• Journal of Power System Engineering
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• v.16 no.5
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• pp.47-54
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• 2012

The steady three-dimensional numerical analysis on the thermal flow using standard k-${\varepsilon}$ turbulence model was carried out to investigate the air cooling effect of a cooler on the cabin for a commercial vehicle. Here, the heat exchanging method of this cabin cooler uses the cooling effect of a thermoelectric module. In consequence, the air system resistance of a cooler within the cabin is about 12.1 Pa as a static pressure, and then the operating point of a virtual cross-flow fan considering in this study is formed in the comparatively low flowrate region. The discharging air temperature of a cooler is about $14{\sim}15^{\circ}C$. Moreover, the air cooling temperature difference obtained under the outdoor cabin temperature of $40^{\circ}C$ shows about $7{\sim}9^{\circ}C$ in a driver resting space and about $9{\sim}14^{\circ}C$ in the front of a driver's seat including the space of a driver's foot.

• Proceedings of the SAREK Conference
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• 2007.11a
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• pp.197-202
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• 2007

In this study, the cooling characteristics of a liquid cooler using thermoelectric module was experimentally investigated. The experiment was conducted for various inner structures of liquid cooler (4 cases), hot fluid flow rates (0.15-0.25 L/min), number of T.E module (2, 4, 6 set), and the cooling water flow rates (200-600 cc/min) for both parallel and counter flow types. Among the results, better cooling performance geometry was selected. And experiment was also carried out to examine further enhancement of cooling performance by inserting coils (pitches: 0.2, 3, 6 mm) into the hot-fluid channel. Present results showed that the short serpentine type(case2) indicated the best cooling performance. In the case of coil pitch of 3 mm, the best cooling performance was shown, more than 10% increase of the inlet and outlet temperature difference, compared with the case of the cooler without coil. Consequently, the inserted coil pitch should be properly selected to improve cooling performance.

• Journal of the Microelectronics and Packaging Society
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• v.24 no.2
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• pp.17-21
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• 2017

Horizontal thin-film thermoelectric cooler has been simulated using a commercial software (ANSYS Workbench Thermal-electric). The thermoelectric cooler consists of thin-film n-type $Bi_2Te_3$, p-type $Sb_2Te_3$ thermoelectric elements, and Au electrode, respectively. The hot spot was placed under the center of device which represents Joule heating. Numerical analysis was conducted by geometric variable, and a maximum temperature difference of $13^{\circ}C$ was obtained. As from the simulation parameters, we presented an optimized design for high efficiency cooling.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.16 no.10
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• pp.2335-2340
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• 2012

The detector is an uncooled detector system that functions inside the thermoelectric cooler (TEC) equipped with features instead of the cooler. The function of the thermoelectric device to control the temperature of the detector based on a function of temperature to prevent degradation of image quality to perform the role, the latest technology trend by removing the thermoelectric device size, cost a lot of effort to reduce has been studied. In this paper, It would be proposed of the actual test result using real chamber environment of for the best TECless algorithm as to minimize the degradation of image quality and obtain the low price of the uncooled detector.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.16 no.8
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• pp.741-747
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• 2004

The purpose of this study was to develop a cooler/heater using a thermoelectric module combined with a parallel flow type oscillating heat pipe with R-142b as a work ing fluid. The experiment was performed for 16 thermoelectric modules (6 A/15 V, size: 40${\times}$40${\times}$4 mm), varying design parameters of the heat pipe (inclination angle, working fluid charging ratio, etc) . Experimental results indicate that the optimum charging ratio and the inclination angle of the parallel flow type oscillating heat pipe were 30% by volume and 30%, respectively. The maximum cooler/heater capacity were 479W (COP : 0.47) and 630W (COP : 0.9), respectively.

• International Journal of Air-Conditioning and Refrigeration
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• v.13 no.4
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• pp.217-224
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• 2005

The purpose of this study was to develop a cooler/heater using a thermoelectric module combined with a parallel flow type pulsating heat pipe with R-142b as a working fluid. The experiment was performed for 16 thermoelectric modules (6A/15V, size: $40\times40\times4mm$), varying design parameters of the heat pipe (inclination angle, working fluid charging ratio, etc.). Experimental results indicate that the optimum charging ratio and the inclination angle of the parallel flow type pulsating heat pipe were $30\%$ by volume and $30^{\circ}$, respectively. The maximum cooler/heater capacity were 479 W (COP: 0.47) and 630 W (COP: 0.9), respectively.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2009.06a
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• pp.27-28
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• 2009

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.24 no.5
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• pp.409-414
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• 2012

A theoretical investigation to optimize thermoelectric elements for thermoelectric coolers was performed using a new one-dimensional analytic model. Mathematical expressions for the optimum current and the optimum length of a thermoelectric element, which maximize the coefficient of performance of thermoelectric coolers, were obtained. The optimum current is expressed in terms of the cooling load for a thermoelectric element, the hot and cold side temperatures and thermoelectric properties, but not the length of a thermoelectric element. The optimum current is proportional to the cooling load and decreases as the temperature difference between the hot and cold sides decreases. It is also shown that the optimum length of a thermoelectric element decreases as the cooling load increases.

• JSTS:Journal of Semiconductor Technology and Science
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• v.12 no.1
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• pp.18-23
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• 2012

We propose and implement a single-wire communication protocol for thermal management systems using thin film thermoelectric modules for 3D IC cooling. The proposed single-wire communication protocol connects the temperature sensors, located near hot spots, to measure the local temperature of the chip. A unique ID number identifying the location of each hot spot is assigned to each temperature sensor. The prototype chip was fabricated by a $0.13{\mu}m$ CMOS MPW process, and the operation of the chip is verified.

• Proceedings of the SAREK Conference
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• 2005.06a
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• pp.53-53
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• 2005