Journal of the Microelectronics and Packaging Society (마이크로전자및패키징학회지)

The Korean Microelectronics and Packaging Society (한국마이크로전자및패키징학회)
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Simulation of Horizontal Thin-film Thermoelectric Cooler for the Mobile Electronics Thermal Management

모바일 전자기기의 열점 제어를 위한 수평형 박막 열전 냉각 소자의 모사 해석

  • Park, Sangkug (Department of Mechanical Engineering, Soonchunhyang University) ;
  • Park, Hong-Bum (Department of Materials Science and Engineering, Seoul National University) ;
  • Joo, Young-Chang (Department of Materials Science and Engineering, Seoul National University) ;
  • Joo, Youngcheol (Department of Mechanical Engineering, Soonchunhyang University)
  • 박상국 (순천향대학교 기계공학과) ;
  • 박홍범 (서울대학교 재료공학부) ;
  • 주영창 (서울대학교 재료공학부) ;
  • 주영철 (순천향대학교 기계공학과)
  • Received : 2017.01.31
  • Accepted : 2017.04.10
  • Published : 2017.06.30
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Abstract

Horizontal thin-film thermoelectric cooler has been simulated using a commercial software (ANSYS Workbench Thermal-electric). The thermoelectric cooler consists of thin-film n-type $Bi_2Te_3$, p-type $Sb_2Te_3$ thermoelectric elements, and Au electrode, respectively. The hot spot was placed under the center of device which represents Joule heating. Numerical analysis was conducted by geometric variable, and a maximum temperature difference of $13^{\circ}C$ was obtained. As from the simulation parameters, we presented an optimized design for high efficiency cooling.

본 연구에서는 수평형 열전 냉각 소자의 열전 냉각 성능 극대화를 위해 모사 해석을 수행하였다. ANSYS Workbench의 Thermal-Electric 프로그램을 활용한 모사 해석을 진행하였으며 해당 프로그램은 열전 효과에 초점이 맞춰 있어 보다 정확하고 효과적인 모사 해석이 가능하다. 수평형 열전 냉각 소자는 n-type의 $Bi_2Te_3$와 p-type의 $Sb_2Te_3$ 및 Au 금속 전극으로 가정하였으며, Joule 발열이 소자 중앙 하부에서 발생되는 것으로 가정하였다. 모사 해석을 통해 최대 $13^{\circ}C$의 냉각 효과를 확인하였으며, 이런 기하학적인 변수들로부터 냉각 성능을 최적화 할 수 있는 디자인을 제시하였다.

Keywords

References

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