• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.26 no.11
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• pp.790-800
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• 2013

The optimal structure of 1-3 piezocomposites has been determined by controlling polymer properties, ceramic volume fraction, thickness of composite and aspect ratio of the composite to maximize the TVR (transmitting voltage response), RVS (receiving voltage sensitivity) and FBW (fractional bandwidth) of underwater acoustic transducers. Influence of the design variables on the transducer performance was analyzed with equivalent circuits and the finite element method. When the piezocomposite is vibrating in a pure thickness mode, inter-pillar resonant modes are likely to occur between lattice-structured piezoceramic pillars and polymer matrix, which significantly deteriorate the performance of the piezocomposite. In this work, a new method to design the structure of the 1~3 type piezocomposite was proposed to maximize the TVR, RVS and FBW while preventing the occurrence of the inter-pillar modes. Genetic algorithm was used in the optimal design.

• Journal of the Institute of Convergence Signal Processing
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• v.3 no.4
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• pp.74-78
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• 2002

For human detecting pyroelectric infrared sensor system using more than 2 sensor devices. By new top and bottom electrode design, 1 sensor can sensing human instead of using 2 sensor system. The poled P(VDF/TrFE) film used for sensor pyroelectric materials. The fabricated sensors NEP (noise equivalent power) and specific detectivity D$^*$ of the device were 9.62 $\times$ 10$10^5$ V/W, 3.95 $\times$ 10$10^-175$ W and 5.06 $\times$ 10$10^5$W under emission energy of 13 ${\mu}W/cm^2$ respectively and It's result is almost same result that using more than 2 sensor system for human detecting.

• Transactions of the Korean Society for Noise and Vibration Engineering
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• v.26 no.6_spc
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• pp.687-696
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• 2016

A series of process to design an acoustic lens for underwater imaging is reviewed and the method to evaluate characteristics of the lens is investigated. If the target specification of lens is given, the design process consists of the material selection, evaluation of its properties, lens geometry design, prediction of lens characteristics, manufacturing, and evaluation by measurement. In this study, an actual acoustical lens is made by cutting polymethylpentene block. The characteristics of lens are predicted by the hybrid method, combination of ray tracing and Rayleigh integral. For the direct comparison between the prediction and measurement results, a simulation method based on the equivalent source method is suggested to reflect the actual radiation pattern of transducer used for measurements. Finally, the measurement is conducted in a small water tank to observe the actual characteristics of the manufactured lens.

• Journal of the Korean Society for Nondestructive Testing
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• v.24 no.5
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• pp.487-493
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• 2004

This study was conducted to develope a capacitive micromachined ultrasonic transducer (cMUT) which enable to high efficient non-contact transmit and receive the ultrasonic wave in air. Theoretical analysis and finite element analysis of the behavior of membrane (such as resonance frequency, membrane deflection, collapse deflection and collapse voltage) of the cMUT were performed. The design parameters of the cMUT such as the dimension and thickness of membrane, thickness of sacrificial layer, thickness and size of electrode were estimated. The resonance frequency of the membrane increased as the thickness of the membrane increased but decreased as the diameter of the membrane increased. The deflection of the membrane increased as d-c bias voltage increased. The collapse voltage of the membrane was analyzed.

• Journal of the Korean Society for Nondestructive Testing
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• v.32 no.2
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• pp.185-191
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• 2012

Typically, a wedge is involved to generate effectively high inspection angle in pipe weld inspection using phased array ultrasonic technique. But the usage of this wedge for weld or access limited area can cause coverage limitation for the examination volume because of the wedge front length. Therefore, the shear wave phased array probe which can generate high inspection angle without wedge is essentially necessary. In this paper, the shear wave phased array ultrasonic probe which can generate high inspection angle designed by modeling and manufactured from the modelling result. And this shear wave probe tested whether it can detect and sizing for EDM test block that contains various depth. As results, the experimental results show that the designed shear wave phased array probe can detect and size with reliable accuracy. Therefore if this phased array probe apply in field inspection, it is expected that it show more reliable inspection result for plant structure having access limitation.

• Journal of Ocean Engineering and Technology
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• v.22 no.4
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• pp.8-13
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• 2008

In this study, an investigation of shear wave ultrasonic technique was carried out to detect stacking orientation error for CF/Epoxy quasi-isotropy composite laminates. The ultrasonic shear wave is particularly sensitive to ply orientation and layup sequence in tire CF/Epoxy composite laminates. In the manufacturing of composite laminates, it is important that layup errors be detected in samples. In this work, an effect was mack to develop shear wave techniques that can be applied to composite laminates. During testing, the mast significant problem is that the couplant conditions do not remain the same because of its changing viscosity. The design and use of a shear ware transducer would greatly alleviate the couplant problem. A pyramid of aluminum, with isosceles triangle (two 45o angles) sides, was made to generate shear waves, using two longitudinal transducers based on an ultrasonic-polarized mechanism. A signal splitter was connected to the pulser jack on a pulser/receiver and to the longitudinal transducers. The longitudinal transducers were mounted with mineral oil, and the shear transducer was mounted with burnt honey on the bottom as a receiver. The shear wave was generated at a maximum and a minimum based on the ultrasonic-polarized mechanism. Results show it is feasible to measure layup error using shear wave transducers on a stacking of prepregs in composites.

• Journal of the Institute of Convergence Signal Processing
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• v.15 no.2
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• pp.64-69
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• 2014

Ultrasound system is one of the complex wireless signal processing systems that are widely used in the fields of modern industry such as medical diagnostics, underwater communications, and sensor-networks. Miniaturization of ultrasound system has been raging recently. In this paper, a hybrid LNA that is suitable for miniaturization and mobile diagnostic ultrasound system has been developed. The proposed LNA has low noise figure of less than 5dB, and the feedback resistor is designed to be electrically adjusted in order to attain the impedance-matching for various ultrasound transducers. It supports the whole ultrasound frequencies from 10KHz to 150MHz frequency band and also provides sleep modes. A gain from -18.8 to -29.5 dB is achieved by adjusting each transducer to fit the system character. Power consumption can be reduced up to 90% in similar performance as compared to the existing LNA.

• Journal of Biomedical Engineering Research
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• v.23 no.3
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• pp.227-233
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• 2002

The IME(implantable middle ear) system is Promising due to its ability to free from sound feedback and Produce a good sound quality and intelligibility with low distortion even if it is operated with high gain for severe hearing impaired. The differential electromagnetic vibration transducer. which was developed for using in IME system and has two small magnets attached the same Pole facing in the coil. is not influenced by environmental external magnetic field. Besides, it has high vibration efficiency and good frequency response characteristics. In this Paper, using acoustic model of the transducer and ear model of normal Person. the signal transfer characteristics of the IME system are analyzed and investigated From the differences of the characteristics between normal ear and the IME system, it is Possible that design of the IME system that have the signal transfer characteristics similar to normal person's ear.

• Journal of the Institute of Convergence Signal Processing
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• v.8 no.3
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• pp.171-177
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• 2007

In this paper, we have designed and implemented an optical signal processor in order to use in a fiber-optic current CT for electric equipments where its properties were discussed. The fabricated optical signal processor is used to reduce a measurement current error that induced by the effects of intensity variation in the optical output signal due to losses coming from optical components or polarization variation in a PFOCS. Also, the optical signal processor was fabricated in compact/lightweight with unification of opto-electronic transducer part, analog signal process part, and real-time measurement part consisted of a level shift and ${\mu}-processor$. The experiment of optical signal processor has been performed in the range of $0{\sim}7,500A$ using the PFOCS made all fiber-optic components. As a result of experiment, the linearity error of measurement current is less than 1.7% and its average error is less than 0.3% in the range of $1,000A{\sim}7,000A$.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2013.10a
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• pp.346-349
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• 2013

This paper describes a triple-input energy harvesting circuit using solar, vibration and thermoelectric energy with MPPT(Maximum Power Point Tracking) control. The designed circuit employs MPPT control to harvest maximum power available from a solar cell, PZT vibration element and thermoelectric generator. The harvested energies are simultaneously combined and stored in a storage capacitor, and then managed and transferred into a sensor node by PMU(Power Management Unit). MPPT controls are implemented using the linear relation between the open-circuit voltage of an energy transducer and its MPP(Maximum Power Point) voltage. The proposed circuit is designed in a CMOS 0.18um technology and its functionality has been verified through extensive simulations. The designed chip occupies $945{\mu}m{\times}995{\mu}m$.