• The Journal of Advanced Prosthodontics
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• 제13권3호
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• pp.160-171
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• 2021

Purpose. This in-vitro study evaluated and compared the color stability of 3D-printed and conventional heat-polymerized acrylic resins following aging, mechanical brushing, and immersion in staining medium. Materials and methods. Forty disc-shaped specimens (10 mm in diameter and 3 mm thick) were prepared from two 3D-printed [DentaBASE (DB) and Denture 3D+ (D3D)] and one conventional polymethylmethacrylate (PMMA) denture materials. The specimens were thermo-cycled, subjected to mechanical brushing, and were immersed in either coffee, lemon juice, coke, or artificial saliva (AS) to simulate one and two years of oral use. Color measurements of the specimens were recorded by a spectrophotometer at baseline (T0), and after one (T1) and two years (T2) of simulation. The color changes (ΔE) were determined and also quantified according to the National Bureau of Standards (NBS) units. Descriptive statistics, followed by factorial ANOVA and Bonferroni post-hoc test (α=.05), were applied for data analysis. Results. The independent factors, namely material, staining medium, and immersion time, and interaction among these factors significantly influenced ΔE (P<.009). Irrespective of the materials, treatments, and time, the highest and the lowest mean ΔEs were observed for PMMA in lemon juice (4.58 ± 1.30) and DB in AS (0.41 ± 0.18), respectively. Regarding the material type, PMMA demonstrated the highest mean ΔE (2.31 ± 1.37), followed by D3D (1.67 ± 0.66), and DB (0.85 ± 0.52), and the difference in ΔE between the materials were statistically significant (P<.001). All the specimens demonstrated a decreased color changes at T2 compared to T1, and this difference in mean ΔE was statistically significant (P<.001). Conclusion. The color changes of 3D-printed denture resins were low compared to conventional heat polymerized PMMA. All the tested materials, irrespective of the staining medium used, demonstrated a significant decrease in ΔE values over time.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2004년도 ISMP Pb-free solders and the PCB technologies related to Pb-free solders
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• pp.233-241
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces strictly related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2004년도 ISMP Pb-free solders and the PCB technologies related to Pb-free solders
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• pp.211-219
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces stric시y related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials. In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• Smart Structures and Systems
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• 제22권5호
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• pp.495-508
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• 2018

Shape memory alloys (SMAs) exhibit superelasticity given the ambient temperature is above the austenite finish temperature threshold, the magnitude of which significantly depends on the metal ingredients though. For the monocrystalline CuAlBe SMAs, their superelasticity was found being maintained even when the ambient temperature is down to $-40^{\circ}C$. Thus this makes such SMAs particularly favorable for outdoor seismic applications, such as the framed structures located in cold regions with substantial temperature oscillation. Due to the thermo-mechanical coupling mechanism, the hysteretic properties of SMAs vary with temperature change, primarily including altered material strength and different damping. Thus, this study adopted the monocrystalline CuAlBe SMAs as the kernel component of the SMA braces. To quantify the seismic response characteristics at various temperatures, a wide temperature range from -40 to $40^{\circ}C$ are considered. The middle temperature, $0^{\circ}C$, is artificially selected to be the reference temperature in the performance comparisons, as well the corresponding material properties are used in the seismic design procedure. Both single-degree-of-freedom systems and a six-story braced frame were numerically analyzed by subjecting them to a suite of earthquake ground motions corresponding to the design basis hazard level. To the frame structures, the analytical results show that temperature variation generates minor influence on deformation and energy demands, whereas low temperatures help to reduce acceleration demands. Further, attributed to the excellent superelasticity of the monocrystalline CuAlBe SMAs, the frames successfully maintain recentering capability without leaving residual deformation upon considered earthquakes, even when the temperature is down to $-40^{\circ}C$.

• Composites Research
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• 제18권6호
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• pp.1-8
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• 2005

섬유강화 복합재료는 우수한 기계적, 전자기적 물성 등으로 다양한 분야에서 응용되고 있다. 열경화성 복합재는 제작공정에서의 성형온도와 제품의 운용온도인 상온간의 온도차이로 형상의 변형(스프링 백)이 발생하게 된다. 이러한 스프링 백은 하이브리드 구조의 정밀한 형상 제작을 위해서 반드시 보정되어야할 부분이다. 본 연구에서는 유리섬유/에폭시 복합재와 카본섬유/에폭시 복합재로 구성된 비대칭 하이브리드 복합재를 경화사이클, 적층두께, 적층방법 등 다양한 조건을 적용하여 제작하고 3차원 좌표측정기를 이용하여 스프링 백을 측정하였다. 또한 고전 적층판 이론(CLT)과 유한요소해석(ANSYS)으로 스프링백을 예측하고 실험결과와 비교하였다. 고전 적층판 이론과 유한요소해석으로 예측된 스프링 백은 실험 결과와 잘 일치하였으며, 성형온도가 낮을수록 스프링 백이 감소되는 경향을 보임을 확인하였으나 근원적으로 스프링 백이 제거되지는 않았다.

• 한국지반공학회논문집
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• 제29권8호
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• pp.65-73
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• 2013

지중 열교환 시스템은 지속적인 에너지 효율의 개선으로 공간 냉난방을 위한 친환경적 에너지 기술로 주목받고 있다. 지중에 매설된 파이프는 내부 유체 순환을 통하여 인접한 지반과 열적 상호작용으로부터 직접적인 열에너지 교환을 수행한다. 하지만, 파이프의 수치모델링에서 열-수리가 연관된 난류해석과 파이프의 긴 세장비에 의한 메쉬사이즈의 부적합성은 열교환 시스템의 적절한 수치해석을 어렵게 하고 있다. 본 논문에서는 파이프 내부 유체흐름에 대한 에너지 보존의 법칙을 적용하여 지배방정식을 유도하였으며, Galerkin수식화와 시간적분을 통하여 열-수리 연동일차원 파이프 요소를 개발하였다. 그리고 제안된 파이프 요소를 기 개발된 다공질 재료를 위한 열-수리-역학(Thermo-Hydro-Mechanical) 해석을 위한 유한요소 프로그램과 결합하였다. 개발된 요소를 이용한 수치해석 결과는 열응답 시험(Thermal Response Test) 결과로부터 주위지반의 유효 열전도도를 평가하기 위하여 사용하는 선형 열원 모델이 인접 파이프간의 열적상호작용과 파이프의 단부효과에 의하여 지반의 열전도도를 과다 평가하는 것으로 보여주었다. 따라서 열응답 시험 해석 결과에 대한 역해석을 적용하여 최적의 수렴성을 보여주는 변환행렬을 제시하였다.

• 한국세라믹학회지
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• 제48권1호
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• pp.63-68
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• 2011

The investigation is directed to lead free (Pb-free) frits that can be used for organic light emitting diode, plasma display screen devices and other sealing materials. $P_2O_5$-SnO system glasses have been prepared for Pb-free low temperature glass frit. Structure and properties of the glasses with the composition SnO-$xB_2O_3-(60-x)P_2O_5$ (x=0, 5, 10, 15, 20, 25, 30, 35, 40 mol%) were characterized by infrared spectra (IR), X-ray diffraction(XRD), Density, Molar volume, Thermo mechanical analysis(TMA) and weight loss after immersion test. Glass transition temperature($T_g$), dilatometric softening temperature($T_d$) and chemical durability increased, and coefficient of thermal expansion($\alpha$) decrease with the substitution of $B_2O_3$ for $P_2O_5$ in the range of 0~25 mol%.

• Nuclear Engineering and Technology
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• 제43권3호
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• pp.279-286
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• 2011

The aging degradation and lifetime assessment of a domestic class 1E Ethylene-Propylene-Diene-Monomer (EPDM), which is a popular insulating elastomer for electrical cables in the nuclear power plants, were studied for equipment qualification verification under the Loss of Coolant Accident (LOCA) conditions. The specimens were acceleratively aged, underwent a LOCA environment, as well as tested mechanically, thermo-gravimetrically, and spectroscopically according to the American Society of the Testing of Materials (ASTM) procedures. The tensile test results revealed that the elongation at break gradually decreased with an increasing aging temperature. The lifetime of EPDM aged isothermally at $140^{\circ}C$ was 1,316 hours and reduced to 1,120 hours after experiencing the severe accident test. The activation energies of the elongation reduction were $1.10{\pm}0.196$ eV and $0.93{\pm}0.191$ eV before and after the LOCA condition, respectively. The TGA test results also showed that the activation energy of the aging decomposition decreased from 1.35 eV to 1.02 eV after undergoing the LOCA environment. Although the mechanical property changes were discernibly observed during the aging process, along with the LOCA simulation, the FT-IR analysis showed that the spectroscopic peaks and their intensities did not alter significantly. Therefore, it can be concluded that the degradation of the domestic class 1E EPDM due to aging can be tolerable, even in severe accident conditions such as LOCA, and thus it qualifies as a suitable insulating material for electrical cables in the nuclear power plants.

• 한국유체기계학회 논문집
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• 제20권1호
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• pp.41-47
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• 2017

This study aimed to analyze organic Rankine cycle(ORC) which recovers discarded heat from a gas turbine based combined cycle cogeneration(CC-cogen) plant in terms of both performance and economics. The nominal electric power of the CC-cogen plant is around $120MW_e$, and heat for district heating is $153MW_{th}$. The major purpose of this study is to compare various options in selecting heat source of the ORC. Three heat sources were compared. Case 1 uses the exhaust gas from the HRSG, which is purely wasted to environment in normal plant operation without ORC. Case 2 also uses the exhaust gas from the HRSG. On the other hand, in this case, the DH economizer, which is located at the end of the HRSG, does not operate. Case 3 generates power using some of the district heating water which is supplied to consumers. The estimated ORC power generation ranges between 0.3 to 2.3% of the power generation capacity of the CC-cogen plant. Overall, Case 3 is evaluated to be better than other two options in terms of system design flexibility and power generation capacity.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2001년도 Proceedings of 6th International Joint Symposium on Microeletronics and Packaging
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• pp.35-43
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• 2001

Flip chip assembly on organic substrates using ACAs have received much attentions due to many advantages such as easier processing, good electrical performance, lower cost, and low temperature processing compatible with organic substrates. ACAs are generally composed of epoxy polymer resin and small amount of conductive fillers (less than 10 wt.%). As a result, ACAs have almost the same CTE values as an epoxy material itself which are higher than conventional underfill materials which contains lots of fillers. Therefore, it is necessary to lower the CTE value of ACAs to obtain more reliable flip chip assembly on organic substrates using ACAs. To modify the ACA composite materials with some amount of conductive fillers, non-conductive fillers were incorporated into ACAs. In this paper, we investigated the effect of fillers on the thermo-mechanical properties of modified ACA composite materials and the reliability of flip chip assembly on organic substrates using modified ACA composite materials. Contact resistance changes were measured during reliability tests such as thermal cycling, high humidity and temperature, and high temperature at dry condition. It was observed that reliability results were significantly affected by CTEs of ACA materials especially at the thermal cycling test. Results showed that flip chip assembly using modified ACA composites with lower CTEs and higher modulus by loading non-conducting fillers exhibited better contact resistance behavior than conventional ACAs without non-conducting fillers. Microwave model and high-frequency measurement of the ACF flip-chip interconnection was investigated using a microwave network analysis. ACF flip chip interconnection has only below 0.1nH, and very stable up to 13 GHz. Over the 13 GHz, there was significant loss because of epoxy capacitance of ACF. However, the addition of $SiO_2filler$ to the ACF lowered the dielectric constant of the ACF materials resulting in an increase of resonance frequency up to 15 GHz. Our results indicate that the electrical performance of ACF combined with electroless Wi/Au bump interconnection is comparable to that of solder joint.