Proceedings of the International Microelectronics And Packaging Society Conference (한국마이크로전자및패키징학회:학술대회논문집)
- 2000.04a
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- Pages.3-7
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- 2000
System-on-Package (SOP) Vision, Status and Challenges
- Tummala, Rao R. (NSF Packaging Research Center, Georgia Institute of Technology)
- Published : 2000.04.01
Abstract
In summary, a fundamentally new paradigm called System-on-Package could potentially become a complementary alternative to System-on-Chip, thus providing a balanced set of system-level functions between the semiconductor IC and single component package beyond the year 2007. The concurrent engineering and optimization of IC and package could overcome the fundamental IC issues presented above.
Keywords