• Journal of Welding and Joining
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• v.16 no.5
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• pp.100-107
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• 1998

This paper describes fluxless soldering of reflow soldering process using solder foil instead of solder pastes. There is an increasing demand for the reliable solder connection in the recent high density microelectronic components technologies. And also, it is problem fracture of an Ozone layer due to freon as which is used to removal of remained flux on the substrate. This paper discussed joining phenomena, boudability and joining processes of microelectronics devices, such as between outer lead of VLSI package and copper pad on a substrate without flux. The shear strength of joints is 8 to 13 N using Sn/Pb (63/37 wt.%) solder foil with optimum joining conditions, meanwhile, in case of using Sn/In (52/48 wt.%) solder foil, it is possible to bond with low heating temperature of 550 K, and accomplish to high bonding strength of 25N in condition heating temperature of 650K. Finally, this paper experimentally shows fluxless soldering using solder foil, and accomplishes key technology of microsoldering processes.

• Journal of the Korean Institute of Telematics and Electronics
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• v.26 no.11
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• pp.1652-1657
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• 1989

In this research, the PN junction type Si photodiodes have been fabricated on the low doped P type(Na=7x10**14 cm**-3) and N type (Nd=4x10**14cm**-3) (100) silicon substrates. We could find out that the dark current was lower in the N type substrate than in the P type substrate. Some well designed photodiodes showed relatively good optical and electronic characteristics that the dark current is lower than 5 nA at 10V of reverse bias condition, that the breakdown voltage is higher than 250V, and that the quantum efficiency is larger than 86% at the wavelength of $6328{\AA}$

• Journal of the Korean Institute of Telematics and Electronics A
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• v.31A no.1
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• pp.93-102
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• 1994

This paper, presents SECRET(SEC REliability Tool), which predicts reliability problems related to the hot-carrier and electromigration effects on the submicron MOSFETs and interconnections. To simulate DC and AC lifetime for hot-carrier damaged devices, we have developed an accurate substrate current model with the geometric sensitivity, which has been verified over the wide ranges of transistor geometries. A guideline can be provided to design hot-carrier resistant circuits by the analysis of HOREL(HOT-carrier RFsistant Logic) effect, and circuit degradation with respect to physical parameter degradation such as the threshold voltage and the mobility can also be expected. In SECRET, DC and AC MTTF values of metal lines are calculated based on lossy transmission line analysis, and parasitic resistances, inductances and capacitances of metal lines are accurately considered when they operate in the condition of high speed. Also, circuit-level reliability simulation can be applied to the determination of metal line width and-that of optimal capacitor size in substrate bias generation circuit. Experimental results obtained from the several real circuits show that SECERT is very useful to estimate and analyze reliability problems.

• Transactions of Materials Processing
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• v.23 no.8
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• pp.507-512
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• 2014

The objective of the current investigation is to establish techniques in micro pattern forming operations of polymeric circular tubes by using hydrostatic pressing. This method was developed and successfully applied to the micro pattern forming on polymeric plates. The key idea of the new technique is to pressurize multiple vacuum-packed substrate-mold stacks above the glass transition temperature of the polymeric substrates. The new process is thought to be a promising micro-pattern fabrication technique for two reasons; first, (hydro-) isostatic pressing ensures a uniform micro-pattern replicating condition regardless of the substrate area and thickness. Second, multiple curved substrates can be patterned at the same time. With the prototype forming machine for the new process, micro prismatic array patterns, 25um in height and 90 degrees in apex angle, were successfully made on the PMMA circular tubes with diameters of 5~40mm. These results show that this process can be also used in the micro pattern forming process on curved plates such as circular tube.

• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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• 2008.04a
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• pp.127-131
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• 2008

This paper deals with the performance evaluation of piezoelectric unimorph actuator. In the unimorph design, the thickness ratio of substrate to piezoelectric material and the elastic modulus ratio of substrate to piezoelectric material are important parameters. There exists only one structural configuration that satisfies the optimal condition among them, and actuators using that configuration exhibit better actuating displacements. Another design parameter is the piezoelectric coefficient which can be improved due to the induced tensile stress and voltages. The application of the tensile stress to the piezoelectric material makes it get higher piezoelectric coefficient and the total displacement performance of the unimorph actuator is improved. Finally, the piezoelectric actuator system with spring elements is fabricated and it shows higher actuating displacement capability.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.58 no.8
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• pp.1566-1571
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• 2009

The discharge electrodes in ac PDP are coated with dielectric layer, and transparent MgO thin films are deposited on the dielectric layer. The main role of the MgO thin films in ac PDP is to protect the dielectric layer from sputtering by ion bombardment in the glow-discharge plasma. An additional important role of the MgO thin film is the high secondary electron emission coefficient which leads the low firing voltage and low cost of the PDP. In this paper, we investigated the relations of the crystal orientation about deposition thickness, deposition rate, temperature of substrate, and distance between the MgO tablet and the substrate. Additionally, we investigated the discharge characteristics of the AC PDP using nano-powder MgO tablet

• Journal of the Korean Institute of Telematics and Electronics A
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• v.29A no.8
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• pp.49-55
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• 1992

We Have investigated the properties of the titanium nitrite films widely used in VLSI devices as diffusion barrier in Al-based metallization. TiN films were formed by reactive sputtering from Ti target in Ar-N$_2$ mixtures, varying deposition parameters such as N$_2$ partial pressure, substrate temperature, power, and total pressure. All the samples received the heat treatment at 45$0^{\circ}C$ for 30 min. The resulting films are characterized by mechanical stylus($\alpha$-step), x-ray diffraction(XRD), scanning electron microscopy(SEM), and four point probe method. The Tin film properties strongly depend on the deposition condition. The stoichiometry and Ti deposition rate are critically affected by nitrogen partial pressure, and the resistivity, in particular, is dependent on both the substrate temperature and sputtering power.

• 한국전산유체공학회:학술대회논문집
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• 2010.05a
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• pp.548-550
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• 2010

The droplet motion on a flat substrate with contact angle hysteresis is studied by solving the equations governing the conservation of mass and momentum. The liquid- gas interface is determined by an level-set method which is based on a sharp-interface representation for accurately imposing the matching or coupling conditions at the interface. The method is modified to treat the dynamic contact angle at the liquid-gas-solid interface. The computations are performed to investigate a droplet impact and merging pattern on a flat substrate to find a optimal condition in a micro-line patterning process. The effects of dynamic contact angles on droplet motion are quantified.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.06a
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• pp.280-283
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• 2003

In this paper, there was finding laser beam focal length using the camera at the work with laser preprocess. A process have some similarity that the laser direct writing was condition of unused other light source in order to a partical object of working substrate, so we worked finding focal length using yellow light. As we found focal lengths from three points of substrate edges, The focal length of all substrates was able to be computed by calculating a plane equation using these three point. Also we make a device and software that can automatically perform all of the processes.

• Journal of the Korean Society of Industry Convergence
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• v.6 no.4
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• pp.347-353
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• 2003

Fe(II)하에서 분자산소에 의한 기질의 산화는 헴에 의해 나타난 가역산화반응에 의해서 대단한 생물학적 흥미가 있다. 적당한 조건하에서 산화되어진 리간드로서 염인 피리딘이나 아마이드, 그리고 두 가지 종류의 Fe(II)-acac나 Fe(II)-sal의 complex와 산화되는 기질의 성질이 비라디칼 조건하에서 안정하다는 것을 알았다.