• Journal of the military operations research society of Korea
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• v.17 no.2
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• pp.100-112
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• 1991

Software system is a hierarchical structure with collection of program units. Software system can import external packages globally or locally depending on the usage within a system. If the imported package is used globally, the soft-ware system can be influenced globally by any change of package and programmer's debugging time for the program maintenance will be greater. To solve these problems, it is desirable to use the imported package locally right on the usage point within the system. The model presented in this paper analyzed entity usage of package in structure of program, identified the usage level to obtain localization and provided information for restructure of the program to localize package usage. To obtain localization, it identified declared entities inside the imported package and analyzed the specification and body part of program unit to identify entities referenced from the imported package. The proposed model can be used to improve the maintainability of software system and contributed to reduction of programmer's debugging time in program maintenance.

• Journal of the Microelectronics and Packaging Society
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• v.29 no.1
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• pp.1-6
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• 2022

The mobile device industry demands much higher levels of integration and lower costs coupled with a growing awareness of the complete system's configuration. A subsystem module package is similar to a board-level circuit that integrates a system function in a package beyond a System-in-Package (SiP) design. It is an advanced IC packaging solution to enhance the PDN and achieve a smaller form factor. Unlike a system-level design with a decoupling capacitor, a subsystem module package system needs to redefine the role of the capacitor and its configuration for PDN performance. Specifically, the design of package's form factor should include careful consideration of optimal PDN performance and the number of components, which need to define the decoupling capacitor's value and the placement strategy for a low impedance profile with associated cost benefits. This paper will focus on both the static case that addresses the voltage (IR) drop and AC analysis in the frequency domain with three specific topics. First, it will highlight the role of simulation in the subsystem module design for the PDN. Second, it will compare the performance of double-sided component placement (DSCP) motherboards with the subsystem module package and then prove the advantage of the subsystem module package. Finally, it will introduce three-terminal decoupling capacitor (decap) configurations of capacitor size, count and value for the subsystem module package to determine the optimum performance and package density based on the cost-effective model.

• Journal of Korea Technology Innovation Society
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• v.3 no.3
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• pp.1-17
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• 2000

This paper shows the institutional limits of technological innovation at the railway package service, that is the limits of introducing the package express system. The railway package service, owned by government and operated by D company, has been suffered severe operating loss since early 1990's. The package express system supported by information network and co-working with inner city quick service might be an solution for the railway package service. But there are several obstacles such as labor union and the rigidities of the Korean National Railroad of government agency.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2000.04a
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• pp.3-7
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• 2000

In summary, a fundamentally new paradigm called System-on-Package could potentially become a complementary alternative to System-on-Chip, thus providing a balanced set of system-level functions between the semiconductor IC and single component package beyond the year 2007. The concurrent engineering and optimization of IC and package could overcome the fundamental IC issues presented above.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.58 no.1
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• pp.107-112
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• 2009

This paper describes design and fabrication issues of the SiP(System in Package) one-chip for a portable digital broadcasting receiver. It includes RF tuner chip, demodulator chip and passive components for the receiver system. When we apply the SiP one-chip technology to the broadcasting receiver, the system board size can be reduced from $776mm^2$ to $144mm^2$. SiP one-chip has an advantage that the area reduces more 81% than separated chips. Also the sensitivity performance advances -1dBm about 36 channels in the RF weak electric field, the power consumption reduces about 2mW and the C/N keeps on the same level.

• International Journal of Advanced Culture Technology
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• v.9 no.4
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• pp.409-416
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• 2021

We are invented the movement composition technique that is to check the food adjacent-package status of the wireless-management movement monitoring level (WMMML) on the movement monitoring communication system. The movement monitoring level condition by the movement monitoring communication system is formatted with the adjacent-package system. As to inspection a wireless RFID of the wireless RFID, we are found of the movement value with wireless RFID by the adjacent upper take form. The concept of movement monitoring level is formatted the reference of wireless-management level for composition signal by the movement package communication system. Further symbolizing a food composition of the WMMML of the medium-minimum in terms of the adjacent-package communication system, and the movement wireless RFID package that was the movement value of the far composition of the Mo-MMCS-FA-_φMED-MIN with 5.80±1.20 units, that was the movement value of the convenient composition of the Mo-MMCS-CO-_φMED-MIN with 4.06±(-0.04) units, that was the movement value of the flank composition of the Mo-MMCS-MO-_φMED-MIN with 0.91±0.07 units, that was the movement value of the vicinage composition of the Mo-MMCS-VI-_φMED-MIN with 0.18±(-0.03) units. The adjacent package will be to look into at the food ability of the adjacent-package communication system with wireless RFID by the movement monitoring level on the WMMML that is supply the wireless communication by the movement monitoring level system. We will be possible to make effort of a communication system by the management signal and to put to use of the delivery data of RFID level by the delivery system.

• International conference on construction engineering and project management
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• 2009.05a
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• pp.635-641
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• 2009

In the building construction, the specialist contractors play the important roles in the point of the quality securing. Therefore, it is very important for the construction industry to study the sub-package problem. The sub-package problem includes two problems which should be solved. One is to decide the scope of works of each specialist contractor, and another one is to decide the particular specialist contractor which carries out the work. However, the sub-package problem in Korea is not clarified yet, although the circumstance around it has changed rapidly. Many factors influence to the sub-package problem regardless of internal factors or external factors of the project. The general contractor usually decides the sub-package under considering the project conditions. In case of the internal factors, each general contractor manages the organization and materials. But the external factors are relatively more difficult to control and predict than internal ones. But out of the external factors, the legal system has very close relationship with a sub-package problem especially in Korean construction system. So, this paper clarifies relationship between the legal system relating subcontracting and the state of sub-package.

• 제어로봇시스템학회:학술대회논문집
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• 1996.10b
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• pp.441-444
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• 1996

Object-oriented programming goes on increasing in many areas, as its advantages of flexibility and ease of maintenance have been recognized. As in usual programmings, the productivity and flexibility of CACSD package can be improved by adopting object-oriented programmin. This paper describes our efforts to implement an OO-CACSD(Object Oriented CACSD) package for control system design and simulation. Since the proposed OO-CACSD is based on the modularity, portability, reuseability, and matrix-oriented data structure, a control system can be not only modeled and simulated but also maintained easily.

• Journal of the Korean Society for Precision Engineering
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• v.30 no.3
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• pp.349-355
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• 2013

Recent high oil price results in the development of energy saving technology such as LED lighting system. Street-lighting system using COH LED package can save energy because the heat dissipation through cupper base is better than conventional technology. Studies on manufacturing processes of lighting system are insufficient even though LED package design and its heat analysis have been studied. This study focuses on the problem and solution of manufacturing processes such as LED packaging process, optimized emission angle, and LED bar dimension for mechanical assembly. As a result, we established better manufacturing alternatives of LED packaging and street-lighting system with higher lighting efficiency of 84 lm/W, as well as good illumination intensity of 39.7 lux at 6 m from lighting source.

• Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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• v.12 no.2
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• pp.45-53
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• 1998

This paper describes the development of educational and training package with Integrated graphic environment for power system analysis '||'&'||' operation. This package runs on a personal computer with interactive scheme and includes a graphic editor for modeling of power system, a database system, the various graphic illustration '||'&'||' animation modules to represent the simulation results, and the application module of the power system analysis '||'&'||' operation. The proposed package is tested on a sample system, the package will be useful for the education and training of power system analysis and operation.