• Proceedings of the International Microelectronics And Packaging Society Conference
• /
• 2002.11a
• /
• pp.153-157
• /
• 2002

Thermal management is very important for the success of high density circuit design in LTCC. To realized more accurate thermal analysis for structure design, a series of simple thermal resistance measurement by laser flash method and parametric numerical analysis have been carried out. The design of via filled material would be useful in thermal management of power devices.

• Transactions of the Korean Society of Mechanical Engineers A
• /
• v.28 no.9
• /
• pp.1408-1414
• /
• 2004

The use of flip-chip technology has many advantages over other approaches for high-density electronic packaging. ACF (anisotropic conductive film) is one of the major flip-chip technologies, which has short chip-to-chip interconnection length, high productivity, and miniaturization of package. In this study, thermal fatigue lift of ACF bonding flip-chip package has been predicted. Elastic and thermal properties of ACF were measured by using DMA and TMA. Temperature dependent nonlinear hi-thermal analysis was conducted and the result was compared with Moire interferometer experiment. Calculated displacement field was well matched with experimental result. Thermal fatigue analysis was also conducted. The maximum shear strain occurs at the outmost located bump. Shear stress-strain curve was obtained to calculate fatigue life. Fatigue model for electronic adhesives was used to predict thermal fatigue life of ACF bonding flip-chip packaging. DOE (Design of Experiment) technique was used to find important design factors. The results show that PCB CTE (Coefficient of Thermal Expansion) and elastic modulus of ACF material are important material parameters. And as important design parameters, chip width, bump pitch and bump width were chose. 2$^{nd}$ DOE was conducted to obtain RSM equation far the choose 3 design parameter. The coefficient of determination ($R^2$) for the calculated RSM equation is 0.99934. Optimum design is conducted using the RSM equation. MMFD (Modified Method for feasible Direction) algorithm is used to optimum design. The optimum value for chip width, bump pitch and bump width were 7.87mm, 430$\mu$m, and 78$\mu$m, respectively. Approximately, 1400 cycles have been expected under optimum conditions. Reliability analysis was conducted to find out guideline for control range of design parameter. Sigma value was calculated with changing standard deviation of design variable. To acquire 6 sigma level thermal fatigue reliability, the Std. Deviation of design parameter should be controlled within 3% of average value.

• Journal of the Korean Society for Precision Engineering
• /
• v.20 no.8
• /
• pp.175-184
• /
• 2003

A method of the shape design sensitivity analysis based on the boundary integral equation formulation is presented for two-dimensional inhomogeneous thermal conducting solids with multiple domains. Shape variation of the external and interface boundary is considered. A sensitivity formula of a general performance functional is derived by taking the material derivative to the boundary integral identity and by introducing an adjoint system. In numerical analysis, state variables of the primal and adjoint systems are solved by the boundary element method using quadratic elements. Two numerical examples of a compound cylinder and a thermal diffuser are taken to show implementation of the shape design sensitivity analysis. Accuracy of the present method is verified by comparing analyzed sensitivities with those by the finite difference. As application to the shape optimization, an optimal shape of the thermal diffuser is found by incorporating the sensitivity analysis algorithm in an optimization program.

• Journal of the Korean Society for Aeronautical & Space Sciences
• /
• v.32 no.7
• /
• pp.117-125
• /
• 2004

Performing the sensitivity analysis of contact conduction on the basis of the thermal model already established, the study of thermal design is accomplished for the preparation of the future changes of mechanical interface design. A relatively simple thermal model is taken into consideration for the convenience of the analysis. A variety of the spacecraft bus voltages and the contact resistances are tried. As a consequence, when the mechanical interface condition is changed at the same module, the successful thermal design could be achieved if we design the heater to have sufficiently large power with reference to the heritage of contact resistance.

• Transactions of the Korean Society of Mechanical Engineers B
• /
• v.27 no.1
• /
• pp.117-124
• /
• 2003

Thermal design fur satellite propulsion system has been performed. Overall design requirements and the constitution for propulsion system is described. To meet the thermal design requirements, both a primary and a redundant heater circuit, each with two thermostats placed in series, will protect each hydrazine-wetted components, even if one heater circuit fails to operate. Heater power is turned off if any one of these thermostats is opened at its higher setpoint. Thus, even if one thermostat is failed closed, the second thermostat will turn off the heater. All such components shall be insulated with MLI. Propulsion heater sizing based on the constant worst cold case condition is conducted through thermal analysis. All heaters selected fur propulsion components operate to prevent propellant freezing satisfying the thermal requirements for the propulsion subsystem over the worst case average voltage, i.e. 25 volts.

• Journal of the Korean Society for Aeronautical & Space Sciences
• /
• v.39 no.5
• /
• pp.474-480
• /
• 2011

Space Imaging Sensor operated on LEO is affected from the Earth IR and Albedo as well as the Sun Radiation. The Imaging Sensor exposed to extreme environment needs thermal control subsystem to be maintained in operating/non-operating allowable temperature. Generally, units are periodically dissipated on spacecraft panel, which is designed as radiator. Because thermal design of the imaging sensor inside a spacecraft is isolated, heat pipes connected to radiators on the panel efficiently transfer dissipation of the units. First of all, preliminary thermal design of radiating area and heater power is performed through steady energy balance equation. Based on preliminary thermal design, on-orbit thermal analysis is calculated by SINDA, so calculation for thermal design could be easy and rapid. Radiators are designed to rib-type in order to maintain radiating performance and reduce mass. After on-orbit thermal analysis, thermal requirements for Space Imaging Sensor are verified.

• 한국전산유체공학회:학술대회논문집
• /
• 2010.05a
• /
• pp.416-421
• /
• 2010

The north and south panel of a geostationary satellite are used for radiator panels to reject internal heat dissipation of electronics units and utilize several heat pipe networks to control the temperatures of units and the satellite within proper ranges. The design of these panels is very important and essential at the conceptual design and preliminary design stage so several thousands of nodes of more are utilized in order to perform thermal analysis of panel. Generating a large number of nodes(meshes) of the panel takes time and is tedious work because the mesh can be easily changed and updated by locations of units and heat pipes. Also the detailed panel model can not be integrated into spacecraft thermal model due to its node size and limitation of commercial satellite thermal analysis program. Thus development of a program was required in order to generate detailed panel model, to perform thermal analysis and to make a reduced panel model for the integration to the satellite thermal model. This paper describes the development and the verification of panel thermal analysis program with ist main modules and its main functions.

• Journal of computational fluids engineering
• /
• v.15 no.3
• /
• pp.66-72
• /
• 2010

The north and south panel of a geostationary satellite are used for radiator panels to reject internal heat and utilize several heat pipe networks to control the temperatures of units and the main structures of satellite within proper ranges. The design of these panels is very important and essential at the conceptual design and preliminary satellite design stage, so several thousands of nodes or more are utilized in order to perform detailed thermal analysis of panel. Generating a large number of panel nodes takes time and is tedious work because the nodes can be easily changed and updated by locations of units and heat pipes. Also the detailed panel model can not be integrated into spacecraft thermal model due to its node size and limitation of commercial satellite thermal analysis program. Thus development of a program was required to generate a detailed panel model, to perform thermal analysis and to make a reduced panel model for the integration to the satellite thermal model. This paper describes the development and the verification of the panel thermal analysis program with its main modules and functions.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
• /
• 2001.10a
• /
• pp.363-368
• /
• 2001

Studies on brake system recently are focused on braking performance, especially the consideration on safety of braking system in an extreme situation and reduction of vibration and noise during braking operation. The thermal crack and Judder from the friction between brake disc and pad can bring the threaten of passengers' safety in the end. Braking force comes from the change of kinetic energy to friction energy. Since heat energy is developed from here, the analysis on thermal stress and thermal strain can be the good data when selecting the material of brake pad and designing heat radiation holes on the disc and it will also be the data when designing the thickness of the disc. This paper is intended to show a creative design method by suggesting the thermal analysis data through FEM study and using shape design parameters.

• Journal of Power System Engineering
• /
• v.13 no.6
• /
• pp.35-42
• /
• 2009

The piping systems in the steam-driven power engines lie under the cyclic condition of thermal expansion and contraction by superheated steam. These phenomena might cause some severe damages on the pipes and the accessory devices. To avoid these damages, the calculation of the proper strength and the consideration of the reduced resultant forces on the materials are needed. In the present study, numerical investigations on the effects of the thermal deformation of the industrial piping system were performed with comparison of the design data. Commercial software, ABAQUS with the thermal-fluidic loadings based on the design conditions was used for the thermal stress analysis of the piping system. From the analysis of the initially-designed pipe supporters, the rearrangement was suggested to improve the piping design.