intaglio on the surface of the LGP. The size of each pyramid is 5$\mu$m $\times$ 5$\mu$m on bottom and the height is about 3.5$\mu$m. The pyramids are distributed on the LGP surface randomly to be sparser where the light comes in and denser at the opposite side as a result of a simulation using lightools$^{TM}$ Based on this design, a silicon pattern master and a nickel stamper are fabricated by MEMS process and electro plating process. Intaglio micro pyramids are fabricated on the 6' of silicon wafer from the anisotropic etching using KOH and the process time, temperature of the KOH solution, etc are optimized to obtain precise shape of the pattern. A Wi stamper is fabricated from this pattern master by electro plating process and the embossed pyramid patterns turns out to be well defined on the stamper. Adopting this stamper to the mold base with two cavities, 1.8' and 3.6' LGPs are injection molded.

• Journal of the Korean Society for Precision Engineering
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• v.22 no.12 s.177
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• pp.34-41
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• 2005

There is a strong demand fur the contactless transportation device fur a hard disk and silicon wafer without contaminating and damaging them. To fulfill this requirements, A transportation device fur them has been proposed. But the device needs many of costly displacement sensors positioned along the transportation interval and possesses a very complicated controller and driving scheme. To overcome those kinds of drawback, in this paper, we present a very simple and cost-effective transportation device which only consists of a linear guide, very simple electrostatic suspension system and driving circuit of stepping motor. The principle of stable suspension by relay feedback control, derivation of lateral restoring force, the design of transportation system are described, fellowed by the experimental system. Experimental results show that a 3.5-inch hard disk has been transported with a speed of approximately 20mm/s while being suspended stably at a gap of 0.25mm.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2006.05a
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• pp.533-534
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• 2006

Micro pyramid pattern and its array are designed to enhance the brightness and its uniformity of LGP which is one of key parts in LCD. The designed micro pyramid patterns are fabricated on a Si-wafer first through MEMS process and then a Ni-stamper is electro-plated from the Si pattern master. Adopting the fabricated Ni-stamper, LGPs are injection molded at different mold temperatures and the fidelity of the pattern replication is estimated for each molding conditions and pattern locations. The replicated patterns are found to have some defect such as local short shot or micro weld line which are believed to have negative effect on the performance of the LGP.