• Transactions on Electrical and Electronic Materials
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• v.16 no.6
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• pp.312-316
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• 2015

Through silicon via (TSV) technology holds the promise of chip-to-chip or chip-to-package interconnections for higher performance with reduced signal delay and power consumption. It includes high aspect ratio silicon etching, insulation liner deposition, and seamless metal filling. The desired etch profile should be straightforward, but high aspect ratio silicon etching is still a challenge. In this paper, we investigate the use of etch hard mask for finer TSVs etching to have clear definition of etched via pattern. Conventionally employed photoresist methods were initially evaluated as reference processes, and oxide and metal hard mask were investigated. We admit that pure metal mask is rarely employed in industry, but the etch result of metal mask support why hard mask are more realistic for finer TSV etching than conventional photoresist and oxide mask.

• Journal of the Semiconductor & Display Technology
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• v.2 no.3
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• pp.7-11
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• 2003

In this research, the etching characteristics of via contact and deep contact hole have been studied using multi-pole inductively coupled plasma(MICP) etching system. We investigated Plasma density of MICP source using the Langmuir probe and etching characteristics with RF frequency, wall temperature, chamber gap, and gas chemistry containing Carbon and Fluorine. As the etching time increases, formation of the polymer increases. To improve the polymer formation, we controlled the temperature of the reacting chamber, and we found that temperature of the chamber was very effective to decrease the polymer thickness. The deep contact etch profile and high selectivity(oxide to photoresist) have been achieved with the optimum mixed gas ratio containing C and F and the temperature control of the etching chamber.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.16 no.5
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• pp.3407-3411
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• 2015

In the process of extending the UML model for a various domain, comply with the UML metamodel and it is possible to obtain a number of advantages. However, the UML metamodel is necessary to redefine the diagram must be defined via the Profile in order to expand and transformation the UML metamodel from a variety of sources using the UML metamodel is becoming increase massive scale. it is necessary to use only those extracts the element relative to the target to be used to extend a UML metamodel. Used to re-define the extension of the UML Metamodel and Profile based UML modeling tools and metadata repositories by analysis tools, can develop more quickly and easily, by utilizing these tools can improve the quality of development in the SW industry. In this paper, we present an algorithm that of the profile through the expansion of the UML metamodel and shows the results in actually applying e-government standards framework.

• The Journal of the Korea Contents Association
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• v.18 no.12
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• pp.118-129
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• 2018

In AI chatbot service via a messenger, a profile image of the chatbot is the first thing that users see to communicate with the chatbot. This profile image not only manages an impression about the profile owner in SNS on followers, but also makes an important impression about chatbot services on users. Thus motivated, this study investigates proper profile images tailored for the types of chatbot services and users. Specifically, I reviewed the preferred images and expressions of chatbots for each purpose of chatbot service. Then, in a case study, I collected and analyzed the representative chatbot profile images for the purpose of fun and counseling. The profile images are categorized as robot, human, animal, and abstract images. Based on these categories, I surveyed the preferred profile image of the chatbot service in either the text type or image type alternatives. For the purpose of fun, in the text version, I found that both men and women preferred a human image to others. However, in the image version, men preferred woman and robot images while women preferred cute animation character and robot images. For counseling services, both men and women preferred woman and animal images most, which is similar to the results of the text version of questionnaires as well. While both genders consistently preferred real photo images, women tend to like abstract images more than men do. I expect that the results of this study would be useful to develop the proper profile images of AI chatbot for each service purpose.

• Journal of Sensor Science and Technology
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• v.24 no.1
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• pp.10-14
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• 2015

This paper reports the results of a study on the optimization of the etching profile, which is an important factor in deep-reactive-ion etching (DRIE), i.e., dry etching. Dry etching is the key processing step necessary for the development of the Internet of Things (IoT) and various microelectromechanical sensors (MEMS). Large-area etching (open area > 20%) under a high-frequency (HF) condition with nonoptimized processing parameters results in damage to the etched sidewall. Therefore, in this study, optimization was performed under a low-frequency (LF) condition. The HF method, which is typically used for through-silicon via (TSV) technology, applies a high etch rate and cannot be easily adapted to processes sensitive to sidewall damage. The optimal etching profile was determined by controlling various parameters for the DRIE of a large Si wafer area (open area > 20%). The optimal processing condition was derived after establishing the correlations of etch rate, uniformity, and sidewall damage on a 6-in Si wafer to the parameters of coil power, run pressure, platen power for passivation etching, and $SF_6$ gas flow rate. The processing-parameter-dependent results of the experiments performed for optimization of the etching profile in terms of etch rate, uniformity, and sidewall damage in the case of large Si area etching can be summarized as follows. When LF is applied, the platen power, coil power, and $SF_6$ should be low, whereas the run pressure has little effect on the etching performance. Under the optimal LF condition of 380 Hz, the platen power, coil power, and $SF_6$ were set at 115W, 3500W, and 700 sccm, respectively. In addition, the aforementioned standard recipe was applied as follows: run pressure of 4 Pa, $C_4F_8$ content of 400 sccm, and a gas exchange interval of $SF_6/C_4F_8=2s/3s$.

• Journal of the Korean GEO-environmental Society
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• v.17 no.8
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• pp.39-44
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• 2016

Ground deformation around construction site in urban area where typically adjacent structures are located needs to be strictly controlled. Accordingly, it is very important to precisely monitor the ground deformation. Settlement beacon is typically employed to measure the ground deformation, but meanwhile the rapid development in electronic technology enables 3D image scanner to become available for measuring the ground deformation profile in usual construction sites. With respect to the profile measurement, the 3D scanner has an advantage, whereas its accuracy is somewhat limited because it does not measure the displacement directly. In this paper, we developed a conditional merging technique to combine the ground displacement measured from settlement beacon and the profile measured by the 3D scanner. Synthetic ground deformation profile was generated to validate the proposed technique. It is found that the ground deformation measurement error can be reduced significantly via the conditional merging technique.

• Journal of The Korean Astronomical Society
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• v.55 no.5
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• pp.149-172
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• 2022

We present a new method which constructs an Hɪ super-profile of a galaxy which is based on profile decomposition analysis. The decomposed velocity profiles of an Hɪ data cube with an optimal number of Gaussian components are co-added after being aligned in velocity with respect to their centroid velocities. This is compared to the previous approach where no prior profile decomposition is made for the velocity profiles being stacked. The S/N improved super-profile is useful for deriving the galaxy's global Hɪ properties like velocity dispersion and mass from observations which do not provide sufficient surface brightness sensitivity for the galaxy. As a practical test, we apply our new method to 64 high-resolution Hɪ data cubes of nearby galaxies in the local Universe which are taken from THINGS and LITTLE THINGS. In addition, we also construct two additional Hɪ super-profiles of the sample galaxies using symmetric and all velocity profiles of the cubes whose centroid velocities are determined from Hermite h3 polynomial fitting, respectively. We find that the Hɪ super-profiles constructed using the new method have narrower cores and broader wings in shape than the other two super-profiles. This is mainly due to the effect of either asymmetric velocity profiles' central velocity bias or the removal of asymmetric velocity profiles in the previous methods on the resulting Hɪ super-profiles. We discuss how the shapes (𝜎_n/𝜎_b, A_n/A_b, and A_n/A_tot) of the new Hɪ super-profiles which are measured from a double Gaussian fit are correlated with star formation rates of the sample galaxies and are compared with those of the other two super-profiles.

• Journal of the Korea Society of Computer and Information
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• v.11 no.2 s.40
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• pp.153-158
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• 2006

The effect of solving questions and learning via internet is getting more and more important these days. In this paper we propose an active learning method that makes a database for the information about certificates and practical examinations and accesses it easily. First of all, this method makes it possible to evaluate students individually, improves the motive of learning and gives students a sense of achievement by providing a user-specific question filtering technique using user profile information by weight. And, it elevates the acquisition rate of certificates by advising and managing for certificate-acquisition and it also draw more interest and understanding for future directions. The case using the method of this paper, the examination record of a certificate of qualification is elevated about 10 marks.

• The Journal of Korean Institute of Communications and Information Sciences
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• v.36 no.10B
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• pp.1240-1245
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• 2011

In this paper, channel modeling and analysis of wireless visible light communication(VLC) were studied in indoor circumstance. Photons emitted from LED straightly moved and navigated within indoor, after that a part of photons reached on PD via LOS(Line Of Sight) or NLOS(None Line Of Sight). These received signals had characteristics of delay profile and attenuation, which was multiple-path fading. In this paper, computer simulation of VLC channel was executed under the condition that two LEDs were used for transmitter and three PDs were located at different positions of the 20*8*2.3m sized indoor. BER performance simulation was excuted based on the characteristics of each VLC channel.

• Proceedings of the KIEE Conference
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• 2002.11a
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• pp.245-247
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• 2002

The paper represents the effects of the drive-in process parameters on the residual stress profile of the p+ silicon film. For the quantitative determination of the residual stress profiles, the test samples are doped via the fixed boron diffusion process and four types of the thermal oxidation processes and consecutively etched by the improved process. The residual stress measurement structures with the different thickness are simultaneously fabricated on the same silicon wafer. Since the residual stress profile is not uniform along the direction normal to the surface, the residual stress is assumed to be a polynomial function of the depth. All of the coefficients of the polynomial are determined from the deflections of cantilevers and the displacement of a rotating beam structure. As the drive-in temperature or the drive-in time increases, the boron concentration decreases and the magnitude of the average residual tensile stress decreases. Also, near the surface of the p+ film the residual tensile stress is transformed into the residual compressive stress and its magnitude increases.