• Journal of the Microelectronics and Packaging Society
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• v.10 no.4
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• pp.1-8
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• 2003

Thermo-mechanical behavior of a ceramic ball grid array (CBGA) package assembly are characterized by high sensitive moire interferometry. Moir fringe patterns are recorded and analyzed at various temperatures in a temperature cycle. Thermal-history dependent analyses of global and local deformations are presented, and bending deformation (warpage) of the package and shear strain in the rightmost solder ball are discussed. A significant non-linear global behavior is documented due to stress relaxation at high temperature. Analysis of the solder interconnections reveals that inelastic deformation accumulates on only eutectic solder fillet region at high temperatures.

• Transactions of the Korean Society of Mechanical Engineers
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• v.15 no.1
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• pp.190-200
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• 1991

Certain structural components are exposed to high temperatures. At high temperature, under thermal and mechanical loading, metal components exhibit both creep and plastic behavior. The unified constitutive theory is to model both the time-dependent behavior(creep) and the time-independent behavior(plasticity) in one set of equations. Microscopically both creep and plasticity are controlled by the motion of dislocations. A finite element method is presented encorporating a unified constitutive model for the transient analysis of viscoplastic behavior of structures exposed to high temperature.

• Journal of Biomedical Engineering Research
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• v.31 no.6
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• pp.472-480
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• 2010

Mechanically deformed cartilage undergoes a temperature dependent phase transformation resulting in reshaping of cartilage. Laser-assisted cartilage reshaping (LCR) is recently introduced to recreate the underlying cartilage framework in structures such as ear, larynx, trachea, and nose. However, this procedure has not been fully supported by confirmed efficacy because of the lack of scientific research and its safety issues. The purpose of this study is to evaluate current laser sources to determine optimal laser wavelength for LCR using mathematical simulations and investigate optical, thermo-mechanical, and backscattering properties of cartilage after laser irradiation. The results showed that 1444 nm wavelength was effective for reshaping of cartilage with minimal thermal damage in the surrounded tissues by monte carlo simulations. Analysis of bend angle changes, thermo-mechanical characteristics, and backscattered properties may be useful to better identify the biophysical transformation responsible for stress relaxation in cartilage and develop an optical feedback control methodologies.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.29 no.6 s.237
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• pp.722-729
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• 2005

Design analysis of the solid oxide fuel cell and gas turbine combined power system is performed considering different methods for preheating cell inlet air. The purpose of air preheating is to keep the temperature difference between cell inlet and outlet within a practical design range thus to reduce thermal stress inside the cell. Three different methods considered are (1) adopting a burner in front of the cell, (2) adopting a preheater (heat transfer from the main combustor) in front of the cell and (3) using recirculation of the cathode exit gas. For each configuration, analyses are carried out for two values of allowable maximum cell temperature difference. Performance characteristics of all cases are compared and design limitations are discussed. Relaxation of the cell temperature difference (larger difference) is proved to ensure higher efficiency. Recirculation of the cathode exit gas exhibits better performance than other methods and this advantage becomes more prominent as the constraint of the cell temperature difference becomes more severe (smaller temperature difference).

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2004.05a
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• pp.70-73
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• 2004

The packaging of the integrated circuits requires knowledge of ceramics and metals to accommodate the fabrication of modules that are used to construct subsystems and entire systems from extremely small components. Composite ceramics (Al$_2$O$_3$-SiO$_2$) were tested for substrates. A stress analysis was conducted for a linear work-hardening metal cylinder embedded in an infinite ceramic matrix. The bond between the metal and ceramic was established at high temperature and stresses developed during cooling to room temperature. The calculations showed that the stresses depend on the mismatch in thermal expansion, the elastic properties, and the yield strength and work hardening rate of the metal. Experimental measurements of the surface stresses have also been made on a Cu/Al$_2$O$_3$-SiO$_2$ceramic system, using an indentation technique. A comparison revealed that the calculated stresses were appreciably larger than the measured surface stresses, indicating an important difference between the bulk and surface residual stresses. However, it was also shown that porosity in the metal could plastically expand and permit substantial dilatational relaxation of the residual stresses. Conversely it was noted that pore clusters were capable of initiating ductile rupture, by means of a plastic instability, in the presence of appreciable tri-axiality. The role of ceramics for packaging of microelectronics will continue to be extremely challenging.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.11a
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• pp.308-312
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• 2003

The packaging of the integrated circuits requires knowledge of ceramics and metals to accommodate the fabrication of modules that are used to construct subsystems and entire systems from extremely small components. Composite ceramics ($Al_2O_3-SiO_2$) were tested for substrates. A stress analysis was conducted for a linear work-hardening metal cylinder embedded in an infinite ceramic matrix. The bond between the metal and ceramic was established at high temperature and stresses developed during cooling to room temperature. The calculations showed that the stresses depend on the mismatch in thermal expansion, the elastic properties, and the yield strength and work hardening rate of the metal. Experimental measurements of the surface stresses have also been made on a $Cu/Al_2O_3-SiO_2$ ceramic system, using an indentation technique. A comparison revealed that the calculated stresses were appreciably larger than the measured surface stresses, indicating an important difference between the bulk and surface residual stresses. However, it was also shown that porosity in the metal could plastically expand and permit substantial dilatational relaxation of the residual stresses. Conversely it was noted that pore clusters were capable of initiating ductile rupture, by means of a plastic instability, in the presence of appreciable tri-axiality. The role of ceramics for packaging of microelectronics will continue to be extremely challenging.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.36 no.10
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• pp.1025-1032
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• 2012

The flash lamp annealing (FLA) process has been considered highly promising for manufacturing low-temperature polysilicon on large-scale backplanes. Based on a theoretical estimation, this study clarifies the critical mechanisms of glass backplane deformation during the FLA process. A simulation using a commercial FEM code with viscoelastic models shows that the local region, whose temperature is larger than the glass softening point, undergoes permanent structural shrinkage owing to stress relaxation. For larger backplanes (4th Gen), structural shrinkages and gravitational deflection are critical to deformation in the FLA process, resulting in an "M" shape; in smaller backplanes (0th Gen), the latter is negligible, resulting in a "U" shape.

• Proceedings of the KIEE Conference
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• 1996.07c
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• pp.2004-2006
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• 1996

A thermally driven polysilicon micro actuator has been fabricated using surface micromachining techniques. It consists of P-doped polysilicon as a structural layer and TEOS (tetracthylorthosilicate) as a sacrificial layer. The polysilicon was annealed for the relaxation of residual stress which is the main cause to its deformation such as bending and buckling. And the newly developed HF VPE (vapor phase etching) process was also used as an effective release method for the elimination of sacrificial TEOS layer. The thickneas of polysilicon is $2{\mu}m$ and the lengths of active and passive polysilicon cantilevers are $500{\mu}m$ and $260{\mu}m$, respectively. The actuation is incurred by die thermal expansion due to the current flow in the active polysilicon cantilever, which motion is amplified by lever mechanism. The moving distance of polysilicon micro actuator was experimentally conformed as large as $21{\mu}m$ at the input voltage level of 10V and 50Hz square wave. The actuating characteristics are investigated by simulating the phenomena of heat transfer and thermal expansion in the polysilicon layer. The displacement of actuator is analyzed to be proportional to the square of input voltage. These micro actuator technology can be utilized for the fabrication of MEMS (microelectromechanical system) such as micro relay, which requires large displacement or contact force but relatively slow response.

• KSCE Journal of Civil and Environmental Engineering Research
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• v.38 no.1
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• pp.1-10
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• 2018

It is difficult to predict the early-age cracks of strain restrained concrete members due to environmentally sensitive parameters. A new method is proposed to predict the cracks by test of autogenous deformation and self-induced restrained stress of specimens which simulates early-age crack state by hydration heat of the'Wall-On-Foundation'members. For this purpose, thermal analysis of entire structure considering the environmental condition is performed at first, and the specimens are set up where hydration heat was electronically controlled according to the analysis results. By measuring free deformation and force to compensate the autogenous strain including relaxation, feasibility of cracks can be estimated. The proposed method can predict the occurrence of cracks better than the material test of the early age concrete which has large variance. The method of this study is particularly useful when it is used as a preliminary experiments to predict the crack more precisely before full-scale concrete placement in construction of large structures.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.34 no.2
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• pp.245-253
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• 2010

The reliability problems of flip chip packages subjected to temperature change during the packaging process mainly occur due to mismatches in the coefficients of thermal expansion as well as features with time-dependent material properties. Resin molding compounds like glass fiber reinforced epoxy composites used as the dielectric layer in printed circuit boards (PCB) strongly exhibit viscoelastic behavior, which causes their Young's moduli to not only be temperature-dependent but also time-dependent. In this study, the stress relaxation and creep tests were used to characterize the viscoelastic properties of the glass fiber reinforced epoxy composite. Using the viscoelastic properties, finite element analysis (FEA) was employed to simulate thermal loading in the pre-baking process and predict thermal warpage. Furthermore, the effect of viscoelastic features for the major polymeric material on the dielectric layer in the PCB (the glass fiber reinforced epoxy composite) was investigated using FEA.