• Transactions of the Korean Society of Mechanical Engineers A
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• v.38 no.10
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• pp.1117-1123
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• 2014

This study sintered $Si_3N_4$ with different amounts of $SiO_2$ nano-colloid. The surface of a mirror-polished specimen was coated with $SiO_2$ nano-colloid, and cracks were healed when the specimen was treated at a temperature of 1273 K for 1 h in air. Wear specimen experiments were conducted after heat treatments for 10 min at 1073, 1273, and 1573 K. The heat-treated surface that was coated with the $SiO_2$ nano-colloid was slightly rougher than the noncoated surface. The oxidation state of the surface according to the heat treatment temperature showed no correlation with the surface roughness. Moreover, the friction coefficient, wear loss, and bending strength were not related to the surface roughness. $Si_3N_4$ exhibited an abrasive wear behavior when SKD11 was used as an opponent material. The friction coefficient was proportional to the wear loss, and the bending strength was inversely proportional to the friction coefficient and wear loss. The friction coefficient and wear loss increased with increasing amounts of the $SiO_2$ nanocolloid. In addition, the friction coefficient was slightly increased by increasing the heat treatment temperature.

• Journal of Surface Science and Engineering
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• v.46 no.1
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• pp.22-28
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• 2013

$WS_2$ particles were added to micro-diamond blades with Cu/Sn binding metal as lubricants to improve cutting efficiency. It was found in previous works that the added $WS_2$ lubricant could reduce remarkably the momentary energy consumption during dicing tests but increased wear rate slightly owing to weak bonding between lubricant particles and bond metals. In the present work, the surface of $WS_2$ lubricant particles were etched for activating the surface of $WS_2$ particles that provide even distribution of particles during powder mixing process and improvement of wetting at the interfaces between $WS_2$ particles and molten Cu/Sn bond metals during pressurized sintering so that could provide the improved strength of micro-blades and result in extended life. Chipping behavior of workpiece with the types of micro-blades including $WS_2$ were compared because it is important in semiconductor and micro-packaging industries to control average roughness and straightness of sliced surface which is closely related with quality.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.05b
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• pp.11-14
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• 2004

In this paper, the effect of adhesion properties of semiconductive-insulating interface layer of silicone rubber on electrical properties was investigated. The modifications produced on the silicone surface by oxygen plasma were accessed using ATR-FTIR, contact angle and AFM. Adhesion was obtained from T-peel tests of semiconductive layer having different treatment durations. In addition, ac breakdown test was carried out for elucidating the change of electrical property with duration of plasma treatment. From the results, the treatment in the oxygen plasma produced a noticeable increase in surface energy, which can be mainly ascribed to the the creation of O-H and C=O. It is observed that adhesion performance was determined by not surface energy but roughness level of silicone surface. It is found that ac dielectric strength was increased with improving the adhesion between the semiconductive and insulating interface.

• Korean Journal of Materials Research
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• v.27 no.6
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• pp.318-324
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• 2017

In this study, two Fe-30Mn-0.2C-(1.5Al) high-manganese steels with different surface conditions were hydrogen-charged under high temperature and pressure; then, tensile testing was performed at room temperature in air. The yield strength of the 30Mn-0.2C specimen increased with decreasing surface roughness(achieved via polishing), but that of the 30Mn-0.2C-1.5Al specimen was hardly affected by the surface conditions. On the other hand, the tendency of hydrogen embrittlement of the two high-manganese steels was not sensitive to hydrogen charging or surface conditions from the standpoints of elongation and fracture behavior. Based on the EBSD analysis results, the small decrease in elongation of the charged specimens for the Fe-30Mn-0.2C-(1.5Al) high-manganese steels was attributed to the enhanced dislocation pile-up around grain boundaries, caused by hydrogen.

• Geomechanics and Engineering
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• v.24 no.4
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• pp.307-321
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• 2021

In an earlier publication (Serrano et al. 2014), the theoretical basis for evaluating the shear strength in rock joints was presented and used to derive an equation that governs the relationship between tangential and normal stresses on the joint during slippage between the joint faces. In this paper, the theoretical equation is applied to two non-linear failure criteria by using non-associated flow laws, including the modified Hoek and Brown and modified Mohr-Coulomb equations. The theoretical model considers the geometric dilatancy, the instantaneous friction angle, and a parameter that considers joint surface roughness as dependent variables. This model uses a similar equation structure to the empirical law that was proposed by Barton in 1973. However, a good correlation with the empirical values and, therefore, Barton's equation is necessary to incorporate a non-associated flow law that governs breakage processes in rock masses and becomes more significant in highly fractured media, which can be induced in a rock joint. A linear law of dilatancy is used to assess the importance of the non-associated flow to obtain very close values for different roughness states, so the best results are obtained for null material dilatancy, which considers significant changes that correspond to soft rock masses or altered zones of weakness.

• Proceedings of the KIEE Conference
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• 1999.07d
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• pp.1645-1647
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• 1999

Epoxy compound has been used as insulation material in electrical equipment because of its properties 1) Nowadays, becoming higher voltage system, the properties of interface between epoxy and its metal insert become more important. In this paper, we suggest two types semiconducting paste. One is epoxy type and the other is olephine type. After sprayed the semiconducting paste on metal insert sanded, we procedure the test one is the adhesion strength test, the other is electrical breakdown strength test. So we knew that the epoxy type paste became more higher adhesion strength than olephine type paste because of its homogeneity at the interfaces. And at the breakdown strength test, olephine type paste became less higher than epoxy type paste because of its volatility. So in this study, we suggest the optimum interface condition by adjusting the semiconducting paste and surface roughness.

• Geomechanics and Engineering
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• v.11 no.3
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• pp.361-372
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• 2016

The soil-concrete interface shear strength, although has been extensively studied, is still difficult to predict as a result of the dependence on many factors such as normal stresses, surface roughness, particle sizes, moisture contents, dilation angles of soils, etc. In this study, a well-known rigorous statistical learning approach, namely the least squares support vector machine (LS-SVM) realized in a ubiquitous spreadsheet platform is firstly used in estimating the soil-structure interface shear strength. Instead of studying the complicated mechanism, LS-SVM enables to explore the possible link between the fundamental factors and the interface shear strengths, via a sophisticated statistic approach. As a preliminary investigation, the authors study the expansive soils that are found extensively in most countries. To reduce the complexity, three major influential factors, e.g., initial moisture contents, initial dry densities and normal stresses of soils are taken into account in developing the LS-SVM models for the soil-concrete interface shear strengths. The predicted results by LS-SVM show reasonably good agreement with experimental data from direct shear tests.

• Korean Journal of Materials Research
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• v.17 no.2
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• pp.61-67
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• 2007

The magnetron reactive sputtering was adopted to deposit CuO buffer layers on the polyimide surfaces for increasing the adhesion strength between Cu thin films and polyimide, varying $O_2$ gas flow rate from 1 to 5 sccm. The CuO oxide was formed through all the $O_2$ gas flow rates of 1 to 5 sccm, showing the highest value at the 3 sccm $O_2$ gas flow rate. The XPS analysis revealed that the $Cu_2O$ oxide was also formed with a significant ratio during the reactive sputtering. The adhesion strength is mainly dependent on the amount of CuO in the buffer layers, which can react with C-O-C or C-N bonds on the polyimide surfaces. The adhesion strength of the multi-layered Cu/buffer layer/polyimide specimen decreased linearly as the heating temperature increased to $300^{\circ}C$, even though there showd no significant change in the chemical state at the polyimide interface. This result is attributed to the decrease in surface roughness of deposited copper oxide on the polyimide, when it is heated.

• Korean Journal of Materials Research
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• v.31 no.3
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• pp.122-131
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• 2021

In the fabrication of joined materials between anodized aluminum alloy and polymer, the performance of the metal-polymer joining is greatly influenced by the chemical properties of the oxide film. In a previous study, the dependence of physical joining strength on the thickness, structure, pore formation, and surface roughness of films formed on aluminum alloys is investigated. In this study, we investigated the effect of silane coupling treatment on the joining strength and sealing performance between aluminum alloy and polymer. After a two-step anodization process with additional treatment by silane, the oxide film with chemically modified nanostructure is strongly bonded to the polymer through physical and chemical reactions. More specifically, after the two-step anodization with silane treatment, the oxide film has a three-dimensional (3D) nanostructure and the silane components are present in combination with hydroxyl groups up to a depth of 150 nm. Accordingly, the joining strength between the polymer and aluminum alloy increases from 29 to 35 MPa, and the helium leak performance increases from 10-2-10-4 to 10-8-10-9 Pa ㎥ s-1.

• Journal of the Microelectronics and Packaging Society
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• v.26 no.4
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• pp.133-140
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• 2019

The effects of thermal cycle conditions on the bonding strength and crack propagation behaviors in electroplated Cr/electroplated Ni-P coatings were systematically evaluated. 1^st heat treatment was performed at 500℃ for 3 hours after electroplating Ni-P, and then, 2^nd heat treatment was performed at 750℃ for 6 hours after electroplating Cr. The measured bonding strength by ASTM C633 were around 25.6 MPa before thermal cycling, while it increased to 47.6 MPa, after 1,000 cycles. Increasing thermal cycles led to dominant fail mode with cohesive failure inside adhesive, which seemed to be closely related to the increasing bonding strength possibly not only due to higher Cr surface roughness, but also to penetrated channeling crack density. Also, increasing density of penetrated channeling cracks in electroplating Cr layer led to slightly stronger bonding strength due to mechanical interlocking effects of adhesive inside channeling cracks.