• Nuclear Engineering and Technology
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• v.41 no.7
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• pp.953-968
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• 2009

It is important to accurately predict the temperature and density distributions in large stratified enclosures both for design optimization and accident analysis. Current reactor system analysis codes only provide lumped-volume based models that can give very approximate results. Previous scaling analysis has shown that stratified mixing processes in large stably stratified enclosures can be described using one-dimensional differential equations, with the vertical transport by jets modeled using integral techniques. This allows very large reductions in computational effort compared to three-dimensional CFD simulation. The BMIX++ (Berkeley mechanistic MIXing code in C++) code was developed to implement such ideas. This paper summarizes major models for the BMIX++ code, presents the two-plume mixing experiment simulation as one validation example, and describes the codes' application to the liquid salt buffer pool system in the AHTR (Advanced High Temperature Reactor) design. Three design options have been simulated and they exhibit significantly different stratification patterns. One of design options shows the mildest thermal stratification and is identified as the best design option. This application shows that the BMIX++ code has capability to provide the reactor designers with insights to understand complex mixing behavior with mechanistic methods. Similar analysis is possible for liquid-metal cooled reactors.

• 제어로봇시스템학회:학술대회논문집
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• 2003.10a
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• pp.2304-2308
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• 2003

Ocean thermal energy conversion (OTEC) is an effective method of power generation, which has a small impact on the environment and can be utilized semi-permanently. This paper describes a dynamic model for a pilot OTEC plant built by the Institute of Ocean Energy, Saga University, Japan. This plant is based on Uehara cycle, in which binary mixtures of ammonia and water is used as the working fluid. Some simulation results attained by this model and the analysis of the results are presented. The developed computer simulation can be used to actual practice effectively, such as stable control in a steady operation, optimal determination of the plant specifications for a higher thermal efficiency and evaluation of the economic prospects and off-line training for the operators of OTEC plant.

• Proceedings of the SAREK Conference
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• 2008.06a
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• pp.853-856
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• 2008

Windows have an great effect on annual building load because windows are the weakest parts of building envelope thermally. To reduce the consumption of building energy, the thermal performance of window has to be improved in first place. Therefore this research aims to make a quantitative analysis of the heating and cooling load according to the window thermal performance using the heat load simulation program. As a result of the simulation, annual heat load is down 38% according to the decrease of U-value of window, 1.00 W/$m^2K$. and annual heat load is up 10% according to the decrease of shading coefficient, 0.20. The annual load of the window with Low-E glass is 15% lower than the window with pair glass.

• Nuclear Engineering and Technology
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• v.32 no.2
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• pp.99-107
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• 2000

A probabilistic integrity analysis method is presented for a reactor vessel under pressurized thermal shock(PTS) based on Monte Carlo simulation. This method can be applied to the structural integrity assessment of a reactor vessel subjected to pressurized thermal shock where the coolant temperature transient cannot be expressed explicitly as a time function. An axially or circumferentially oriented infinite length surface crack is assumed to be in the beltline weld region of the rector vessel's inside surface. The random variables are the initial crack depth, neutron fluence on the vessel's inside surface, the copper and nickel content of the vessel materials, R $T_{NDT}$ , $K_{IC}$ , and K/aub la/. The reliability of a sample reactor vessel under PTS is assessed quantitatively and the influence of the amount of neutron fluence is also examined by applying the present method.sent method.

• Proceedings of the KSME Conference
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• 2008.11b
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• pp.2231-2235
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• 2008

Thermal performance of fusing system in laser printer is determined by FPOT(First print out time) required and toner fusing quality. FPOT is influenced by the thermal resistance of fusing system between heat source and nip region. Also FPOT is depended by the heat source power and toner fusing temperature. The fusing quality of toner is decided by the temperature, pressure and duration time in nip region. In this study, I have performed thermal analysis for the toner fusing system. Computational simulation has been used to understand the effect of heat source power and printing speed etc. on the temperature distribution of the fusing system. Also in order to predict fusing quality, numerical simulation of the process that paper is continuously supplied to the nip regions were performed. In comparison with the experimental results of the fusing quality vs transferred calory to the toner layer, I could evaluate various fusing condition parameters effected on the thermal performance.

• Aerospace Engineering and Technology
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• v.3 no.1
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• pp.155-169
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• 2004

Space launch vehicles and reentry vehicles are exposed to extreme heating conditions due to high aerodynamic heating while flying at high Mach numbers in the atmosphere. To protect the vehicle itself or the payload from the aerodynamic heating, the thermal load imposed on the surface should be exactly predicted and proper thermal protection should be applied based on the prediction results. But this requires rigorous thermal analysis and testing to prevent loss of payload capacity caused by excessive heat shielding, and the amount of thermal protection material to be applied is determined through aerodynamic heating tests. Various design points to be considered to upgrade the prototype aerodynamic thermal simulation facility(ATSF) used for the KSR-series sounding rocket development to the one suitable for the KSLV(Korean Space Launch Vehicle)-series launch vehicle are considered in this research. The need and limitation for the facility are first considered, and the functions required for KSLV testing are determined. The specifications of the upgraded facility are briefly suggested and these results will be used for the future fabrication and installation of the facility.

• Journal of IKEEE
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• v.25 no.3
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• pp.528-533
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• 2021

This paper presents the PCB heat dissipation characteristics of high density DC-DC converter for electric vehicles. This paper also analyzes the heat dissipation structure of the high density DC-DC converter and optimizes the PCB heat dissipation design of the high density power system through thermal analysis simulation. Based on heat transfer theory, the thermal path of general electronic devices is analyzed and the thermal resistance equivalent circuit is modeled in this paper. Additionally, the thermal resistance equivalent circuit of the 500W synchronous buck converter, which is addressed in this paper, is modeled to present a structural heat dissipation path for better thermal performance. The validity of the proposed scheme is verified through the thermal analysis simulation results and experiments applying multi-surface heat dissipation structure to a 500[W](12[V], 41.67[A]) synchronous buck converter prototype with an input voltage 72[V].

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.06a
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• pp.363-366
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• 2003

The hard turning is a turning operation performed in high strength alloy steels (HRC>30) in order to reach surface roughness close to those obtained in grinding. This is possible because of availability of improved tool materials (polycrystalline cubic boron nitride. PCBN), ad more rigid machine tools. According to many previous work of hard turning mechanism, the maximum temperature of cutting can be raised up to 100$0^{\circ}C$. As the heat generation rate is very high, the thermal displacement of tool holder cannot be negligible. Therefore, the aim of this paper is to analyze effects of high heat generation at CBN tool tip to the thermal displacement of a tool holder in hard turning and finally geometric accuracy. The thermal behavior of a CBN tool holder is investigated by numerical simulation and experiment, and the result shows thermal elongation of microns order is possible during hard turning process.

• Proceedings of the Korean Society of Propulsion Engineers Conference
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• 2011.11a
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• pp.565-569
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• 2011

A two-dimensional thermal response and ablation analysis code for predicting charring material ablation and shape change on solid rocket nozzle is presented. For closing the problem of thermo-structural analysis, Arrhenius' equation and Zvyagin's ablation model are used. The moving boundary problem are solved by remeshing-rezoning method. For simulation of complicated thermal protection systems, this method is integrated with a three-dimensional finite-element thermal and structure analysis code.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2001.09a
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• pp.121-145
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• 2001

Chip Size Packages (CSP) are now widely used in high speed DRAM. The major driving farce of CSP development is its superior electrical performance than that of conventional package. However, the power dissipation of high speed DRAM like DDR or RAMBUS DRAM chip reaches up to near 2W. This fact makes the thermal management methods in DRAM package be more carefully considered. In this study, the thermal performances of 3 type CSPs named $\mu-BGA$^{TM}$$ $UltraCSP^{TM}$ and OmegaCSP$^{TM}$ were measured under the JEDEC specifications and their thermal characteristics were of a simulation model utilizing CFD and FEM code. The results show that there is a good agreement between the simulation and measurement within Max. 10% of $\circledM_{ja}$. And they show the wafer level CSPs have a superior thermal performance than that of $\mu-BGA.$ Especially the analysis results show that the thermal performance of wafer level CSPs are excellent fur modulo level in real operational mode without any heat sink.