• Title/Summary/Keyword: vertical tunneling

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Sub-10 nm Ge/GaAs Heterojunction-Based Tunneling Field-Effect Transistor with Vertical Tunneling Operation for Ultra-Low-Power Applications

  • Yoon, Young Jun;Seo, Jae Hwa;Cho, Seongjae;Kwon, Hyuck-In;Lee, Jung-Hee;Kang, In Man
    • JSTS:Journal of Semiconductor Technology and Science
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    • v.16 no.2
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    • pp.172-178
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    • 2016
  • In this paper, we propose a sub-10 nm Ge/GaAs heterojunction-based tunneling field-effect transistor (TFET) with vertical band-to-band tunneling (BBT) operation for ultra-low-power (LP) applications. We design a stack structure that is based on the Ge/GaAs heterojunction to realize the vertical BBT operation. The use of vertical BBT operations in devices results in excellent subthreshold characteristics with a reduction in the drain-induced barrier thinning (DIBT) phenomenon. The proposed device with a channel length ($L_{ch}$) of 5 nm exhibits outstanding LP performance with a subthreshold swing (S) of 29.1 mV/dec and an off-state current ($I_{off}$) of $1.12{\times}10^{-11}A/{\mu}m$. In addition, the use of the highk spacer dielectric $HfO_2$ improves the on-state current ($I_{on}$) with an intrinsic delay time (${\tau}$) because of a higher fringing field. We demonstrate a sub-10 nm LP switching device that realizes a good S and lower $I_{off}$ at a lower supply voltage ($V_{DD}$) of 0.2 V.

Electrical Characteristics of Tunneling Field-effect Transistors using Vertical Tunneling Operation Based on AlGaSb/InGaAs

  • Kim, Bo Gyeong;Kwon, Ra Hee;Seo, Jae Hwa;Yoon, Young Jun;Jang, Young In;Cho, Min Su;Lee, Jung-Hee;Cho, Seongjae;Kang, In Man
    • Journal of Electrical Engineering and Technology
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    • v.12 no.6
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    • pp.2324-2332
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    • 2017
  • This paper presents the electrical performances of novel AlGaSb/InGaAs heterojunction-based vertical-tunneling field-effect transistor (VTFET). The device performance was investigated in views of the on-state current ($I_{on}$), drain-induced barrier thinning (DIBT), and subthreshold swing (SS) as the gate length ($L_G$) was scaled down. The proposed TFET with a $L_G$ of 5 nm operated with an $I_{on}$ of $1.3mA/{\mu}m$, a DIBT of 40 mV/V, and an SS of 23 mV/dec at a drain voltage ($V_{DS}$) of 0.23 V. The proposed TFET provided approximately 25 times lower DIBT and 12 times smaller SS compared with the conventional $L_G$ of 5 nm TFET. The AlGaSb/InGaAs VTFET showed extremely high scalability and strong immunity against short-channel effects.

Surface displacements due to tunneling in granular soils in presence and absence of geosynthetic layer under footings

  • Rebello, Nalini E.;Shivashankar, R.;Sastry, Vedala R.
    • Geomechanics and Engineering
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    • v.15 no.2
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    • pp.739-744
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    • 2018
  • This paper presents the results of numerical modeling studies on the effect of displacements of tunneling in granular soils. Presence of building loads is considered, to find displacement generated at the surface on tunnel. Effect of varying eccentricities of building is simulated, to find influence of building on vertical and horizontal displacement. Studies were carried out in two cases of with and without a geosynthetic layer installed at the bottom of the footing. Results of analysis revealed, the presence of geosynthetic layer under footing, with building placed on centre line, reduced the surface displacements compared to displacement generated without geosynthetic layer. Presence of geosynthetic layer under footing had a dominant effect in reducing displacements in high storey structures. However, when the building was shifted to greater eccentricities from centre line, presence of geosynthetic layer, led to insignificant reduction of displacements on the centre line at the surface.

Triple-gate Tunnel FETs Encapsulated with an Epitaxial Layer for High Current Drivability

  • Lee, Jang Woo;Choi, Woo Young
    • JSTS:Journal of Semiconductor Technology and Science
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    • v.17 no.2
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    • pp.271-276
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    • 2017
  • The triple-gate tunnel FETs encapsulated with an epitaxial layer (EL TFETs) is proposed to lower the subthreshold swing of the TFETs. Furthermore, the band-to-band tunneling based on the maximum electric-field can occur thanks to the epitaxial layer wrapping the Si fin. The performance and mechanism of the EL TFETs are compared with the previously proposed TFET based on simulation.

Optimization of Double Gate Vertical Channel Tunneling Field Effect Transistor (DVTFET) with Dielectric Sidewall

  • WANG, XIANGYU;Cho, Wonhee;Baac, Hyoung Won;Seo, Dongsun;Cho, Il Hwan
    • JSTS:Journal of Semiconductor Technology and Science
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    • v.17 no.2
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    • pp.192-198
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    • 2017
  • In this paper, we propose a novel double gate vertical channel tunneling field effect transistor (DVTFET) with a dielectric sidewall and optimization characteristics. The dielectric sidewall is applied to the gate region to reduced ambipolar voltage ($V_{amb}$) and double gate structure is applied to improve on-current ($I_{ON}$) and subthreshold swing (SS). We discussed the fin width ($W_S$), body doping concentration, sidewall width ($W_{side}$), drain and gate underlap distance ($X_d$), source doping distance ($X_S$) and pocket doping length ($X_P$) of DVTFET. Each of device performance is investigated with various device parameter variations. To maximize device performance, we apply the optimum values obtained in the above discussion of a optimization simulation. The optimum results are steep SS of 32.6 mV/dec, high $I_{ON}$ of $1.2{\times}10^{-3}A/{\mu}m$ and low $V_{amb}$ of -2.0 V.

Temperature-dependent DC Characteristics of Homojunction InGaAs vertical Fin TFETs (동종 접합 InGaAs 수직형 Fin TFET의 온도 의존 DC 특성에 대한 연구)

  • Baek, Ji-Min;Kim, Dae-Hyun
    • Journal of Sensor Science and Technology
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    • v.29 no.4
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    • pp.275-278
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    • 2020
  • In this study, we evaluated the temperature-dependent characteristics of homojunction InGaAs vertical Fin-shaped Tunnel Field-Effect Transistors (Fin TFETs), which were fabricated using a novel nano-fin patterning technique in which the Au electroplating and the high-temperature InGaAs dry-etching processes were combined. The fabricated homojunction InGaAs vertical Fin TFETs, with a fin width and gate length of 60 nm and 100 nm, respectively, exhibited excellent device characteristics, such as a minimum subthreshold swing of 80 mV/decade for drain voltage (VDS) = 0.3 V at 300 K. We also analyzed the temperature-dependent characteristics of the fabricated TFETs and confirmed that the on-state characteristics were insensitive to temperature variations. From 77 K to 300 K, the subthreshold swing at gate voltage (VGS) = threshold voltage (VT), and it was constant at 115 mV/decade, thereby indicating that the conduction mechanism through band-to-band tunneling influenced the on-state characteristics of the devices.

Socket sealing using pedicle subepithelial connective tissue graft with tunneling in maxillary esthetic zone: Case reports

  • Bae, Ju-Eun;Kim, Yong-Gun;Park, Jin-Woo;Lee, Jae-Mok;Suh, Jo-Young
    • Oral Biology Research
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    • v.42 no.4
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    • pp.254-261
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    • 2018
  • Reports have it that horizontal and vertical loss of the ridge happens during 6 months after tooth extraction. So valuable ridge preservation techniques are often necessary in the maxillary anterior areas. Maintaining and/or increasing blood supply and stability is essential to graft survival. The objective of this study was to determine the effect on extraction socket seal of pedicle subepithelial connective tissue graft with tunneling on maxillary esthetic zone through healing state for 8 weeks.

Dual-Tunneling Mechanism for Supporting Host Mobility between Heterogeneous Access Networks (이종 접속 망간의 단말 이동성 지원을 위한 이원적 터널 기법)

  • Choi, Young-Hwan;Kim, Yeon-Jung;Yu, Fucal;Park, Soo-Chang;Kim, Sang-Ha
    • Journal of KIISE:Information Networking
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    • v.36 no.1
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    • pp.43-49
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    • 2009
  • The Mobile IPv6(MIPv6) has a well-known time gap of packet loss between link down and binding update. To minimize such packet loss, this paper proposes a MIPv6-based dual tunneling mechanism, which keeps exploiting the old tunnel while creating a new tunnel. Superiority of the proposed mechanism is evaluated by quantitative analysis on the lost packets and computer simulation, based on two overlay heterogeneous access networks, such as the UMTS and a WLAN.

Effect of tunneling under a bridge on pile foundation behavior mechanism (교량 직하부에 시공되는 터널에 의한 말뚝기초의 거동변화)

  • Choi, Go-Ny;Woo, Seung-Je;Yoo, Chung-Sik
    • Journal of Korean Tunnelling and Underground Space Association
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    • v.13 no.1
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    • pp.51-69
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    • 2011
  • This paper presents the effect of tunneling on bridge pile foundation being operated using three-dimensional numerical modeling. Also the parametric study on the depth of tunnel of which the diameter was 10 m was carried out in order to evaluate the behaviors of pile foundation due to the tunnel excavation. This paper expresses the changes of vertical and horizontal displacement, movement of soil and stress of the pile. Based on the results obtained from the numerical analysis some insights into the changes of pile foundation behaviors due to variations of tunneling location were mentioned and discussed.

COMPARATIVE STUDY ON THE POSITIONAL STABILITY OF REMOVABLE DIES USING SEVERAL DOWEL PIN SYSTEMS (수종의 dowel pin systems을 이용한 가철성 다이의 위치 안정성에 관한 비교 연구)

  • Jeong, Jae-Hyang;Jeong, Chang-Mo;Jeon, Young-Chan
    • The Journal of Korean Academy of Prosthodontics
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    • v.36 no.5
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    • pp.738-747
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    • 1998
  • The purpose of this study was to compare the positional stability of removable dies using several dowel pin systems. The removable dies were made by using five dowel pin systems: single dowel pin(Group I), single dowel pin and prepared groove on the die base(Group II), two-single dowel pin(Group III), two separate parallel dowel pins with plastic sleeves(Group IV), double straight dowel pins with metal sleeve(Group V). Special aluminum mold was made for specimens, and the dies of specimens removed and replaced thirty times with universal testing machine. Horizontal and vertical shift of dies was measured by Olympus monocular scanning tunneling microscope(STM5). The results were as follows: 1. The vertical shift was larger than the horizontal shift in all the other groups except Group I. 2. Single dowel pin system(Group I) was the most unstable of five dowel pin systems. 3. Double dowel pin systems with steeve(group IV, V) were the most stable of five dowel pin systems. 4. This study indicates that excellent horizontal positional stability is attainable with use of additional groove on the die base or double dowel pin. and excellent vertical positional stability is attainable with use of sleeve.

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